Bonding method and bonding device for metal member

Patent metadata

Field	Value
Publication number	US-10722979-B2
Application number	US-201715481050-A
Country	US
Kind code	B2
Filing date	Apr 6, 2017
Priority date	Apr 12, 2016
Publication date	Jul 28, 2020
Grant date	Jul 28, 2020

Abstract

A bonding method includes: an oxide-film forming step, on an irradiated surface, an oxide film having a film thickness corresponding to a first output and an irradiation time of an oxide-film-forming laser beam; a first reflected-laser-beam detection step of detecting a second output; a first absorptance computing step of computing a first absorptance for the oxide-film-forming laser beam; laser-beam switching step of switching the oxide-film-forming laser beam radiated onto the irradiated surface to a heat-bonding laser beam; and a heat bonding step of heating a first bonding surface until the temperature thereof reaches a predetermined bonding temperature, and bonding the first bonding surface to a second bonding surface.

First claim

What is claimed is:

1. A bonding method for bonding a first bonding surface of a first metal member to a second bonding surface of a second metal member that is in contact with the first bonding surface by radiating a heat-bonding laser beam onto an irradiated surface of the first metal member to heat the first bonding surface, the bonding method comprising:
radiating an oxide-film-forming laser beam at a first output onto the irradiated surface of the first metal member, and forming by virtue of the radiating the oxide-film-forming, laser beam, on the irradiated surface, an oxide film having a film thickness that corresponds to the first output and an irradiation time of the oxide-film-forming laser beam;
detecting a second output that is an output of a first reflected laser beam generated from the oxide-film-forming laser beam upon being reflected by the irradiated surface;
computing a first absorptance of the irradiated surface of the first metal member for the oxide-film-forming laser beam based on the first output of the oxide-film-forming laser beam and the second output of the first reflected laser beam;
determining that the first absorptance is equal to or higher than a predetermined absorptance;
switching the oxide-film-forming laser beam radiated onto the irradiated surface to the heat-bonding laser beam when the first absorptance is equal to or higher than the predetermined absorptance; and
after the switching to the heat-bonding laser beam, radiating the heat-bonding laser beam at a third output onto the irradiated surface to heat the first bonding surface until a temperature of the first bonding surface reaches a predetermined bonding temperature, and bonding the first bonding surface to the second bonding surface.

2. The bonding method according to claim 1 , wherein
the predetermined bonding temperature is a temperature at which the first bonding surface and the second bonding surface are put in a solid-phase state that occurs at a temperature lower than a temperature of a liquid-phase state and enables bonding therebetween in a solid state, and
the method further comprising pressing the first bonding surface and the second bonding surface in the solid-phase state against each other in a pressure-bonding direction to be bonded together.

3. The bonding method according to claim 1 , wherein the third output of the heat-bonding laser beam is lower than the first output of the oxide-film-forming laser beam.

4. The bonding method according to claim 1 , wherein
in a relation with the film thickness of the oxide film, the first absorptance has a periodicity in which a local-maximum value and a local-minimum value alternate with a change of the film thickness in an increasing direction, and the first absorptance is minimum when the film thickness of the oxide film is zero,
the predetermined absorptance having periodicity in relation with the film thickness, is set within a range of the first absorptance corresponding to a film-thickness range that is a combination of a first film-thickness range and a second film-thickness range,
the first film-thickness range is a film-thickness range in which the film thickness of the oxide film exceeds zero and is smaller than a first local-minimum film thickness corresponding to a. first local-minimum value of the first absorptance between a first local-maximum film thickness corresponding to a first local-maximum value of the first absorptance at a first time and a second local-maximum film thickness corresponding to a second local-maximum value of the first absorptance at a time subsequent to the first local-maximum value, and
the second film-thickness range is a film-thickness range in which the film thickness is equal to or larger than the first local-minimum film thickness, the second local-maximum film thickness is contained, and the film thickness is smaller than a second local-minimum film thickness corresponding to a second local-minimum value of the first absorptance between the second local-maximum film thickness and a third local-maximum film thickness corresponding to a third local-maximum value of the first absorptance at a time subsequent to the second local-maximum value.

5. The bonding method according to claim 4 , wherein the range of the first absorptance is from 20% to 60%.

6. The bonding method according to claim 4 , wherein the predetermined absorptance is set within the range of the first absorptance corresponding to the first film-thickness range.

7. The bonding method according to claim 4 , wherein the predetermined absorptance is set to the first local-maximum value.

8. The bonding method according to claim 4 , wherein the predetermined absorptance is set to 40%.

9. The bonding method according to claim 1 , wherein the radiating the oxide-film-forming laser beam at the first output includes radiating the oxide-film-forming laser beam is-incident on the irradiated surface orthogonally thereto.

10. The bonding method according to claim 1 , further comprising:
detecting a fourth output that is an output of a second reflected laser beam generated from the heat-bonding laser beam radiated at the third output onto the irradiated surface upon being reflected by the irradiated surface;
computing a second absorptance of the irradiated surface of the first metal member for the heat-bonding laser beam based on the third output and the fourth output; and
adjusting the third output based on the second absorptance that changes with increase in an irradiation time of the heat-bonding laser beam.

11. The bonding method according to claim 1 , wherein, in a relation with the film thickness of the oxide film, the first absorptance has a periodicity in which a local-maximum value and a local-minimum value alternate with a change of the film thickness in an increasing direction, and the first absorptance is minimum when the film thickness of the oxide film is zero.

12. The bonding method according to claim 11 , wherein the predetermined absorptance, having periodicity in relation with the film thickness, is set within a range of the first absorptance corresponding to a film-thickness range that is a combination of a first film-thickness range and a second film-thickness range.

13. The bonding method according to claim 12 , wherein the first film-thickness range is a film-thickness range in which the film thickness of the oxide film exceeds zero and is smaller than a first local-minimum film thickness corresponding to a first local-minimum value of the first absorptance.

14. The bonding method according to claim 13 , wherein the first local-minimum value of the first absorptance is between a first local-maximum film thickness corresponding to a first local-maximum value of the first absorptance at a first time and a second local-maximum film thickness corresponding to a second local-maximum value of the first absorptance at a time subsequent to the first local-maximum value.

15. The bonding method according to claim 14 , wherein the second film-thickness range is a film-thickness range in which the film thickness is equal to or larger than the first local-minimum film thickness.

16. The bonding method according to claim 15 , wherein the second local-maximum film thickness is contained.

17. The bonding method according to claim 16 , wherein the film thickness is smaller than a second local-minimum film thickness corresponding to a second local-minimum value of the first absorptance.

Assignees

• Jtekt Corp

Inventors

• Imoto Yoshinori
• Nagahama Takaya
• Shiiba Koichi

Classifications

• H10W70/041

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