Method of making patterned conductive microstructures within a heat shrinkable substrate

Patent metadata

Field	Value
Publication number	US-10721815-B2
Application number	US-201816029507-A
Country	US
Kind code	B2
Filing date	Jul 6, 2018
Priority date	Jul 6, 2018
Publication date	Jul 21, 2020
Grant date	Jul 21, 2020

Abstract

A conductive interconnect structure comprises a polymeric substrate (e.g., a thermoplastic) and a plurality of compliant conductive microstructures (e.g., conductive carbon nanofibers) embedded in the polymeric substrate. The microstructures can be arranged linearly or in a grid pattern. In response to heating, the polymeric substrate transitions from an unshrunk state to a shrunken state to move the microstructures closer together, thereby increasing an interconnect density of the compliant conductive microstructures. Thus, the gap or pitch between adjacent microstructures is reduced in response to heat-induced shrinkage of the polymeric substrate to generate finely-pitched microstructures that are densely pitched, thereby increasing the current-carrying capacity of the microstructures. The polymeric material can be heated to conform or form-fit to planar and non-planar surfaces/geometries, and can be selectively heated at various portions to tailor or customize the interconnect density of the microstructures at selected portions. Associated electrical conducting assemblies and methods are provided.

First claim

What is claimed is:

1. A method of locally patterning conductive microstructures embedded in a heat-induced shrinkable polymeric substrate, comprising:
providing a conductive interconnect structure comprising a heat-induced shrinkable polymeric substrate and a plurality of compliant conductive microstructures embedded in the polymeric substrate and separated one from another by a pitch distance wherein the pitch distance is sufficient to prevent conduction between adjacent compliant conductive microstructures, each conductive microstructure comprising a plurality of conductive fibers; and
applying heat to the polymeric substrate to shrink at least a portion of the polymeric substrate to transition the portion from an unshrunk state to a shrunken state, thereby decreasing the pitch distance of the plurality of compliant conductive microstructures associated with the shrunken portion of the polymeric substrate.

2. The method of claim 1 , wherein applying heat to the polymeric substrate comprises applying heat to shrink a selected portion of the polymeric substrate to decrease the pitch distance of the plurality of compliant conductive microstructures associated with the selected portion.

3. The method of claim 1 , wherein providing the conductive interconnect structure comprises forming the conductive interconnect structure by embedding the compliant conductive microstructures in the polymeric substrate.

4. The method of claim 1 , further comprising overlaying the conductive interconnect structure to a support body when in the unshrunk state, and applying heat to shrink at least a portion of the polymeric substrate to conform the conductive interconnect structure to the support body to decrease the pitch distance of the compliant conductive microstructures.

5. The method of claim 4 , wherein the support body comprises a curved surface, such that the conductive interconnect structure is conformed to the curved surface after heating the polymeric substrate.

6. The method of claim 4 , wherein the support body further comprises a second curved surface, and wherein the method further comprises applying heat to shrink a second portion of the polymeric substrate to conform the second portion to the second curved surface.

7. The method of claim 1 , wherein applying heat to the polymeric substrate comprises applying heat to shrink a first end portion and a second end portion of the polymeric substrate to decrease the pitch distance of the compliant conductive microstructures associated with first and second end portions.

8. The method of claim 7 , wherein the polymeric substrate comprises a thermoplastic material, and wherein the conductive interconnect structure is formed as an electrical cable line coupleable to an electronics assembly.

9. The method of claim 1 , wherein applying heat to the polymeric substrate comprises applying heat to shrink a middle portion of the polymeric substrate to decrease the pitch distance of the plurality of compliant conductive microstructures associated with the middle portion, wherein a first end portion and a second end portion of the polymeric substrate remain in the unshrunk state, such that the compliant conductive microstructures associated with at least one of the first and second end have an original pitch distance that is greater than the decreased pitch distance of the plurality of compliant conductive microstructures associated with the middle portion.

10. The method of claim 1 , wherein the compliant conductive microstructures are arranged in a grid pattern or a linear pattern.

11. A method of making a conductive interconnect structure, comprising:
associating a plurality of compliant conductive microstructures with a heat-induced shrinkable polymeric substrate such that the compliant conductive microstructures are separated one from another by a pitch distance of 50 microns or greater, each conductive microstructure comprising a plurality of conductive fibers; and
applying heat to the polymeric substrate to shrink at least a portion of the polymeric substrate to transition the portion from an unshrunk state to a shrunken state, thereby decreasing the pitch distance of the plurality of compliant conductive microstructures associated with the portion of the polymeric substrate.

12. The method of claim 11 , wherein applying heat to the polymeric substrate comprises applying heat to the entire polymeric substrate to uniformly shrink the polymeric substrate.

13. The method of claim 11 , wherein applying heat to the polymeric substrate comprises applying heat to shrink a selected portion of the polymeric substrate to decrease the pitch distance of the plurality of compliant conductive microstructures associated with the selected portion.

14. The method of claim 11 , wherein associating the plurality of compliant conductive microstructures with the polymeric substrate comprises embedding the compliant conductive microstructures in the polymeric substrate.

15. The method of claim 11 , wherein applying heat to the polymeric substrate comprises applying heat to shrink first and second end portions of the polymeric substrate to decrease the pitch distance of the compliant conductive microstructures associated with first and second end portions.

16. The method of claim 11 , wherein the polymeric substrate comprises a thermoplastic material, and wherein the conductive interconnect structure is formed as an electrical cable line coupleable to an electronics assembly.

17. The method of claim 11 , wherein applying heat to the polymeric substrate comprises applying heat to shrink a middle portion of the polymeric substrate to decrease the pitch distance of a middle section of the plurality of compliant conductive microstructures.

18. The method of claim 11 , wherein the compliant conductive microstructures are traces, wires, contacts, thermal conductors, or a combination thereof.

19. The method of claim 11 , wherein the conductive fibers comprise carbon fibers, polymer fibers, or metal wires.

20. The method of claim 19 , wherein the conductive fibers are doped with gold, silver, or acid.

21. The method of claim 11 , wherein the pitch distance is decreased to from 4 microns to 50 microns by applying the heat.

Assignees

• Raytheon Co

Inventors

• Grosse Kyle L
• Trent Catherine

Classifications

• H05K2201/09245

  Crossing layout · CPC title

• H05K2201/09009

  Substrate related · CPC title

• H05K1/0313 Primary

  Organic insulating material · CPC title

• H05K1/09

  Use of materials for the {conductive, e.g. } metallic pattern · CPC title

• H05K2203/1105

  Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating · CPC title