Forming of staged thermoset composite materials
US-9539767-B2 · Jan 10, 2017 · US
Preform member bonding method
US10717243B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10717243-B2 |
| Application number | US-201615138271-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 26, 2016 |
| Priority date | May 28, 2015 |
| Publication date | Jul 21, 2020 |
| Grant date | Jul 21, 2020 |
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Abstract
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Provided is a preform member bonding method of bonding a preform member and another member with an adhesive in an RTM process. The preform member bonding method includes increasing viscosity of the adhesive by heat-treating only the adhesive in advance before inserting the adhesive between bonding surfaces of the preform member and the other member.
First claim
Opening claim text (preview).
The invention claimed is: 1. A preform member bonding method of bonding a preform member and another member with an adhesive in resin transfer molding, comprising a staging step of beforehand heat-treating only the adhesive to reach a ST temperature so as to progress hardening of the adhesive before inserting the adhesive between bonding surfaces of the preform member and the other member, a temperature lowering step of lowering a temperature of the adhesive to a temperature lower than the ST temperature, and a pre-heating step of heat-treating the preform member together with the adhesive to reach and hold at a pre-heat temperature lower than the ST temperature after inserting the adhesive between bonding surfaces of the preform member and the other member, wherein the temperature of the adhesive lowered in the temperature lowering step is lower than the pre-heat temperature. 2. A preform member bonding method comprising: a staging step of beforehand heat-treating an adhesive, which is placed in a bond area of a hardened member, to reach a ST temperature so as to progress hardening of the adhesive; a temperature lowering step of lowering a temperature of the adhesive to a temperature lower than the ST temperature, and a pre-heating step of heat-treating the preform member together with the adhesive to reach and hold at a pre-heat temperature lower than the ST temperature after placing a preform member on the heat-treated adhesive, wherein the temperature of the adhesive lowered in the temperature lowering step is lower than the pre-heat temperature. 3. A composite material producing method comprising: a staging step of beforehand heat-treating an adhesive, which is placed in a bond area of a hardened member, to reach a ST temperature so as to progress hardening of the adhesive; a temperature lowering step of lowering a temperature of the adhesive to a temperature lower than the ST temperature, and a pre-heating step of heat-treating the preform member together with the adhesive to reach and hold at a pre-heat temperature lower than the ST temperature before or during resin impregnation after placing a preform member on the heat-treated adhesive, wherein the temperature of the adhesive lowered in the temperature lowering step is lower than the pre-heat temperature.
Assignees
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Classifications
- B29C70/48Primary
and impregnating the reinforcements in the closed mould, e.g. resin transfer moulding [RTM] {, e.g. by vacuum} · CPC title
Layered products · CPC title
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- What does patent US10717243B2 cover?
- Provided is a preform member bonding method of bonding a preform member and another member with an adhesive in an RTM process. The preform member bonding method includes increasing viscosity of the adhesive by heat-treating only the adhesive in advance before inserting the adhesive between bonding surfaces of the preform member and the other member.
- Who is the assignee on this patent?
- Mitsubishi Aircraft Corp
- What technology area does this patent fall under?
- Primary CPC classification B29C70/48. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Jul 21 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).