Direct connection of high speed signals on PCB chip

Patent metadata

Field	Value
Publication number	US-10716213-B2
Application number	US-201816048267-A
Country	US
Kind code	B2
Filing date	Jul 28, 2018
Priority date	Jul 28, 2018
Publication date	Jul 14, 2020
Grant date	Jul 14, 2020

Abstract

To eliminate signal loss and sources of signal attenuation, a connection methodology is utilized which enables high-speed signals to be directly communicated from particular integrated circuits housed on a printed circuit board, to other locations within a system. More specifically, a signal escape strategy directly connects a high-speed cable to a point on the circuit board which is very close to the integrated circuit itself. A back-side connection methodology is utilized so that electrical signals pass directly from the integrated circuit through a via, to a connection point on the backside of the circuit board. To accommodate this connection, a specially designed interposer and related paddle cards are utilized so the high-speed communication cable can be easily attached.

First claim

The invention claimed is:

1. A circuit board assembly capable of transferring a select grouping of high-speed signals from an electronic chip to a second system, the assembly comprising:
a circuit board configured the support an electronic chip on a first surface thereof and to provide a plurality of electrical communication paths capable of carrying the select grouping of high-speed signals to and from the chip, the communication paths comprising at least one via extending through the circuit board and positioned below the chip capable of carrying at least one signal to a second side of the circuit board;
a paddle card positioned adjacent the second side of the circuit board and opposite the electronic chip, the paddle card having electrical connections to receive the select grouping of signals so that the select grouping of signals can be transmitted through the paddle card; and
a high-speed cable electrically coupled to the paddle card configured to carry the select grouping of high-speed signals to the second system; and
an interposer attached to the circuit board on the second surface of the circuit board at a location opposite the chip, and between the board and the paddle card, the interposer capable of allowing the select grouping of signals to be received and be present to the electrical connections on the paddle card.

2. The assembly of claim 1 , wherein the electronic chip is contained within a package that is configured to present the predetermined signals to the via.

3. The assembly of claim 1 further comprising a communication cable connector which is attachable to at least one of the electrical connections.

4. The assembly of claim 1 wherein the predetermine signals are high frequency signals having an operating frequency of greater than 56 Gbps.

5. The assembly of claim 1 wherein the high-speed cable is a high-speed coaxial cable configured to carry the predetermined signals to the second system.

6. The assembly of claim 5 wherein the cable has a length within a range from 10 inches to 40 inches.

7. An electrical connection system for use in conjunction with high-speed electronic circuits, with the high-speed electronic circuits comprising at least one electronic chip supported by a printed circuit board, and the circuit board configured to pass a select grouping of signals from the electronic chip to at least one connection point directly below the electronic chip, the connection system comprising:
an interposer coupled to a surface of the circuit board at a position directly opposite the at least one electronic chip, the interposer having an electrical connection mechanism which is electrically coupled to said at least one connection point on the circuit board and is thus configured to receive the select grouping of signals;
a connector electrically coupled to the interposer, wherein the connector is configured to be attachable to a high-speed cable, wherein the cable is configured to carry the select grouping of high-speed signals from the electronic chip to a remote system; and
a backer positioned on a side of the interposer opposite the circuit board to provide physical support for the interposer;
wherein the high-speed signal is to be communicated to the high-speed cable without being routed within the circuit board.

8. The assembly of claim 7 , wherein the electronic chip is contained within a package that is configured to present the predetermined signals to a via directly below the chip.

9. The assembly of claim 7 wherein the predetermine signals are high frequency signals having an operating frequency of greater than 56 Gbps.

10. The assembly of claim 9 wherein the cable is a high-speed coaxial cable configured to carry the predetermined signals to a related electronic assembly.

11. The assembly of claim 10 wherein the cable is at least ten inches in length.

12. A circuit assembly to facilitate the communication of high-speed signals between an electronic chip and a cooperating electronic system, comprising:
a circuit board having a first surface configured to support the electronic chip, the circuit board having a plurality of vias configured to facility electrical connections between the first surface of the circuit board to a second surface of the circuit board;
a connection system providing electrical connections between the electronic chip and a connection portion of the vias at the first surface, thereby allowing communication of a select grouping of high-speed signals to be communication between the electronic chip and the vias;
a paddle card having a plurality of electrical connections in communication with a portion of the plurality of vias situated on the second surface, wherein the select grouping of high-speed signals are transmitted between the vias and the plurality of electrical connection on the paddle card;
a high-speed cable having a first end coupled to the paddle card and a second end coupled to the cooperating system so as to communicate the select grouping of high-speed signals between the paddle card and the cooperating system; and
a connector assembly having a first portion coupled to the paddle card and second portion coupled to the high-speed cable, thus allowing the high-speed cable to be removably coupled to the paddle card;
wherein the select grouping of high-speed signals are only transmitted between the first side of the circuit board and the second side of the circuit board using the plurality of vias and are not routed through the circuit board in any other way.

13. The circuit assembly of claim 12 wherein the connection system is a ball grid array.

14. The circuit assembly of claim 12 where in the paddle card is directly coupled to the second side of the circuit board by a second ball grid array.

15. The circuit assembly of claim 12 further comprising:
an interposer coupled to the second surface of the circuit board at a position directly opposite the at least one electronic chip, the interposer configured to interact with the paddle card and the vias to allow communication there between;
an electrical connection mechanism which provides an electrically coupling between the interposer and a connection portion of the vias at the second side of the circuit board; and
a retaining structure holding the paddle card in contact with the interposer, thus accommodating communication to the high-speed electrical cable.

Assignees

• Cray Inc
• Hewlett Packard Entpr Dev Lp

Inventors

• Kim Hyunjun
• Becker Andy
• Fitzke Jim
• Smith Brad
• Wildes Paul

Classifications

• Y02P70/50

  Manufacturing or production processes characterised by the final manufactured product · CPC title

• H05K1/113

  Via provided in pad; Pad over filled via · CPC title

• H01R12/716

  Coupling device provided on the PCB · CPC title

• H05K1/181 Primary

  associated with surface mounted components · CPC title

• H05K1/117

  Pads along the edge of rigid circuit boards, e.g. for pluggable connectors · CPC title