Apparatus and method for treating substrate

Patent metadata

Field	Value
Publication number	US-10714352-B2
Application number	US-201715681347-A
Country	US
Kind code	B2
Filing date	Aug 19, 2017
Priority date	Aug 31, 2016
Publication date	Jul 14, 2020
Grant date	Jul 14, 2020

Abstract

Disclosed are an apparatus and a method for treating a substrate. The method includes repeatedly rotating the substrate alternately at a first speed and at a second speed while the treatment liquid is supplied, and the second speed is higher than the first speed.

First claim

What is claimed is:

1. A method for treating a substrate by supplying a treatment liquid onto the substrate during an etching process, the method consists of:
repeatedly rotating the substrate alternately at a first speed and at a second speed while the treatment liquid is supplied,
wherein the second speed is higher than the first speed,
wherein the supply of the treatment liquid is initiated when the substrate rotates at the second speed,
wherein the treatment liquid is a chemical for etching a film coated on the substrate,
wherein a rotational acceleration of the substrate is changed while the rotational speed of the substrate is changed between the first speed and the second speed, and
wherein a foregoing portion of the rotational acceleration is larger than a subsequent portion of the rotational acceleration during the change of the rotational acceleration.

2. The method of claim 1 , wherein the rotational speed of the substrate is changed between the first speed and the second speed two times or more.

3. The method of claim 1 , wherein the first speed is 100 rpm or lower and the second speed is 1000 rpm or higher.

4. The method of claim 3 , wherein the second speed is higher than 1000 rpm.

5. The method of claim 1 , wherein the first speed is 0 rpm.

6. The method of claim 1 , wherein the treatment liquid includes thinner.

7. The method of claim 1 , wherein a time period for which the treatment liquid is supplied is 100 seconds or less.

8. A method for treating a substrate, the method comprising:
a first coating process of forming a first coating layer by supplying a first coating liquid onto the substrate having a pattern, in a first chamber;
an etching process of removing the first coating layer located on an upper surface of the pattern such that the upper surface of the pattern is exposed, by supplying a chemical onto the substrate; and
a second coating process of forming a second coating layer by supplying a second coating liquid onto the substrate having a pattern, in a second chamber,
wherein the first coating process, the etching process, and the second coating process are sequentially performed,
wherein the etching process consists of:
repeatedly rotating the substrate alternately at a first speed and at a second speed while the treatment liquid is supplied,
wherein the second speed is higher than the first speed,
wherein the supply of the chemical is initiated when the substrate rotates at the second speed,
wherein a rotational acceleration of the substrate is changed while the rotational speed of the substrate is changed between the first speed and the second speed, and
wherein a foregoing portion of the rotational acceleration is larger than a subsequent portion of the rotational acceleration during the change of the rotational acceleration.

9. The method of claim 8 , wherein the rotational speed of the substrate is changed between the first speed and the second speed two times or more.

10. The method of claim 8 , wherein the first speed is 100 rpm or lower and the second speed is 1000 rpm or higher.

11. The method of claim 8 ,
wherein the chemical being provided for etching the first coating layer, and
wherein the first speed is 100 rpm or lower and the second speed is higher than 1000 rpm.

12. The method of claim 8 , wherein the etching process is performed in one of the first chamber or the second chamber.

Assignees

• Semes Co Ltd

Inventors

• Park Min Jung
• Lee Jung Yul
• Lee Hyun Hee
• Cho Soo Hyun

Classifications

• H10P76/20 Primary

  of masks comprising organic materials · CPC title

• H10P72/7626

  characterised by the construction of the shaft · CPC title

• H10P72/7618

  characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel · CPC title

• H10P72/7612

  characterised by lifting arrangements, e.g. lift pins · CPC title

• H10P72/0604

  Process monitoring, e.g. flow or thickness monitoring · CPC title