Method for transferring an adhesive layer of thermoplastic polymer(s) from a first substrate to a second substrate
US-2024093063-A1 · Mar 21, 2024 · US
US10711162B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10711162-B2 |
| Application number | US-201415028147-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 6, 2014 |
| Priority date | Oct 11, 2013 |
| Publication date | Jul 14, 2020 |
| Grant date | Jul 14, 2020 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
Provided are: an adhesive that offers high adhesiveness to bond and secure an adherend even in a high-temperature environment, as long as securing is necessary. The adherend can be removed without failure and without adhesive residue once securing becomes unnecessary; and a method for processing an adherend using the adhesive. The adhesive according to the present invention contains a multivalent vinyl ether compound (A) and at least one of a compound (B) and a compound (C). The compound (B) is represented by Formula (b). The compound (C) includes two or more constitutional units each represented by Formula (c). Formulae (b) and (c) are expressed as follows:
Opening claim text (preview).
The invention claimed is: 1. An adhesive comprising: a multivalent vinyl ether compound (A) comprising at least one compound selected from the group consisting of a compound represented by Formula (a-1): a compound represented by Formula (a-2): a compound represented by Formula (a-4): and a compound represented by Formula (a-6): and at least one of: a compound (B) represented by Formula (b); and a compound (C) including two or more constitutional units each represented by Formula (c), Formulae (b) and (c) expressed as follows: Z 1 X) n 1 (b) wherein Z 1 represents a group corresponding to a compound selected from the group consisting of saturated or unsaturated aliphatic hydrocarbons, saturated or unsaturated alicyclic hydrocarbons, aromatic hydrocarbons, heterocyclic compounds, and compounds including two or more of them bonded to one another with or without medium of a linkage group, except for removing hydrogen atoms in a number of n 1 from a structural formula of the compound; X is selected from a hydroxyl group and a carboxyl group; and n 1 represents an integer of 2 or more, where n 1 occurrences of X may be identical to or different from each other, wherein Z 2 represents a group corresponding to a compound selected from the group consisting of saturated or unsaturated aliphatic hydrocarbons, saturated or unsaturated alicyclic hydrocarbons, aromatic hydrocarbons, heterocyclic compounds, and compounds including two or more of them bonded to one another with or without medium of a linkage group, except for removing hydrogen atoms in a number of (n 2 +2) from a structural formula of the compound; X is selected from a hydroxyl group and a carboxyl group; and n 2 represents an integer of 1 or more, where n 2 occurrence(s) of X may be identical to or different from each other. 2. The adhesive according to claim 1 , further comprising an acid generator. 3. The adhesive according to claim 1 , wherein the compound (C) has a weight-average molecular weight of 1500 or more as determined by Gel Permeation Chromatography and calibrated with a polystyrene standard. 4. The adhesive according to claim 1 , wherein the adhesive comprises: 0.5% to 80% by weight of the multivalent vinyl ether compound (A); and 20% to 99.5% by weight in total of the at least one of the compound (B) and the compound (C), based on the total amount of polymerizable compounds contained in the adhesive. 5. The adhesive according to claim 1 , further comprising at least one of: a monovalent carboxylic acid represented by Formula (d); and a monohydric alcohol represented by Formula (e), Formulae (d) and (e) expressed as follows: Z 4 —COOH (d) wherein Z 4 represents a group corresponding to a compound selected from the group consisting of saturated or unsaturated aliphatic hydrocarbons, saturated or unsaturated alicyclic hydrocarbons, and aromatic hydrocarbons, each of which may have one or more substituents excluding carboxyl groups, except for removing one hydrogen atom from the structural formula of the corresponding compound, Z 5 —OH (e) wherein Z 5 represents a group corresponding to an aromatic hydrocarbon which may have one or more substituents excluding hydroxyl groups, except for removing one hydrogen atom from the structural formula of the aromatic hydrocarbon. 6. The adhesive according to claim 1 , further comprising a surfactant.
for bonding electronic components such as wafers, chips or semiconductors · CPC title
Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers · CPC title
organic · CPC title
characterised by the presence of specified groups {, e.g. terminal or pendant functional groups} · CPC title
Carboxyl groups · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.