Ceramic substrate and its manufacturing method, power module

US10710936B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10710936-B2
Application numberUS-201715432608-A
CountryUS
Kind codeB2
Filing dateFeb 14, 2017
Priority dateAug 28, 2014
Publication dateJul 14, 2020
Grant dateJul 14, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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Abstract

Official abstract text for this publication.

Provided is a ceramic substrate. The ceramic substrate includes a core layer, made of zirconia toughened alumina; and surface layers, symmetrically located on an upper and a lower surfaces of the core layer, made of Al 2 O 3 . The core layer has a chemical composition of 0 wt %<ZrO 2 ≤40 wt % and 60 wt %≤Al 2 O 3 <100 wt %. A method for manufacturing the ceramic substrate and a power module including the ceramic substrate are also provided.

First claim

Opening claim text (preview).

What is claimed is: 1. A ceramic substrate, comprising: a core layer including zirconia (ZrO 2 ) and alumina (Al 2 O 3 ), wherein the core layer has a chemical composition of 0 wt %<ZrO 2 ≤40 wt % and 60 wt %≤Al 2 O 3 <100 wt %; a plurality of transition layers each including zirconia and alumina, wherein the plurality of transition layers is disposed on an upper surface and a lower surface of the core layer, and each of the plurality of transition layers has a content of zirconia less than that of the core layer; and a plurality of surface layers disposed on the upper surface and the lower surface of the core layer and made of Al 2 O 3 , wherein each of the plurality of transition layers is located between one of the plurality of surface layers and the core layer. 2. The ceramic substrate of claim 1 , wherein the core layer has the chemical composition of 0 wt %<ZrO 2 ≤20 wt % and 80 wt %≤Al 2 O 3 <100 wt %. 3. The ceramic substrate of claim 2 , wherein the plurality of surface layers comprises: an upper surface layer, located on the upper surface of the core layer; and a lower surface layer, located on the lower surface of the core layer, wherein each of the upper surface layer, the lower surface layer, and the core layer has a same thickness. 4. The ceramic substrate of claim 3 , wherein the ceramic substrate has a total thickness of about 0.2 mm to about 0.4 mm. 5. The ceramic substrate of claim 1 , wherein the core layer has the chemical composition of 10 wt %<ZrO 2 ≤20 wt % and 80 wt %≤Al 2 O 3 <90 wt %, and each of the plurality of transition layers has a chemical composition of 0 wt %<ZrO 2 ≤10 wt % and 90 wt %≤Al 2 O 3 <100 wt %. 6. The ceramic substrate of claim 1 , wherein the core layer has the chemical composition of 20 wt %<ZrO 2 ≤40 wt % and 60 wt %≤Al 2 O 3 <80 wt %, each of the plurality of transition layers has a chemical composition of 10 wt %<ZrO 2 ≤20 wt % and 80 wt %≤Al 2 O 3 <90 wt %. 7. The ceramic substrate of claim 3 , wherein the plurality of transition layers comprises: an upper transition layer, located between the core layer and the upper surface layer; and a lower transition layer, located between the core layer and the lower surface layer, wherein each of the upper transition layer, the lower transition layer, the upper surface layer, the lower surface layer, and the core layer has a same thickness. 8. The ceramic substrate of claim 3 , wherein the plurality of transition layers comprises: a first upper transition layer, located on the upper surface of the core layer; a second upper transition layer, located between the first upper transition layer and the upper surface layer; a first lower transition layer, located on the lower surface of the core layer; and a second lower transition layer, located between the first lower transition layer and the lower surface layer; wherein the second upper transition layer has a content of zirconia less than that of the first upper transition layer, and the second lower transition layer has a content of zirconia less than that of the first lower transition layer. 9. The ceramic substrate of claim 8 , wherein each of the second upper transition layer and the second lower transition layer has a same chemical composition of 0 wt %<ZrO 2 ≤10 wt % and 90 wt %≤Al 2 O 3 <100 wt %; each of the first upper transition layer and the first lower transition layer has a same chemical composition of 10 wt %<ZrO 2 ≤20 wt % and 80 wt %<Al 2 O 3 <90 wt %; and the core layer has the chemical composition of 20 wt %<ZrO 2 ≤40 wt % and 60 wt %≤Al 2 O 3 <80 wt %. 10. The ceramic substrate of claim 8 , wherein each of the first upper transition layer, the second upper transition layer, the first lower transition layer, the second lower transition layer, the upper surface layer, the lower surface layer and the core layer has a same thickness. 11. A power module, comprising a direct bonded copper substrate, and the direct bonded copper substrate comprising: a ceramic substrate of claim 1 ; and a metal layer, located on a surface of the ceramic substrate. 12. A power module comprising a direct bonded copper substrate, and the direct bonded copper substrate comprising: a ceramic substrate comprising: a core layer including zirconia (ZrO) and alumina (Al 2 O 3 ), wherein the core layer has a chemical composition of 0 wt %<ZrO 2 ≤40 wt % and 60 wt %≤Al 2 O 3 <100 wt %; a plurality of transition layers each including zirconia and alumina, wherein the plurality of transition layers is disposed on an upper surface and a lower surface of the core layer, and each of the plurality of transition layers has a content of zirconia less than that of the core layer; a plurality of surface layers disposed on the upper surface and the lower surface of the core layer and made of Al 2 O 3 , wherein each of the plurality of transition layers is located between one of the plurality of surface layers and the core layer; and a metal layer located on a surface of the ceramic substrate.

Assignees

Inventors

Classifications

  • Ceramics or glasses · CPC title

  • of conductive package substrates serving as an interconnection, e.g. of metal plates (manufacture or treatment of leadframes H10W70/04) · CPC title

  • having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates · CPC title

  • B32B18/00Primary

    Layered products essentially comprising ceramics, e.g. refractory products · CPC title

  • consisting of glass or ceramic material · CPC title

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What does patent US10710936B2 cover?
Provided is a ceramic substrate. The ceramic substrate includes a core layer, made of zirconia toughened alumina; and surface layers, symmetrically located on an upper and a lower surfaces of the core layer, made of Al 2 O 3 . The core layer has a chemical composition of 0 wt %<ZrO 2 ≤40 wt % and 60 wt %≤Al 2 O 3 <100 wt %. A method for manufacturing the ceramic substrate and a power module inc…
Who is the assignee on this patent?
Byd Co Ltd
What technology area does this patent fall under?
Primary CPC classification B32B18/00. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jul 14 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).