Polishing device and polishing method
US-2016176008-A1 · Jun 23, 2016 · US
US10710207B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10710207-B2 |
| Application number | US-201615236004-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 12, 2016 |
| Priority date | Aug 14, 2015 |
| Publication date | Jul 14, 2020 |
| Grant date | Jul 14, 2020 |
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A magnetic field manipulated localized polishing system includes a container holding a volume of a magnetic abrasive fluid. The magnetic abrasive fluid contains abrasive particles. A motor is positioned under the container. A magnet is coupled to the motor such that the motor induces rotation of the magnet. A workpiece is suspended in the container.
Opening claim text (preview).
What is claimed is: 1. A magnetic field manipulated localized polishing system comprising: a container holding a volume of a magnetic abrasive fluid, the magnetic abrasive fluid containing abrasive particles; a motor positioned under the container; a magnet coupled to the motor such that the motor induces rotation of the magnet; a workpiece suspended in the container; a compressible barrier having a portion thereof extending downwardly perpendicular to the container, the compressible barrier being spaced apart from a side interior face of the container and positioned around and extending below the workpiece and contacting the container so as to create a sealed region under the workpiece, the magnetic abrasive fluid being contained in the sealed region; and wherein movement of the magnet produces spatial and temporal variations in a magnetic field produced by the magnet that excites the magnetic fluid. 2. The magnetic field manipulated localized polishing system of claim 1 , wherein the abrasive particles comprise silicon carbide. 3. The magnetic field manipulated localized polishing system of claim 1 , wherein: the container is positioned on a platform above the motor; and the platform is inclined at an angle relative to horizontal. 4. The magnetic field manipulated localized polishing system of claim 3 , wherein inclination of the platform induces curvilinear variation of a magnetic field of the magnet sufficient to induce agitation of the magnetic abrasive fluid. 5. The magnetic field manipulated localized polishing system of claim 1 , wherein the magnet is mounted off-center of an axis of rotation of the motor. 6. The magnetic field manipulated localized polishing system of claim 5 , wherein the magnet is slightly tilted relative to vertical. 7. The magnetic field manipulated localized polishing system of claim 1 , wherein the magnetic abrasive fluid is suspended in mineral oil. 8. The magnetic field manipulated localized polishing system of claim 1 , wherein the abrasive particles have a diameter of approximately 15 μm. 9. The magnetic field manipulated localized polishing system of claim 1 , wherein the portion extends downwardly perpendicular to a bottom interior face of the container, and wherein the sealed region is formed by the compressible barrier contacting the bottom interior face of the container such that the magnetic abrasive fluid is within the sealed region. 10. A method for magnetic abrasive polishing, the method comprising: positioning a workpiece in a container; positioning a compressible barrier having a portion thereof extending downwardly perpendicular to the container around the workpiece, the compressible barrier contacting the container so as to create a sealed region between the workpiece and the container, wherein the compressible barrier is spaced apart from a side interior face of the container and extends below the workpiece; introducing a magnetic abrasive fluid to a space under the workpiece within the sealed region; magnetizing the magnetic abrasive fluid via a magnet; varying a resulting magnetic field by rotating the magnet to apply a magnetic field gradient to the workpiece; and inducing travel of magnetic particles present in the magnetic abrasive fluid, via spatial and temporal variations in the magnetic field, to affect localized polishing of the workpiece. 11. The method of claim 10 , comprising removing the workpiece and immersing the workpiece in a bath of a solvent. 12. The method of claim 10 , comprising adjusting, via the spatial and the temporal variations in the magnetic field, a stiffness of a polishing action achieved by the magnetic abrasive fluid. 13. The method of claim 12 , wherein the magnet is tilted relative to vertical. 14. The method of claim 10 , comprising applying a downward force to the workpiece sufficient to cause sustained contact between the workpiece and the magnetic abrasive fluid. 15. The method of claim 10 , wherein the magnetic abrasive fluid is moved responsive to variations in the resulting magnetic field. 16. The method of claim 10 , wherein a stiffness of a polishing action is varied with the resulting magnetic field. 17. The method of claim 16 , wherein the varying the resulting magnetic field causes fewer abrasive particles to be exposed to the workpiece in regions of low magnetic field intensity and a greater number of abrasive particles being exposed to the workpiece in regions of high magnetic field intensity. 18. The method of claim 10 , wherein the portion extends downwardly perpendicular to a bottom interior face of the container, and wherein the sealed region is formed by the compressible barrier contacting the bottom interior face of the container such that the magnetic abrasive fluid is within the sealed region.
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using a magnetic polishing agent · CPC title
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