Method and device for plasma treatment of substrates

Patent metadata

Field	Value
Publication number	US-10707059-B2
Application number	US-201415306132-A
Country	US
Kind code	B2
Filing date	May 9, 2014
Priority date	May 9, 2014
Publication date	Jul 7, 2020
Grant date	Jul 7, 2020

Abstract

A device for bombarding at least one substrate with a plasma with a first electrode and a second electrode that can be arranged opposite thereto, which electrodes are formed together producing the plasma between the electrodes wherein at least one of the electrodes is formed from at least two electrode units. In addition, this invention relates to a corresponding method.

First claim

Having described the invention, the following is claimed:

1. A method for bombarding a substrate with a plasma in a chamber, said method comprising:
providing a first electrode and a second electrode arranged opposite to the first electrode to produce the plasma therebetween, wherein at least one of the first and second electrodes comprises an inner electrode unit having a first support surface and an outer electrode unit having a second support surface;
moving at least one of the inner and outer electrode units in a Z-direction such that the first support surface is located above the second support surface;
loading a substrate on the first support surface using a robot arm when the first support surface is located above the second support surface;
moving at least one of the inner and outer electrode units in the Z-direction such that the first support surface and the second support surface form a common support plane (E) for supporting the substrate during a plasma treatment of the substrate;
supplying a plasma gas to the chamber; and
applying a voltage to the first and second electrodes when the first support surface and the second support surface form the common support plane (E), wherein the first and second substrate support surfaces have the same potential during the plasma treatment of the substrate, thereby distributing the plasma homogenously over the entire surface of the substrate.

2. The method according to claim 1 , wherein the common support plane (E) is a closed surface with a uniform potential.

3. The method according to claim 1 , wherein the inner electrode unit is moved in the Z-direction relative to the outer electrode unit.

4. The method according to claim 1 , wherein the substrate is supported by both the first and second support surfaces during the plasma treatment of the substrate.

Assignees

• Ev Group E Thallner Gmbh

Inventors

• Glinsner Thomas
• Flotgen Christoph
• Bernauer Johann
• Wagenleitner Thomas
• Wieser Thomas
• Schmid Florian
• Plach Thomas
• Anzengruber Roman
• Nones Alexander
• Kriebisch Uwe

Classifications

• H10P72/7624

  characterised by the mechanical construction of the susceptor, stage or support · CPC title

• H10P72/0421

  for drying etching · CPC title

• H10P50/242

  of Group IV materials · CPC title

• H01J37/32568 Primary

  Relative arrangement or disposition of electrodes; moving means · CPC title

• H01J37/32532 Primary

  Electrodes · CPC title