Process and formulation to join ceramic forms while maintaining structural and physical characteristics across the bond surface

Patent metadata

Field	Value
Publication number	US-10703879-B2
Application number	US-201414585505-A
Country	US
Kind code	B2
Filing date	Dec 30, 2014
Priority date	Dec 30, 2014
Publication date	Jul 7, 2020
Grant date	Jul 7, 2020

Abstract

A ceramic bonding material including at least one fibrous material, a flux agent and a thickening agent wherein the ceramic bonding material fired at a set temperature to bond the two adjacent substrate faces.

First claim

What is claimed is:

1. A bonding material consisting of:
chopped fibers;
from about 0.05 to about 1.0 wt % of a fluxing agent that is one or more of sodium carbonate, boron carbide, lithium metaborate, cadmium borate, cadmium borosilicate, bismuth oxide, lithium tetraborate, and lead borosilicate; and
a thickening agent wherein the thickening agent is a starch, a vegetable gum, a sugar, a protein, pectin, gelatin, or a combination thereof.

2. The bonding material of claim 1 wherein the chopped fibers have an average length of from about 1/16th of an inch to about ½ of an inch.

3. The bonding material of claim 1 wherein the chopped fibers are selected from fibers of silica (SiO 2 ), alumina (Al 2 O 3 ), zirconium oxide (ZrO 2 ), titanium oxide (TiO 2 ), aluminum silicate (Al-Si-oxide), aluminum borosilicate—with or without an alkali metal, carbon, borosilicate, silicon nitride (SiN) or silicon carbide (SiC) and combinations of these fibers.

4. The bonding material of claim 1 wherein the chopped fibers are aluminum borosilicate.

5. The bonding material of claim 1 wherein the chopped fibers are present in the bonding material before it is cured in an amount ranging from about 50 wt % to about 90 wt %.

6. The bonding material of claim 1 wherein the thickening agent is present in the bonding material before it is cured in an amount ranging from greater than about 0 wt % to about 10 wt %.

7. A composite structure comprising:
a first ceramic foam substrate having a first ceramic foam substrate bonding surface, a second ceramic foam substrate having a second ceramic foam substrate bonding surface; and
a bond region formed by curing the bonding material of claim 1 in contact with the first ceramic foam substrate bonding surface and the second ceramic foam substrate bonding surface.

8. A composite structure comprising;
a first substrate having a first substrate bonding surface, a second substrate having a second substrate bonding surface; and
a green bonding material located between and in contact with the first substrate bonding surface and the second substrate bonding surface, the green bonding material consisting of the bonding material according to claim 1 .

9. The composite structure of claim 8 wherein the first and second substrates are each ceramic foam substrates.

10. The composite structure according to claim 8 wherein the green bonding material penetrates into at least one of the first substrate bonding surface and the second substrate bonding surface to a depth of from about 1/32 inch to about ½ inch.

11. A bonding material consisting of an aqueous admixture of:
from about 50 wt % to about 90 wt % of chopped aluminum borosilicate fibers having an average length of from about 1/16th of an inch to about ½ of an inch;
from about 0.01 wt % to about 5 wt % of lithium metaborate; and
from greater than about 0 wt % to about 10 wt % methylcellulose.

12. A composite structure comprising:
a first ceramic foam substrate having a first ceramic foam substrate bonding surface, a second ceramic foam substrate having a second ceramic foam substrate bonding surface; and
a bonding material located between the first substrate bonding surface and the second substrate bonding surface, the bonding material being formed by applying the bonding material of claim 11 to the first ceramic foam substrate bonding surface and to the second ceramic foam substrate bonding surface such that the bonding material penetrates into the first ceramic foam substrate bonding surface to a depth of from about 1/32 inch to about ½ inch wherein after curing, the cured bonding material bonds the first ceramic foam substrate to the second ceramic foam substrate.

13. A composite structure comprising:
a first substrate having a first substrate bonding surface, a second substrate having a second substrate bonding surface, and the first and second substrates have different coefficients of thermal expansion (CTEs); and
a bonding material located between and in contact with the first substrate bonding surface and the second substrate bonding surface, wherein the bonding material consists of the bonding material according to claim 11 .

14. A composite structure comprising:
a first ceramic foam substrate having a first ceramic foam substrate bonding surface and a second ceramic foam substrate having a second ceramic foam substrate bonding surface; wherein the first and second substrates are fused at a bonding region consisting of product produced by curing, at a temperature of from about 1,000° C. to about 1,600° C., the following:
a thickening agent selected from a starch, a vegetable gum, a sugar, a protein, pectin, a cellulosic material, gelatin a synthetic thickening agent, and combinations thereof,
material at the first ceramic foam substrate bonding surface,
material at the second ceramic foam substrate bonding surface,
one or more of sodium carbonate, boron carbide, lithium metaborate, cadmium borate, cadmium borosilicate, bismuth oxide, lithium tetraborate, and lead borosilicate, and
fibers selected from fibers of silica (SiO2), alumina (Al2O3), zirconium oxide (ZrO2), titanium oxide (TiO2), aluminum silicate (Al-Si-oxide), aluminum borosilicate—with or without an alkali metal, carbon, borosilicate, silicon nitride (SiN) or silicon carbide (SiC) and combinations thereof.

Assignees

• Boeing Co

Inventors

• Crooks Tab H
• Muench Maryann S

Classifications

• B32B7/027

  Thermal properties · CPC title

• B32B2315/02

  Ceramics · CPC title

• B32B2309/02

  Temperature · CPC title

• B32B2305/22

  Fibres of short length · CPC title

• B32B37/1207

  Heat-activated adhesive (B32B37/04 takes precedence) · CPC title