Method and structure for flip-chip package reliability monitoring using capacitive sensors groups
US-2018047644-A1 · Feb 15, 2018 · US
US10697851B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10697851-B2 |
| Application number | US-201715720861-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 29, 2017 |
| Priority date | Sep 29, 2017 |
| Publication date | Jun 30, 2020 |
| Grant date | Jun 30, 2020 |
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An electro-mechanical fuse is provided and includes a chassis component, an extrusion disposed on a monitored component which is disposable proximate to the chassis component and a sensor. The sensor is mounted to the chassis component. The sensor is mechanically breakable in power-on and power-off conditions by the extrusion as a result of a predefined action of or relative to the monitored component. The sensor electrically signals an occurrence of the mechanical breakage during power-on conditions following mechanical breakage.
Opening claim text (preview).
What is claimed is: 1. An electro-mechanical fuse, comprising: a chassis component; an extrusion disposed on a monitored component which is disposable proximate to the chassis component; and a sensor mounted to the chassis component to be mechanically breakable in power-on and power-off conditions by the extrusion as a result of a predefined magnitude of deflection of the monitored component, the sensor being configured to identify mechanical breakage of the conducting filament occurring during the power-off conditions and to electrically signal an occurrence of the mechanical breakage upon the power-on conditions taking effect following the mechanical breakage occurring during the power-off conditions. 2. The electro-mechanical fuse according to claim 1 , wherein: the chassis component is operably disposable within a computing device housing, the chassis component comprises a surface and a mounting for the sensor, and the mounting comprises bosses extending from the surface and which are sized for clean sensor breakage. 3. The electro-mechanical fuse according to claim 1 , wherein the sensor comprises a conductor assembly comprising: a conducting filament; a body to support the conducting filament; and circuitry configured to identify the mechanical breakage of the conducting filament occurring during the power-off conditions upon the power-on conditions taking effect. 4. The electro-mechanical fuse according to claim 3 , wherein at least one of the conducting filament and the body are at least one of: brittle, comprised of laminates or composites with known break strengths, and at least one of: scored, scribed, pre-cracked, and pre-stressed. 5. The electro-mechanical fuse according to claim 3 , wherein the circuitry electrically signals the occurrence of the mechanical breakage occurring during the power-off conditions responsive to sampling upon the power-on conditions taking effect. 6. The electro-mechanical fuse according to claim 3 , wherein the extrusion is harder than at least the body. 7. The electro-mechanical fuse according to claim 1 , wherein the sensor is a singular element with multiple stages embodied therein and is configured to mechanically break in the multiple stages and to correspondingly electrically signal occurrences of the mechanical break in each of the multiple stages. 8. An electro-mechanical fuse for identifying deflection of a monitored component, the electro-mechanical fuse comprising: a chassis component comprising a mounting; a conductor assembly comprising an encased conducting filament and circuitry configured to identify encased conducting filament breakage, the encased conducting filament being supportively disposable on the mounting such that the encased conducting filament oppositely faces and is separate from the chassis component and the monitored component, respectively; and an extrusion disposed on the monitored component to impact and then break the encased conducting filament upon a predefined action of or relative to the monitored component, wherein the circuitry is configured to identify the encased conducting filament breakage occurring during power-off conditions and to electrically signal an occurrence of the encased conducting filament breakage upon power-on conditions taking effect following the encased conducting filament breakage occurring during the power-off conditions. 9. The electro-mechanical fuse according to claim 8 , wherein the chassis component is operably disposable within a computing device housing. 10. The electro-mechanical fuse according to claim 8 , wherein the chassis component comprises a surface and the mounting comprises bosses extending from the surface which are sized for clean encased conducting filament breakage. 11. The electro-mechanical fuse according to claim 8 wherein the encased conducting filament comprises a conducting filament electrically communicative with the circuitry and a body supportive of the conducting filament. 12. The electro-mechanical fuse according to claim 11 , wherein at least one of the conducting filament and the body are at least one of: brittle, comprised of laminates or composites with known break strengths, and at least one of: scored, scribed, pre-cracked, and pre-stressed. 13. The electro-mechanical fuse according to claim 8 , wherein the circuitry electrically signals the encased conducting filament breakage responsive to sampling upon the power-on conditions taking effect. 14. The electro-mechanical fuse according to claim 8 , wherein the extrusion is harder than at least the encased conducting filament. 15. The electro-mechanical fuse according to claim 8 , wherein: the encased conducting filament is configured for breakage in multiple stages exclusively embodied in the encased conducting filament, and the circuitry correspondingly electrically signals occurrences of the breakage of the encased conducting filament in each of the multiple stages. 16. An electro-mechanical fuse for identifying damage to a printed circuit board (PCB) inside a housing of a computing device, the electro-mechanical fuse comprising: a chassis component of the housing, the PCB being disposed in the housing proximate to the chassis component; an extrusion disposed on the PCB; and a sensor mounted to the chassis component to be mechanically breakable in power-on conditions and power-off conditions by the extrusion as a result of the PCB deflecting by a predefined magnitude, the sensor being configured to identify mechanical breakage of the conducting filament occurring during the power-off conditions by mechanically breaking during the power-off conditions and to electrically signal an occurrence of the mechanical breakage upon the power-on conditions taking effect following the mechanical breakage occurring during the power-off conditions. 17. The electro-mechanical fuse according to claim 16 , wherein the sensor comprises a conductor assembly comprising: a conducting filament; a body to support the conducting filament; and circuitry configured to identify the mechanical breakage of the conducting filament occurring during the power-off conditions upon the power-on conditions taking effect. 18. The electro-mechanical fuse according to claim 17 , wherein the circuitry electrically signals the occurrence of the mechanical breakage occurring during the power-off conditions responsive to sampling upon the power-on conditions taking effect. 19. The electro-mechanical fuse according to claim 16 , wherein the sensor is a singular element with multiple stages embodied therein and is configured to mechanically break in the multiple stages and to correspondingly electrically signal occurrences of the mechanical break in each of the multiple stages.
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