Flexible filter element using liquid metal and method of preparing the same

Patent metadata

Field	Value
Publication number	US-10697838-B1
Application number	US-201916397073-A
Country	US
Kind code	B1
Filing date	Apr 29, 2019
Priority date	Apr 15, 2019
Publication date	Jun 30, 2020
Grant date	Jun 30, 2020

Abstract

Provided are a filter element and a method of preparing a filter element. The filter element includes a pattern substrate having a first channel formed on one surface and a second channel formed on the other surface and including a first base and a second base which have different liquid permeabilities; a first liquid metal pattern disposed in the first channel; a second liquid metal pattern disposed in the second channel and at least partially overlapping the first liquid metal pattern; and a contactor configured to invade in the first base and the second base and electrically connect the first liquid metal pattern to the second liquid metal pattern.

First claim

What is claimed is:

1. A filter element comprising:
a pattern substrate having a first channel formed on one surface and a second channel formed on the other surface and including a first base and a second base which have different liquid permeabilities;
a first liquid metal pattern disposed in the first channel;
a second liquid metal pattern disposed in the second channel and at least partially overlapping the first liquid metal pattern; and
a contactor configured to invade in the first base and the second base and electrically connect the first liquid metal pattern to the second liquid metal pattern.

2. The filter element of claim 1 , wherein:
the contactor is electrically equivalent to an output terminal of the filter element;
a width of the contactor decreases in a direction from a first area at which the first liquid metal pattern is connected to the contactor to a second area at which the second liquid metal pattern is connected to the contactor, and
the direction is a view direction of a plan view.

3. The filter element of claim 2 , wherein:
the filter element is a low-pass filter element;
the first liquid metal pattern forms an inductor element; and
the second liquid metal pattern forms a capacitor element.

4. The filter element of claim 2 , wherein:
the filter element is a high-pass filter element;
the first liquid metal pattern forms a capacitor element; and
the second liquid metal pattern forms an inductor element.

5. The filter element of claim 2 , wherein:
the first base is in contact with the first liquid metal pattern;
the second base is in contact with the second liquid metal pattern;
the contactor includes:
a first contactor configured to invade in the first base; and
a second contactor configured to invade in the second base and having a physical boundary with the first contactor; and
a variance rate in width of the first contactor is greater than that in width of the second contactor.

6. The filter element of claim 5 , wherein:
each of the first liquid metal pattern and the second liquid metal pattern includes conductive particles dispersed therein; and
the first contactor and the second contactor have compositions different from those of the first liquid metal pattern and the second liquid metal pattern.

7. The filter element of claim 6 , wherein:
the first liquid metal pattern includes a first contact pad and a first circuit pattern connected to the first contact pad; and
the second liquid metal pattern includes a second contact pad overlapping the first contact pad and the contactor, and a second circuit pattern connected to the second contact pad and at least partially overlapping the first circuit pattern.

8. The filter element of claim 7 , wherein each of the first circuit pattern and the second circuit pattern has a round shape in the plan view.

9. The filter element of claim 8 , wherein the pattern substrate further includes:
a first patterned layer disposed on one surface of the first base;
a second patterned layer disposed on one surface of the second base; and
a reinforcing layer disposed on a side surface of the first patterned layer.

10. The filter element of claim 9 , wherein:
the pattern substrate further includes a transmission blocking layer disposed on the one surface of the first base and configured to be in contact with the first liquid metal pattern; and
the transmission blocking layer overlaps the first circuit pattern and does not overlap the first contact pad.

11. The filter element of claim 10 , further comprising:
a sealing layer disposed on the one surface of the pattern substrate and having a plurality of holes overlapping the first contact pad; and
a plurality of cover members disposed on the plurality of holes of the sealing layer to cover the plurality of holes and configured to be in contact with the first liquid metal pattern,
wherein at least a part of the plurality of holes and at least a part of the plurality of cover members are disposed to not overlap the transmission blocking layer.

12. The filter element of claim 8 , wherein:
each of a side surface of the first contact pad and a side surface of the first circuit pattern has an inclination angle of less than 90 degrees;
a maximal width of the first contact pad is greater than that of the first circuit pattern; and
an inclination angle of the first circuit pattern is greater than that of the first contact pad.

13. A filter element comprising:
a first base;
a first passive element disposed on one surface of the first base;
a second base disposed on the other surface of the first base and having liquid permeability that is greater than that of the first base;
a second passive element disposed on the second base;
a first contactor formed by a liquid metal invading in the first base and configured to be electrically connected to the first passive element; and
a second contactor formed by a liquid metal invading in the second base and configured to be electrically connected to the first contactor and the second passive element,
wherein an average width of the first contactor is greater than that of the second contactor.

14. A method of preparing a filter element, comprising:
preparing a first pattern substrate having a first channel formed on one surface thereof and comprising a first base;
forming a first liquid metal pattern in the first channel;
preparing a second pattern substrate having a second channel formed on one surface thereof and comprising a second base;
forming a second liquid metal pattern in the second channel;
disposing the other surface of the first pattern substrate to face the other surface of the second pattern substrate; and
pressurizing a portion of the first liquid metal pattern to form a contactor invading in the first base and the second base.

15. The method of claim 14 , wherein:
the pressurization is performed in a direction from the first pattern substrate to the second pattern substrate; and
liquid permeability of the second base is greater than that of the first base.

16. The method of claim 15 , further comprising, between the preparing of the first pattern substrate and the forming of the first liquid metal pattern,
disposing a sealing layer on the one surface of the first pattern substrate; and
forming a hole in the sealing layer.

17. The method of claim 16 , wherein the preparing of the first pattern substrate includes:
preparing the first base;
forming a first patterned layer, which forms the first channel, on the one surface of the first base;
forming a reinforcing layer on a side surface of the first patterned layer;
forming a transmission blocking layer on the one surface of the first base which is exposed without being covered by the first patterned layer,
wherein the forming of the first liquid metal pattern includes injecting a liquid metal through the hole of the sealing layer.

Assignees

• Korea Inst Ind Tech

Inventors

• Kang Sung Bok
• Kim Jong Seok
• Choi Hyeun Seog

Classifications

• H10P50/00

  Etching of wafers, substrates or parts of devices · CPC title

• A61B5/7225

  Details of analogue processing, e.g. isolation amplifier, gain or sensitivity adjustment, filtering, baseline or drift compensation (input circuits for detecting, measuring, or recording bioelectric or biomagnetic signals A61B5/30; specific diagnostic methods using bioelectric or biomagnetic signals A61B5/316) · CPC title

• H01B1/22 Primary

  the conductive material comprising metals or alloys · CPC title

• A61B5/0531

  Measuring skin impedance · CPC title

• H01P11/007 Primary

  Manufacturing frequency-selective devices (resonators H01P11/008) · CPC title