Engineered Polymer-Based Electronic Materials
US-2018056455-A1 · Mar 1, 2018 · US
Conductive paste for bonding
US10696875B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10696875-B2 |
| Application number | US-201715704456-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 14, 2017 |
| Priority date | Sep 15, 2016 |
| Publication date | Jun 30, 2020 |
| Grant date | Jun 30, 2020 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
The present invention relates to a conductive paste for bonding comprising 100 parts by weight of the metal powder, 5 to 20 parts by weight of a solvent, and 0.05 to 3 parts by weight of a polymer, wherein the polymer comprises a first polymer and a second polymer, wherein the molecular weight (Mw) of the first polymer is 5,000 to 95,000, and the molecular weight (Mw) of the second polymer is 100,000 to 300,000.
First claim
Opening claim text (preview).
What is claimed is: 1. A conductive paste for bonding consisting essentially of 100 parts by weight of a metal powder consisting of silver and/or copper, 5 to 20 parts by weight of a solvent, 0.05 to 3 parts by weight of a polymer, wherein the polymer comprises a first polymer and a second polymer, wherein the molecular weight (Mw) of the first polymer is 5,000 to 95,000, and the molecular weight (Mw) of the second polymer is 100,000 to 300,000, and optionally one or more additives selected from the group consisting of surfactant, dispersing agent, emulsifier, stabilizer, and plasticizer. 2. The conductive paste of claim 1 , wherein the first polymer is selected from the group consisting of ethyl cellulose, methylcellulose, hydroxypropyl cellulose, polyvinyl butyral resin, phenoxy resin, polyester resin, epoxy resin, acrylic resin, polyimide resin, polyamide resin, polystyrene resin, butyral resin, polyvinyl alcohol resin, polyurethane resin and a mixture thereof. 3. The conductive paste of claim 1 , wherein the second polymer is selected from the group consisting of ethyl cellulose, methylcellulose, hydroxypropyl cellulose, polyvinyl butyral resin, phenoxy resin, polyester resin, epoxy resin, acrylic resin, polyimide resin, polyamide resin, polystyrene resin, butyral resin, polyvinyl alcohol resin, polyurethane resin and a mixture thereof. 4. The conductive paste of claim 1 , wherein the mixing weight ratio of the first polymer and the second polymer (first polymer:second polymer) is 10:1 to 0.1:1. 5. The conductive paste of claim 1 , wherein the molecular weight of the second polymer is greater than the molecular weight of the first polymer by 10,000 or more.
Assignees
Inventors
Classifications
between a chip and a stacked insulating package substrate, interposer or RDL · CPC title
of die-attach connectors · CPC title
Controlling the bonding environment, e.g. atmosphere composition or temperature · CPC title
Connecting techniques · CPC title
Treating the bonding area before connecting, e.g. by applying flux or cleaning · CPC title
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- What does patent US10696875B2 cover?
- The present invention relates to a conductive paste for bonding comprising 100 parts by weight of the metal powder, 5 to 20 parts by weight of a solvent, and 0.05 to 3 parts by weight of a polymer, wherein the polymer comprises a first polymer and a second polymer, wherein the molecular weight (Mw) of the first polymer is 5,000 to 95,000, and the molecular weight (Mw) of the second polymer is 1…
- Who is the assignee on this patent?
- Du Pont
- What technology area does this patent fall under?
- Primary CPC classification C09J9/02. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Jun 30 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).