Method for producing polyamide resin

Patent metadata

Field	Value
Publication number	US-10696789-B2
Application number	US-201515517464-A
Country	US
Kind code	B2
Filing date	Sep 8, 2015
Priority date	Oct 7, 2014
Publication date	Jun 30, 2020
Grant date	Jun 30, 2020

Abstract

Provided is a method for producing a polyamide resin including reacting a dicarboxylic acid component containing sebacic acid in an amount of 50 mol % or more and a diamine component containing xylylenediamine in an amount of 70 mol % or more, wherein the total content of the specific compounds in the sebacic acid is 100 ppm by mass or less.

First claim

The invention claimed is:

1. A method for producing a polyamide resin, comprising:
reacting a dicarboxylic acid component containing sebacic acid in an amount of 50 mol % or more and a diamine component containing xylylenediamine in an amount of 70 mol % or more,
wherein a total content of compounds represented by the following general formulae (A) and the following general formula (B) in the sebacic acid is 100 ppm by mass or less:

wherein, in the general formula (A), one hydroxyl group is bonded to one of carbon atoms C 1 , C 2 , C 3 , C 4 , C 5 , C 6 , C 7 and C 8 , and
one of a bond between C 1 and C 2 , a bond between C 2 and C 3 , a bond between C 3 and C 4 , a bond between C 4 and C 5 , a bond between C 5 and C 6 , a bond between C 6 and C 7 , and a bond between C 7 and C 8 is a double bond, and the others are single bonds; and
in the general formula (B), one hydroxyl group is bonded to one of carbon atoms C 9 , C 10 , C 11 , C 12 , C 13 , C 14 and C 15 , and
one of a bond between C 9 and C 10 , a bond between C 10 and C 11 , a bond between C 11 and C 12 , a bond between C 12 and C 13 , a bond between C 13 and C 14 , and a bond between C 14 and C 15 is a double bond, and the others are single bonds.

2. The method for producing a polyamide resin according to claim 1 , wherein the sebacic acid has a purity of 99.5% by mass or more.

3. The method for producing a polyamide resin according to claim 1 , wherein the xylylenediamine is metaxylylenediamine, paraxylylenediamine or a mixture thereof.

4. The method for producing a polyamide resin according to claim 1 , wherein the dicarboxylic acid component and the diamine component are reacted in the presence of a phosphorus atom-containing compound.

5. The method for producing a polyamide resin according to claim 4 , wherein the phosphorus atom-containing compound is selected from the group consisting of sodium hypophosphite, calcium hypophosphite and hydrates of these compounds.

6. The method for producing a polyamide resin according to claim 1 , wherein the sebacic acid is obtained according to a recrystallization method using methanol as a solvent.

Assignees

• Mitsubishi Gas Chemical Co

Inventors

• Tochihara Tatsuya
• Shinohara Katsumi
• Mitadera Jun

Classifications

• C08K2003/324

  Alkali metal phosphate · CPC title

• B01D9/00

  Crystallisation (crystallisation directly from the vapour phase B01D7/02; making single crystals C30B {; crystallisation as part of the Bayer process also classified in C01F7/14}) · CPC title

• C08G69/28 Primary

  Preparatory processes · CPC title

• C08L77/06

  Polyamides derived from polyamines and polycarboxylic acids (C08L77/10 takes precedence) · CPC title

• C08K3/32

  Phosphorus-containing compounds · CPC title