Modular satellite

Patent metadata

Field	Value
Publication number	US-10696430-B2
Application number	US-201615158097-A
Country	US
Kind code	B2
Filing date	May 18, 2016
Priority date	May 19, 2015
Publication date	Jun 30, 2020
Grant date	Jun 30, 2020

Abstract

A modular satellite having a plurality of electronics boxes that accommodate electrical and/or electronic modules. The electronics boxes are or can be electrically connected with one another. The satellite is provided with a basis structural panel, a docking structure disposed on the basis structural panel, and a plurality of device carrier panels that are or can be connected with the docking structure. The docking structure has first electrical connection elements for an electrical connection with the electronics boxes. The device carrier panels have mechanical connection elements for holding the electronics boxes. The respective device carrier panel is configured, at least in certain regions, so that it can be tempered by means of integrated heat sources and/or heat sinks.

First claim

The invention claimed is:

1. A modular satellite having a plurality of electronics boxes that accommodate at least one of electrical or electronic modules, wherein the electronics boxes are electrically connected or electrically connectable with one another, comprising:
a basis structural panel,
a docking structure disposed on the basis structural panel,
a plurality of device carrier panels that are connected or connectable with the docking structure,
wherein the docking structure has first electrical connection elements for an electrical connection with the electronics boxes,
wherein the device carrier panels have mechanical connection elements for holding the electronics boxes, and
wherein the respective device carrier panel is configured, at least in certain regions, so as to be temperable by means of at least one of integrated heat sources or heat sinks.

2. The modular satellite according to claim 1 , wherein the mechanical connection elements of the device carrier panels and the electrical connection elements of the docking structure assigned to them, form docking stations for the electronics boxes, and at least part of the docking stations are configured in the same manner and arranged in a raster, in order to determine accommodation niches for the electronics boxes.

3. The modular satellite according to claim 1 , wherein the docking structure is configured as a lattice-like box profile, in an interior of which electrical supply lines and connection lines run, which lines are connected with the electrical connection elements.

4. The modular satellite according to claim 1 , wherein the at least one of heat sources or heat sinks integrated into the device carrier panel are provided in a base plate of the device carrier panel.

5. The modular satellite according to claim 4 , wherein
the base plate is provided with at least one heat contact surface in the region of the first mechanical connection elements, on which surface an electronics box that stands in engagement with the mechanical connection elements lies on a housing surface with heat-conductive contact, and
the at least one heat contact surface stands in heat-conductive contact with the at least one of a heat source or heat sink integrated into the base plate.

6. The modular satellite according to claim 4 , wherein the base plate is equipped, at least in certain regions, with heat conduction devices, which are configured for transporting away, by means of heat conduction, the heat or cold that acts on the base plate or on a region of the base plate.

7. The modular satellite according to claim 6 , wherein the heat conduction devices have heat pipes that are provided on or in the base plate.

8. The modular satellite according to claim 7 , wherein the heat pipes are formed by tracks of a heat-conductive material that run in the interior of the base plate.

9. The modular satellite according to claim 7 , wherein the heat pipes are formed by channels of a heat-conductive material that run in the interior of the base plate, the channels being configured to contain a flow of a heat transport medium.

10. The modular satellite according to claim 6 , wherein the base plate is provided with heat conduction coupling devices, which stand in a heat-conductive connection with the heat conduction devices, and which can be coupled, in heat-conductive manner, with other heat conduction devices outside of the base plate.

11. The modular satellite according to claim 4 , wherein the base plate is equipped, at least in certain regions, with at least one of electrical cooling or heating devices that are configured for directly cooling or heating the base plate or a region of the base plate.

12. The modular satellite according to claim 6 , wherein a plurality of at least one of individually controllable heat conduction devices, cooling or heating devices is provided, distributed over a surface of the base plate.

13. The modular satellite according to claim 12 , wherein at least one temperature sensor is assigned to each of the individually controllable heat conduction devices, cooling or heating devices, in or on the base plate.

14. The modular satellite according to claim 13 , wherein a temperature control device is provided, which is connected with the temperature sensors by way of signal lines and is connected with the individually controllable heat conduction devices, cooling or heating devices by way of control lines.

15. The modular satellite according to claim 14 , wherein the temperature control device is provided on the base plate.

16. The modular satellite according to claim 14 , wherein the temperature control device is integrated into the base plate.

17. A modular satellite having a plurality of electronics boxes that accommodate at least one of electrical or electronic modules, wherein the electronics boxes are electrically connected or electrically connectable with one another, comprising:
a basis structural panel,
a docking structure disposed on the basis structural panel,
a plurality of device carrier panels that are connected or connectable with the docking structure,
wherein the docking structure has first electrical connection elements for an electrical connection with the electronics boxes,
wherein the device carrier panels have mechanical connection elements for holding the electronics boxes, and
wherein the respective device carrier panel is configured, at least in certain regions, so as to be temperable by means of integrated heat sources and heat sinks.

18. The modular satellite according to claim 17 , wherein the heat sources and heat sinks integrated into the device carrier panel are provided in a base plate of the device carrier panel.

19. The modular satellite according to claim 18 , wherein the base plate is equipped, at least in certain regions, with electrical cooling and heating devices that are configured for directly cooling or heating the base plate or a region of the base plate.

Assignees

• Airbus Ds Gmbh

Inventors

• Bose Guido
• Grasl Andreas

Classifications

• B64G1/10 Primary

  Artificial satellites; Systems of such satellites; Interplanetary vehicles (space shuttles B64G1/14) · CPC title

• B64G1/50

  for temperature control · CPC title

• H05K7/20254

  Cold plates transferring heat from heat source to coolant · CPC title

• H05K7/20

  Modifications to facilitate cooling, ventilating, or heating · CPC title

• B64G1/44

  using radiation, e.g. deployable solar arrays · CPC title