Laser processing apparatus

Patent metadata

Field	Value
Publication number	US-10695870-B2
Application number	US-201815921137-A
Country	US
Kind code	B2
Filing date	Mar 14, 2018
Priority date	Mar 14, 2017
Publication date	Jun 30, 2020
Grant date	Jun 30, 2020

Abstract

A laser processing apparatus includes a controller having (a) a section for storing the Y coordinate of a characteristic point having a predetermined positional relation to each division line formed on a wafer as a reference value with respect to a reference position where the focal point of a laser beam coincides with a predetermined position on each division line, (b) a section for detecting the amount of deviation of the Y coordinate of the characteristic point after indexing each division line of the wafer in the Y direction by the operation of a Y moving unit, from the Y coordinate stored as the reference value, and (c) a section for determining whether or not the amount of deviation detected is greater than an allowable value.

First claim

What is claimed is:

1. A laser processing apparatus comprising:
a chuck table for holding a wafer having a plurality of devices formed on a front side so as to be separated by a plurality of crossing division lines;
laser beam applying means for applying a laser beam to said wafer held on said chuck table;
imaging means for imaging said wafer held on said chuck table;
X moving means for relatively feeding said chuck table and said laser beam applying means in an X direction;
Y moving means for relatively indexing said chuck table and said laser beam applying means in a Y direction perpendicular to said X direction; and
control means for controlling said chuck table, said laser beam applying means, said imaging means, said X moving means, and said Y moving means;
said laser beam applying means including
a laser oscillator for oscillating said laser beam, and
focusing means for focusing said laser beam oscillated from said laser oscillator and applying said laser beam to each division line of said wafer held on said chuck table,
said control means including
a coordinate storing section for storing the Y coordinate of a characteristic point having a predetermined positional relation to each division line as a reference value with respect to a reference position where the focal point of said laser beam to be focused by said focusing means coincides with a predetermined position on each division line in said Y direction,
a deviation detecting section for detecting the amount of deviation of the Y coordinate of said characteristic point imaged by said imaging means after indexing each division line of said wafer in said Y direction by the operation of said Y moving means, from the Y coordinate stored as said reference value in said coordinate storing section, and
a determining section for determining whether or not the amount of deviation detected by said deviation detecting section is greater than an allowable value,
wherein when said determining section determines that the amount of deviation is greater than said allowable value, an index amount as the amount of indexing each division line is corrected by the amount of deviation in said Y direction by the operation of said Y moving means, and the index amount corrected is used in next indexing said wafer.

2. The laser processing apparatus according to claim 1 , wherein said deviation detecting section is operated during laser processing while said wafer held on said chuck table and said focusing means are being relatively moved in said X direction.

3. The laser processing apparatus according to claim 2 , wherein said imaging means includes an imaging element, an objective lens, and a strobe light source for forming a still image of said wafer, said still image being formed during laser processing while said wafer held on said chuck table and said focusing means are being relatively moved in said X direction.

4. The laser processing apparatus according to claim 1 , wherein said laser beam to be applied from said focusing means is a laser beam having a transmission wavelength to said wafer, and said laser beam is applied to said wafer along each division line in the condition where the focal point of said laser beam to be focused by said focusing means is set inside said wafer, thereby forming a modified layer inside said wafer along each division line.

5. The laser processing apparatus according to claim 4 , wherein said wafer is held on said chuck table in the condition where a back side of said wafer is exposed, and said characteristic point formed on the front side of said wafer is imaged through the back side of said wafer by said imaging means.

6. The laser processing apparatus according to claim 1 , wherein said deviation detecting section is operated during laser processing along an arbitrary one of said division lines.

7. The laser processing apparatus according to claim 1 , wherein said deviation detecting section is operated during laser processing along each division line.

8. The laser processing apparatus according to claim 1 , further comprising:
alignment means for imaging said wafer held on said chuck table and making the focal position of said laser beam to be focused by said focusing means coincide with the center of each division line in said Y direction,
said imaging means functioning also as said alignment means.

Assignees

• Disco Corp

Inventors

• Kobayashi Yutaka
• Sawabe Taiki
• Mannami Hidetoshi
• Tanaka Kohei
• Onoe Wakana

Classifications

• H10W10/00

  Isolation regions in semiconductor bodies between components of integrated devices · CPC title

• H10W10/01

  Manufacture or treatment · CPC title

• H10P54/00

  Cutting or separating of wafers, substrates or parts of devices · CPC title

• H10P72/70

  for supporting or gripping · CPC title

• H10P72/53

  using optical controlling means · CPC title