Method of seamless bonding and device therefor

Patent metadata

Field	Value
Publication number	US-10695854-B2
Application number	US-201514670834-A
Country	US
Kind code	B2
Filing date	Mar 27, 2015
Priority date	Mar 28, 2014
Publication date	Jun 30, 2020
Grant date	Jun 30, 2020

Abstract

A method of seamless bonding comprises in sequence: feeding a filler wire into a de-scaling unit; removing with the de-scaling unit a contamination layer disposed onto a core of the filler wire, removing the contamination layer comprising: applying a laser beam to the filler wire at a wavelength causing at least a portion of the contamination layer to break away from the core of the filler wire while leaving the core unaffected; and feeding the filler wire to a seamless bonding unit. A seamless bonding device is also presented.

First claim

The invention claimed is:

1. A method of seamlessly joining components, the method comprising, in sequence:
feeding a filler wire to a de-scaling unit, the filler wire extending along a longitudinal axis, the de-scaling unit configured for moving the filler wire therethrough along the longitudinal axis;
removing with the de-scaling unit an oxidation layer disposed onto an outer surface of a core of the filler wire, the oxidation layer being a layer forming on a material of the core as a result of an oxidation of the material of the core, removing the oxidation layer comprising:
applying at least one laser beam to the filler wire at a wavelength causing at least a portion of the oxidation layer to break away from the core of the filler wire while leaving the core unaffected such that the non-oxidized material of the core is not removed by the at least one laser beam; and

welding the components together with the filler wire fed to a welding unit.

2. The method as defined in claim 1 , wherein removing the oxidation layer further comprises projecting a flow of gas onto the filler wire thereby pushing freed pieces of the oxidation layer away from the filler wire.

3. The method as defined in claim 1 , wherein applying the at least one laser beam comprises applying two or more laser beams to the filler wire.

4. The method as defined in claim 1 , comprising applying a plurality of laser beams to the filler wire to separate areas of the filler wire.

5. The method as defined in claim 1 , wherein applying the at least one laser beam to the filler wire comprises applying four laser beams disposed at 90 degrees from each other around the filler wire.

6. The method as defined in claim 1 , wherein feeding the filler wire to the welding unit comprises feeding the filler wire to the welding unit in series with the de-scaling unit.

7. The method according to claim 1 , wherein removing with the de-scaling unit the oxidation layer includes selecting a wavelength of the laser beam as a function of the oxidation layer and of the core.

8. The method according to claim 1 , wherein removing with the de-scaling unit the oxidation layer includes selecting a wavelength of the laser beam as a function of the oxidation layer and of the core.

9. A seamless bonding device comprising:
a de-scaling unit adapted to receive a filler wire, the filler wire extending along a longitudinal axis, the de-scaling unit configured for moving the filler wire therethrough along the longitudinal axis, the de-scaling unit comprising:
at least one optical fiber configured to emit at least one laser beam at a wavelength enabling breaking of an oxidation layer forming on a material of a core of the filler wire as a result of an oxidation of the material of the core, and removal of the oxidation layer from the filler wire without removing the non-oxidized material of the core; and
a welding unit for joining components together using the filler wire, the welding unit disposed downstream of the de-scaling unit relative to the moving filler wire.

10. The seamless bonding device as defined in claim 9 , further comprising a flow of gas adapted to be projected onto the filler wire, the flow of gas being configured to remove the freed pieces of the oxidation layer from the filler wire.

11. The seamless bonding device as defined in claim 10 , wherein the flow of gas is a flow of argon.

12. The seamless bonding device as defined in claim 9 , wherein the filler wire has a magnesium core.

13. The seamless bonding device as defined in claim 9 , wherein the at least one optical fiber includes four optical fibers disposed at 90 degrees from each other.

14. The method according to claim 9 , further comprising means to select a wavelength of the laser beam as a function of the oxidation layer and of the core.

15. A method of seamlessly joining components, the method comprising, in sequence:
feeding a filler wire having a magnesium core to a de-scaling unit, the filler wire extending along a longitudinal axis, the de-scaling unit configured for moving the filler wire therethrough along the longitudinal axis;
removing with the de-scaling unit an oxidation layer disposed onto the magnesium core of the filler wire, the oxidation layer being a layer forming on the magnesium core as a result of an oxidation of the magnesium core, removing the oxidation layer comprising:
applying a laser beam to the filler wire at a wavelength causing at least a portion of the oxidation layer to break away from the magnesium core of the filler wire while leaving the magnesium core unaffected such that only the oxidation layer is removed by the at least one laser beam; and

seamlessly welding the components together with the filler wire.

16. The method of claim 15 , wherein applying a laser beam comprises applying at least two laser beams to the filler wire, a first one of the at least two laser beams being at a first longitudinal position relative to the longitudinal axis, a second one of the at least two laser beams being at a second longitudinal position relative to the longitudinal axis, wherein the first longitudinal position is longitudinally offset from the second longitudinal position.

Assignees

• Pratt & Whitney Canada

Inventors

• Verrier Pierre

Classifications

• B23K26/0619

  with spots located on opposed surfaces of the workpiece · CPC title

• B23K26/142

  for the removal of by-products · CPC title

• B23K26/0622

  by shaping pulses · CPC title

• B23K26/361

  for deburring or mechanical trimming (B23K26/351 takes precedence) · CPC title

• B23K1/0018

  Brazing of turbine parts · CPC title