Applicator having active backpressure control devices

US10695779B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10695779-B2
Application numberUS-201916378186-A
CountryUS
Kind codeB2
Filing dateApr 8, 2019
Priority dateSep 8, 2016
Publication dateJun 30, 2020
Grant dateJun 30, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present disclosure describes a method and system for controlling dispensing of adhesive from an applicator. The method includes pumping adhesive from a plurality of pump assemblies to a plurality of dispensing modules and measuring current draw from each of the plurality of pump assemblies. The method also includes determining an adjustment to an operating speed of each of the plurality of pump assemblies individually based on their respective current draws and adjusting the operating speed of each of the plurality of pump assemblies individually.

First claim

Opening claim text (preview).

What is claimed is: 1. A dispensing system for dispensing adhesive, the dispensing system comprising: an applicator comprising: a manifold; a plurality of dispensing modules coupled to said manifold; and a plurality of pump assemblies, wherein each of the plurality of pump assemblies is configured to pump the adhesive to a respective one of the plurality of dispensing modules at a respective operating speed; and a controller in signal communication with the applicator, wherein the controller is configured to a) measure current draw from each of the plurality of pump assemblies, b) determine an adjustment to the operating speed of each of the plurality of pump assemblies individually based on their respective current draws, and c) direct each of the plurality of pump assemblies to individually adjust their operating speed. 2. The dispensing system of claim 1 , wherein the applicator further comprises: a supply channel configured to provide the adhesive to the plurality of pump assemblies; a recirculation channel configured to receive the adhesive from the plurality of pump assemblies and direct the adhesive to the supply channel; and a recirculation pump assembly configured to control flow of the adhesive through the recirculation channel. 3. The dispensing system of claim 2 , wherein the applicator further comprises: a plurality of pressure sensors each configured to measure a pressure of the adhesive pumped from a respective one of the plurality of pumps to a corresponding one of the plurality of dispensing modules, and send a signal to the controller that is representative of the pressure. 4. The dispensing system of claim 3 , wherein the applicator further comprises: a recirculation pressure sensor configured to measure a pressure of the adhesive flowing through the recirculation channel and send a signal to the controller that is representative of the pressure, wherein the controller is configured to determine an adjustment to an operating speed of the recirculation pump assembly so as to equalize the pressure measured by the recirculation pressure sensor and the pressures measured by the pressure sensors. 5. The dispensing system of claim 2 , wherein the controller is in signal communication with the recirculation pump assembly, the controller being further configured to measure current draw from the recirculation pump assembly and determine an adjustment to the operating speed of the recirculation pump assembly based on the current draw from the recirculation pump assembly. 6. The dispensing system of claim 5 , wherein the applicator further comprises a plurality of pump sensors and a recirculation pump sensor, wherein the plurality of pump sensors and the recirculation pump sensor are configured to measure motor torque and operating speed of the plurality of pump assemblies and recirculation pump assembly, respectively, and a pump pressure of the adhesive exiting the plurality of pump assemblies and the recirculation pump assembly, respectively. 7. The dispensing system of claim 1 , wherein each of the plurality of dispensing modules includes a valve stem that is configured to control flow of adhesive from the plurality of dispensing modules, the applicator further comprising: a plurality of position sensors, wherein each of the plurality of position sensors is configured to measure an instantaneous position of a respective one of the valve stems and send a position signal to the controller that is representative of the instantaneous position of the respective one of the valve stems, wherein the controller is configured to determine whether a defect exists in the dispensing system based on the instantaneous positions. 8. The dispensing system of claim 1 , wherein the applicator further comprises: a plurality of thermal elements for heating the adhesive; and a plurality of heat sensors, wherein each of the plurality of heat sensors is positioned adjacent a respective one of the plurality of thermal elements and in fluid communication with the adhesive, such that the plurality of thermal elements are configured to detect a temperature of the adhesive and transmit a heat signal to the controller that is representative of the temperature of the adhesive, wherein the controller is configured to determine a property of the adhesive based on the temperature of the adhesive. 9. The dispensing system of claim 1 , wherein the controller is configured to direct each of the plurality of pump assemblies to individually adjust their operating speeds when their respective current draws are outside a predetermined range. 10. The dispensing system of claim 9 , wherein the controller is configured to direct each of the plurality of pump assemblies to individually maintain their operating speeds when their respective current draws are within the predetermined range. 11. The dispensing system of claim 9 , wherein the controller includes a human-machine interface (HMI) device configured to produce an alert when the current draw of one of the plurality of pump assemblies is outside the predetermined range. 12. The dispensing system of claim 11 , wherein the HMI device is configured to receive a user input to manually select the predetermined range. 13. The dispensing system of claim 1 , further comprising: a melter configured to melt the adhesive and provide the adhesive to the applicator. 14. A method of controlling dispensing of adhesive from an applicator, comprising: pumping adhesive from a plurality of pump assemblies to a plurality of dispensing modules; measuring current draw from each of the plurality of pump assemblies; determining an adjustment to an operating speed of each of the plurality of pump assemblies individually based on their respective current draws; and adjusting the operating speed of each of the plurality of pump assemblies individually. 15. The method of claim 14 , further comprising: directing the adhesive through a supply channel to the plurality of pump assemblies; and pumping the adhesive from the plurality of dispensing modules through a recirculation channel and to the supply channel via a recirculation pump assembly. 16. The method of claim 15 , further comprising: measuring a recirculation pressure of the adhesive flowing through the recirculation channel; measuring a dispensing pressure of the adhesive flowing from each of the plurality of pump assemblies to the respective one of the plurality of dispensing modules; and adjusting an operating speed of the recirculation pump assembly so as to equalize the recirculation pressure with the dispensing pressure. 17. The method of claim 15 , further comprising: determining current draw from the recirculation pump assembly; determining an adjustment to an operating speed of the recirculation pump assembly based on the current draw; and adjusting the operating speed of the recirculation pump assembly. 18. The method of claim 17 , further comprising: measuring motor torque, operating speed, and pump pressure of the recirculation pump assembly, wherein determining the adjustment to the operating speed of the recirculation pump assembly includes determining the adjustment to the operating speed of the recirculation pump assembly based on the motor torque, operating speed, and pump pressure. 19. The method of claim 14 , further comprising: measuring motor torque, operating speed, and pump pressure of each of the plurality of pump assemblies, wherein determining the adjustment to the operating speed of each of the plurality of pump

Assignees

Inventors

Classifications

  • B05B9/0406Primary

    with several pumps · CPC title

  • of the gear type · CPC title

  • provided with a pump inside the receptacle to recirculate the material within the receptacle · CPC title

  • Recovery of excess liquid or other fluent material; Controlling means therefor · CPC title

  • Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves · CPC title

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What does patent US10695779B2 cover?
The present disclosure describes a method and system for controlling dispensing of adhesive from an applicator. The method includes pumping adhesive from a plurality of pump assemblies to a plurality of dispensing modules and measuring current draw from each of the plurality of pump assemblies. The method also includes determining an adjustment to an operating speed of each of the plurality of …
Who is the assignee on this patent?
Nordson Corp
What technology area does this patent fall under?
Primary CPC classification B05B9/0406. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jun 30 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).