Flux recovery device, and reflow apparatus and gas exchange method using the same

Patent metadata

Field	Value
Publication number	US-10695713-B2
Application number	US-201815866763-A
Country	US
Kind code	B2
Filing date	Jan 10, 2018
Priority date	Jan 30, 2017
Publication date	Jun 30, 2020
Grant date	Jun 30, 2020

Abstract

A flux recovery device recovers a vaporized flux being generated at a time of soldering an electronic circuit board on which electronic components are placed. The flux recovery device includes a first pipe, a dust collector, and a current controller. The first pipe causes gas including the vaporized flux to pass to the flux recovery device. The dust collector solidifies the vaporized flux passed through the first pipe and collects dust, by a plasma discharge. The current controller performs a constant current control of the plasma discharge.

First claim

What is claimed is:

1. A flux recovery device which recovers vaporized flux being generated at a time of soldering an electronic circuit board on which electronic components are placed, the device comprising:
a first pipe which causes gas including the vaporized flux to pass to the flux recovery device;
a dust collector that solidifies the vaporized flux passed through the first pipe and collects dust, by a plasma discharge; and
a current controller that performs a constant current control of the plasma discharge.

2. A reflow apparatus comprising the flux recovery device of claim 1 .

3. The flux recovery device of claim 1 ,
wherein the dust collector comprising a first dust collector and a second dust collector;
wherein the first dust collector is configured to generate negative ions and
the second dust collector is configured to generate positive ions.

4. The flux recovery device of claim 1 ,
further comprising of a discharge controller that controls a discharge amount of the plasma discharge.

5. A flux recovery device which recovers vaporized flux being generated inside a reflow furnace at a time of soldering an electronic circuit board on which electronic components are placed, the device comprising:
a first pipe which causes gas including the vaporized flux to pass to the flux recovery device;
a dust collector that solidifies the vaporized flux passed through the first pipe and collects dust, by a plasma discharge; and
a discharge controller that controls a discharge amount of the plasma discharge.

6. The flux recovery device of claim 5 ,
wherein the discharge controller causes the discharge amount to be increased in proportion to increase of the number of the electronic circuit boards which are processed inside the reflow furnace.

7. The flux recovery device of claim 5 ,
wherein the discharge controller causes the discharge amount to be increased in proportion to an elapse of an operation time of the reflow furnace.

8. A reflow apparatus comprising the flux recovery device of claim 5 .

9. The flux recovery device of claim 5 ,
wherein the dust collector comprising a first dust collector and a second dust collector;
wherein the first dust collector is configured to generate negative ions and
the second dust collector is configured to generate positive ions.

Assignees

• Panasonic Ip Man Co Ltd

Inventors

• Mizuoka Seiji
• Endo Takahiro
• Suzuki Yasuhiro

Classifications

• B03C2201/10

  Ionising electrode with two or more serrated ends or sides · CPC title

• B03C2201/06

  Ionising electrode being a needle · CPC title

• B03C3/41

  Ionising-electrodes · CPC title

• B03C3/025

  Combinations of electrostatic separators, e.g. in parallel or in series, stacked separators or dry-wet separator combinations · CPC title

• B03C3/47

  flat, e.g. plates, discs, gratings · CPC title