Wickless capillary driven constrained vapor bubble heat pipes for application in electronic devices with various system platforms

Patent metadata

Field	Value
Publication number	US-10694641-B2
Application number	US-201615392589-A
Country	US
Kind code	B2
Filing date	Dec 28, 2016
Priority date	Apr 29, 2016
Publication date	Jun 23, 2020
Grant date	Jun 23, 2020

Abstract

A system and method for providing and using wickless capillary driven constrained vapor bubble heat pipes for application in electronic devices with various system platforms are disclosed. An example embodiment includes: a substrate; and a plurality of wickless capillary driven constrained vapor bubble heat pipes embedded in the substrate, each wickless capillary driven constrained vapor bubble heat pipe including a body having a capillary therein with generally square corners and a high energy interior surface, and a highly wettable liquid partially filling the capillary to dissipate heat between an evaporator region and a condenser region.

First claim

What is claimed is:

1. An apparatus comprising:
a substrate including:
a first channel;
a second channel, the first channel substantially parallel to the second channel; and
a third channel, the third channel substantially orthogonal to the second channel;

a first wickless capillary driven constrained vapor bubble heat pipe embedded in the first channel, the first wickless capillary driven constrained vapor bubble heat pipe including a first capillary, the first capillary including:
a first curved wall;
a first linear wall directly coupled to the first curved wall;
a second curved wall;
a second linear wall directly coupled to the second curved wall and the second linear wall directly coupled to the first linear wall;
a first substantially square corner formed by the first linear wall and the second linear wall;
a third linear wall directly coupled to the second curved wall;
a third curved wall;
a fourth linear wall directly coupled to the third curved wall and the fourth linear wall directly coupled to the third linear wall; and
a second substantially square corner formed by the third linear wall and the fourth linear wall; and
a first amount of a liquid partially filling the first capillary to dissipate heat;

a second wickless capillary driven constrained vapor bubble heat pipe embedded in the second channel, the second wickless capillary driven constrained vapor bubble heat pipe including a second capillary with substantially square corners and a second amount of the liquid partially filling the second capillary to dissipate the heat; and
a third wickless capillary driven constrained vapor bubble heat pipe embedded in the third channel, the third wickless capillary driven constrained vapor bubble heat pipe including a third capillary with substantially square corners and a third amount of the liquid partially filling the third capillary to dissipate the heat.

2. The apparatus of claim 1 , wherein the substrate includes at least one of a printed circuit board (PCB), an electronic circuit board, a motherboard, a circuit board with embedded integrated circuit (IC) devices, a circuit board with embedded semiconductor or silicon devices, a chassis, a housing, an enclosure, or a support structure of an electronic device.

3. The apparatus of claim 1 , wherein the first wickless capillary driven constrained vapor bubble heat pipe and the second wickless capillary driven constrained vapor bubble heat pipe are embedded in the substrate in a substantially cross-pattern orientation.

4. An apparatus comprising:
a substrate;
a first means for dissipating heat, the first means embedded in the substrate; and
a second means for dissipating the heat, the second means embedded in the substrate substantially orthogonal to the first means, respective ones of the first and second means including an in-built channel,
the in-built channel including:
a first curved wall;
a first linear wall directly coupled to the first curved wall;
a second curved wall;
a second linear wall directly coupled to the second curved wall and the second linear wall directly coupled to the first linear wall;
a first substantially square corner formed by the first linear wall and the second linear wall;
a third linear wall directly coupled to the second curved wall;
a third curved wall;
a fourth linear wall directly coupled to the third curved wall and the fourth linear wall directly coupled to the third linear wall;
a second substantially square corner formed by the third linear wall and the fourth linear wall; and
a fluid partially filling the in-built channel to dissipate the heat between an evaporator region and a condenser region of the in-built channel.

5. The apparatus of claim 4 , wherein the substrate includes at least one of a printed circuit board (PCB), an electronic circuit board, a motherboard, a circuit board with embedded integrated circuit (IC) devices, a circuit board with embedded semiconductor or silicon devices, a chassis, a housing, an enclosure, or a support structure of an electronic device.

6. The apparatus of claim 4 , wherein the substrate has a first axis and a second axis orthogonal to the first axis, the first and second means embedded in the substrate in a substantially orthogonal orientation relative to one of the first axis or the second axis.

7. The apparatus of claim 4 , wherein the first and second means are embedded in the substrate in a substantially radial orientation.

8. The apparatus of claim 4 , wherein at least one of the first and second heat means are embedded in the substrate in a substantially cross-pattern orientation.

9. A method comprising:
fabricating an electronic circuit into a substrate, the substrate including a first axis and a second axis, the second axis orthogonal to the first axis;
forming a first channel in the substrate substantially orthogonally to the second axis;
forming a second channel in the substrate substantially orthogonally to the second axis;
forming a third channel in the substrate substantially orthogonally to the first axis;
fabricating a first wickless capillary driven constrained vapor bubble heat pipe into the first channel, the first wickless capillary driven constrained vapor bubble heat pipe including a first capillary, the first capillary including:
a first curved wall;
a first linear wall directly coupled to the first curved wall;
a second curved wall;
a second linear wall directly coupled to the second curved wall and the second linear wall directly coupled to the first linear wall;
a first substantially square corner formed by the first linear wall and the second linear wall;
a third linear wall directly coupled to the second curved wall;
a third curved wall;
a fourth linear wall directly coupled to the third curved wall and the fourth linear wall directly coupled to the third linear wall; and
a second substantially square corner formed by the third linear wall and the fourth linear wall, the first capillary to include a first amount of a liquid to partially fill the first capillary to dissipate heat;

fabricating a second wickless capillary driven constrained vapor bubble heat pipe into the second channel, the second wickless capillary driven constrained vapor bubble heat pipe including a second capillary with substantially square corners, the second capillary to include a second amount of the liquid to partially fill the second capillary to dissipate the heat; and
fabricating a third wickless capillary driven constrained vapor bubble heat pipe into the third channel, the third wickless capillary driven constrained vapor bubble heat pipe including a third capillary therein with substantially square corners, the third capillary to include a third amount of the liquid to partially fill the third capillary to dissipate the heat.

10. The method of claim 9 , wherein the substrate includes at least one of a printed circuit board (PCB), an electronic circuit board, a motherboard, a circuit board with embedded integrated circuit (IC) devices, a circuit board with embedded semiconductor or silicon devices, a chassis, a housing, an enclosure, or a support structure of an electronic device.

11. The method of claim 9 , wherein the first, second, and third wickless capillary driven constrained vapor bubble heat pipes are embedded in the substrate using a chemical etching process.

12. The method of claim 9 , wherein the first, second, and third wickless capillary driven constrained vapor bubble heat pipes are embedded in the substrate using a mechanical subtraction process.

13. The method of claim 9 , further including:
filling the first capillary with the first a

Assignees

• Intel Corp

Inventors

• Basu Sumita
• Kulkarni Shantanu D
• Ghosh Prosenjit
• Kouliachev Konstantin I

Classifications

• H10W70/614

  the multiple chips being integrally enclosed · CPC title

• H10W70/05

  of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04) · CPC title

• H10W70/02

  of conductive package substrates serving as an interconnection, e.g. of metal plates (manufacture or treatment of leadframes H10W70/04) · CPC title

• H10W40/73

  for cooling by change of state · CPC title

• H05K7/20336 Primary

  Heat pipes, e.g. wicks or capillary pumps · CPC title