Fiber encapsulation mechanism for energy dissipation in a fiber amplifying system

US10693272B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10693272-B2
Application numberUS-201715691917-A
CountryUS
Kind codeB2
Filing dateAug 31, 2017
Priority dateOct 17, 2016
Publication dateJun 23, 2020
Grant dateJun 23, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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Abstract

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The present disclosure relates to a fiber encapsulation mechanism for energy dissipation in a fiber amplifying system. One example embodiment includes an optical fiber amplifier. The optical fiber amplifier includes an optical fiber that includes a gain medium, as well as a polymer layer that at least partially surrounds the optical fiber. The polymer layer is optically transparent. In addition, the optical fiber amplifier includes a pump source. Optical pumping by the pump source amplifies optical signals in the optical fiber and generates excess heat and excess photons. The optical fiber amplifier additionally includes a heatsink layer disposed adjacent to the polymer layer. The heatsink layer conducts the excess heat away from the optical fiber. Further, the optical fiber amplifier includes an optically transparent layer disposed adjacent to the polymer layer. The optically transparent layer transmits the excess photons away from the optical fiber.

First claim

Opening claim text (preview).

What is claimed: 1. An optical fiber amplifier, comprising: an optical fiber comprising a gain medium; a polymer layer that at least partially surrounds the optical fiber, wherein the polymer layer is optically transparent; a pump source configured to optically pump the optical fiber, wherein optical pumping by the pump source amplifies optical signals in a wavelength range transmitted through the gain medium of the optical fiber and generates excess heat and excess photons; a heatsink layer disposed adjacent to the polymer layer, wherein the heatsink layer conducts the excess heat away from the optical fiber; and an optically transparent layer disposed adjacent to the polymer layer opposite the heatsink layer, wherein the optically transparent layer transmits the excess photons away from the optical fiber, and wherein the optically transparent layer defines a minimum distance from the optical fiber at which the excess photons are absorbable. 2. The optical fiber amplifier of claim 1 , wherein the optical fiber comprises a core that includes the gain medium and a cladding layer that surrounds the core. 3. The optical fiber amplifier of claim 2 , wherein at least a portion of the optical fiber comprises a second cladding layer that surrounds the cladding layer. 4. The optical fiber amplifier of claim 1 , wherein the gain medium comprises erbium or ytterbium. 5. The optical fiber amplifier of claim 1 , wherein the wavelength range includes 1.55 μm, 1.05 μm, or 900 nm. 6. The optical fiber amplifier of claim 1 , wherein the polymer layer comprises a polymer material and an additional material, and wherein the additional material increases a thermal conductivity of the polymer layer. 7. The optical fiber amplifier of claim 6 , wherein the additional material comprises a binary salt of fluoride. 8. The optical fiber amplifier of claim 6 , wherein the additional material does not substantially decrease the optical transparency of the polymer layer. 9. The optical fiber amplifier of claim 1 , further comprising a passive optical fiber that is joined to the optical fiber comprising the gain medium at a fusion splice. 10. The optical fiber amplifier of claim 9 , wherein the polymer layer surrounds the fusion splice. 11. The optical fiber amplifier of claim 1 , wherein the polymer layer can withstand temperatures up to 200 degrees Celsius. 12. The optical fiber amplifier of claim 1 , wherein the polymer layer has a refractive index between 1.37 and 1.40. 13. The optical fiber amplifier of claim 1 , wherein the optically transparent layer comprises glass. 14. The optical fiber amplifier of claim 1 , wherein the optical fiber amplifier is a transmitting component of a light detection and ranging (LIDAR) system, and wherein the optical signals are scattered by objects within a scene and detected by a receiver of the LIDAR system to analyze the scene. 15. The optical fiber amplifier of claim 1 , wherein the optical fiber is less than 2 meters in length. 16. The optical fiber amplifier of claim 1 , further comprising an absorptive material disposed adjacent to a top surface of the optically transparent layer. 17. The optical fiber amplifier of claim 1 , wherein the optically transparent layer further mechanically protects the polymer layer from damage. 18. The optical fiber amplifier of claim 1 , further comprising a pulsed seed laser, wherein the pulsed seed laser seeds the optical fiber with the optical signals in the wavelength range. 19. A method, comprising: optically pumping, by a pump source, an optical fiber comprising a gain medium, wherein optically pumping by the pump source amplifies optical signals in a wavelength range transmitted through the gain medium of the optical fiber and generates excess heat and excess photons; transmitting, to a polymer layer that at least partially surrounds the optical fiber, the excess heat and the excess photons, wherein the polymer layer is optically transparent; conducting, by a heatsink layer disposed adjacent to the polymer layer, the excess heat away from the optical fiber; and conducting, by an optically transparent layer disposed adjacent to the polymer layer opposite the heatsink layer, the excess photons away from the optical fiber, wherein the optically transparent layer defines a minimum distance from the optical fiber at which the excess photons are absorbable. 20. A method of assembling an optical fiber amplifier, comprising: connecting an output end of a pump source to an input end of an optical fiber, wherein the optical fiber comprises a gain medium, wherein the pump source is configured to optically pump the optical fiber to amplify optical signals in a wavelength range transmitted through the gain medium of the optical fiber, and wherein optically pumping the optical fiber to amplify optical signals generates excess heat and excess photons; placing at least a portion of the optical fiber adjacent to a heatsink layer, wherein the heatsink layer conducts the excess heat away from the optical fiber; surrounding the portion of the optical fiber adjacent to the heatsink layer with a polymer layer, wherein the polymer layer is optically transparent; and placing an optically transparent layer adjacent to the polymer layer opposite the heatsink layer, wherein the optically transparent layer transmits the excess photons away from the optical fiber, and wherein the optically transparent layer defines a minimum distance from the optical fiber at which the excess photons are absorbable. 21. The method of claim 20 , further comprising: curing the polymer layer so the polymer layer undergoes a phase change from a liquid to a solid and adheres to the optical fiber, the heatsink layer, and the optically transparent layer.

Assignees

Inventors

Classifications

  • Anti-reflection devices, e.g. optical isolaters (absorbing layers for marking or protecting purposes in laser working B23K26/50; magneto-optical non-reciprocal devices G02F1/093, G02F1/0955) · CPC title

  • Multi-mode pumping · CPC title

  • Transverse or lateral modes · CPC title

  • Housings; Packages · CPC title

  • Suppression of nonlinear conversion, e.g. specific design to suppress for example stimulated brillouin scattering [SBS], mainly in optical fibres in combination with multimode pumping · CPC title

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What does patent US10693272B2 cover?
The present disclosure relates to a fiber encapsulation mechanism for energy dissipation in a fiber amplifying system. One example embodiment includes an optical fiber amplifier. The optical fiber amplifier includes an optical fiber that includes a gain medium, as well as a polymer layer that at least partially surrounds the optical fiber. The polymer layer is optically transparent. In addition…
Who is the assignee on this patent?
Waymo Llc
What technology area does this patent fall under?
Primary CPC classification H01S3/0405. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jun 23 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 7 related publications on this page (citations in our corpus or others sharing the same primary CPC).