Barrier assembly

US10693024B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10693024-B2
Application numberUS-201816017128-A
CountryUS
Kind codeB2
Filing dateJun 25, 2018
Priority dateJul 2, 2010
Publication dateJun 23, 2020
Grant dateJun 23, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An assembly that includes a barrier film interposed between a first polymeric film substrate and a first major surface of a pressure sensitive adhesive layer is provided. The first polymeric film substrate has a first coefficient of thermal expansion that is, in some embodiments, up to 50 parts per million per Kelvin. The pressure sensitive adhesive layer has a second major surface opposite the first major surface that is disposed on a second polymeric film substrate. The second polymeric film substrate is typically resistant to degradation by ultraviolet light. In some embodiments, the second polymeric film substrate has a second coefficient of thermal expansion that is at least 40 parts per million per Kelvin higher than the first coefficient of thermal expansion. The assembly is transmissive to visible and infrared light.

First claim

Opening claim text (preview).

What is claimed is: 1. An assembly comprising, in order: a first polymeric film substrate; a barrier film comprising at least first and second polymer layers separated by an inorganic barrier layer that is immediately adjacent to both the first and second polymer layers, the first and second polymer layers each comprising a polymeric reaction product of at least one of acrylic or methacrylic monomers; an acrylic pressure sensitive adhesive layer; and a second polymeric film substrate comprising a fluoropolymer and in direct contact with the acrylic pressure sensitive adhesive layer. 2. The assembly of claim 1 , wherein the acrylic pressure sensitive adhesive comprises an ultraviolet absorber (UVA). 3. The assembly of claim 1 , wherein the first polymeric layer is non-heat stabilized. 4. The assembly of claim 1 , wherein the barrier film has a water vapor transmission rate less than 0.005 g/m 2 /day at 50° C. and 100% relative humidity. 5. The assembly of claim 4 , wherein the barrier film has an oxygen transmission rate less than 0.005 g/m 2 /day at 23° C. and 90% relative humidity. 6. The assembly of claim 1 , wherein the assembly is transmissive to visible and infrared light, and wherein the second polymeric film substrate is resistant to degradation by ultraviolet light. 7. The assembly of claim 1 , wherein a ratio of the thickness of the first polymeric film to the second polymeric film is at least 5:2. 8. The assembly of claim 1 , wherein the acrylic pressure sensitive adhesive layer has a tensile modulus of up to 3.4×10 8 Pascals. 9. The assembly of claim 1 having a curl of up to 7 m −1 . 10. The assembly of claim 1 , wherein the inorganic barrier layer is an oxide layer that shares a siloxane bond with at least one of the first or second polymer layers. 11. The assembly of claim 1 , wherein the first polymeric film substrate comprises at least one of polyethylene terephthalate, polyethylene naphthalate, polyetheretherketone, polyaryletherketone, polyarylate, polyetherimide, polyarylsulfone, polyethersulfone, polyamideimide, or polyimide. 12. The assembly of claim 1 , wherein a ratio of a tensile modulus of the first polymeric film substrate to a tensile modulus of the second polymeric film substrate is at least 2 to 1. 13. The assembly of claim 1 , wherein at least one of the first or second polymer layers comprises a silane and a polymer comprising an acrylate monomer. 14. The assembly of claim 13 , wherein the silane is an amino silane represented by formula Z 2 N-L-SiY x Y′ 3-x , wherein each Z is independently hydrogen or alkyl having up to 12 carbon atoms, L is alkylene having up to 12 carbon atoms, Y is alkoxy having up to 12 carbon atoms or halogen, Y′ is alkyl having up to 12 carbon atoms, and x is at least 1. 15. The assembly of claim 1 , wherein the first and second polymeric film substrates have first and second coefficients of thermal expansion respectively, wherein the second coefficient is at least 40 parts per million per Kelvin higher than the first coefficient. 16. The assembly of claim 1 , wherein the assembly has an average transmission over the range of 400 nm to 1400 nm of at least 75%. 17. The assembly of claim 1 , wherein the first and second polymer layers each further comprise polymerized volatilizable acrylic or methacrylic monomers.

Assignees

Inventors

Classifications

  • Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules · CPC title

  • H10F19/804Primary

    Materials of encapsulations · CPC title

  • Thermal properties · CPC title

  • Optical properties · CPC title

  • Mechanical properties · CPC title

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What does patent US10693024B2 cover?
An assembly that includes a barrier film interposed between a first polymeric film substrate and a first major surface of a pressure sensitive adhesive layer is provided. The first polymeric film substrate has a first coefficient of thermal expansion that is, in some embodiments, up to 50 parts per million per Kelvin. The pressure sensitive adhesive layer has a second major surface opposite the…
Who is the assignee on this patent?
3M Innovative Properties Co
What technology area does this patent fall under?
Primary CPC classification H10F19/804. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jun 23 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).