Method for manufacturing wiring board and wiring board

Patent metadata

Field	Value
Publication number	US-10691270-B2
Application number	US-201616066021-A
Country	US
Kind code	B2
Filing date	Dec 22, 2016
Priority date	Dec 24, 2015
Publication date	Jun 23, 2020
Grant date	Jun 23, 2020

Abstract

A method is provided for manufacturing a wiring board that includes a conductor part including a first line and a second line wider than the first line. The method includes: a first process of forming the first line and a boundary line corresponding to at least a portion of an outline of the second line near the first line; and a second process of forming a remaining portion of the second line.

First claim

The invention claimed is:

1. A method of manufacturing a wiring board that comprises a base and a conductor part that is disposed on the base and that includes a first line and a second line wider than the first line, the method comprising:
forming the conductor part by:
a first process of forming, on the base, the first line and at least a portion of an outline of the second line near the first line; and
a second process of forming, on the base, a remaining portion of the second line,

wherein the first line and the second line are adjacent to and insulated each other, and
wherein the second process is performed after the first process.

2. The method of manufacturing the wiring board according to claim 1 ,
wherein the first line, the portion of the outline, and the remaining portion satisfy the following Formula (1):
H 2 <H 3   (1),

wherein H 2 is a height of the portion of the outline and H 3 is a height of the remaining portion in the Formula (1).

3. The method of manufacturing the wiring board according to claim 1 , wherein the second process includes overlapping a part of the remaining portion of the second line with the portion of the outline in plan view.

4. The method of manufacturing the wiring board according to claim 1 , wherein the portion of the outline corresponds to the whole of the outline.

5. The method of manufacturing the wiring board according to claim 1 , wherein the first line and the portion of the outline satisfy the following Formula (2):
W 1 <W 2   (2), and

wherein W 1 is a width of the first line and W 2 is a width of the portion of the outline in the Formula (2).

6. The method of manufacturing the wiring board according to claim 1 , wherein the portion of the outline includes linear patterns extending adjacent to each other.

7. The method of manufacturing the wiring board according to claim 1 ,
wherein the second line includes a mesh portion surrounded by the outline and formed into a mesh shape, and
the method of manufacturing the wiring board further comprises forming the mesh portion before the second process.

Assignees

• Fujikura Ltd

Inventors

• Aoshima Shinsuke
• Koshimizu Kazutoshi

Classifications

• G06F3/04164 Primary

  Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads · CPC title

• G06F3/044 Primary

  by capacitive means · CPC title

• G06F2203/04103

  Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices · CPC title

• H05K3/1241

  by ink-jet printing or drawing by dispensing · CPC title

• H05K2201/09681

  Mesh conductors, e.g. as a ground plane · CPC title