Reaction force diversion mechanism, motor device and photolithography machine

US10691025B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10691025-B2
Application numberUS-201816024200-A
CountryUS
Kind codeB2
Filing dateJun 29, 2018
Priority dateJun 30, 2017
Publication dateJun 23, 2020
Grant dateJun 23, 2020

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  1. Title

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  2. Abstract

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A reaction force diversion mechanism, a motor device and a photolithography machine are disclosed. The photolithography machine includes an illumination unit, a mask stage, a projection objective, a main baseplate, a wafer stage and a main carrier frame. The illumination unit and the mask stage are disposed above the main baseplate, and the main carrier frame is arranged above a ground base. Both of the wafer stage and the main baseplate are supported on the main carrier frame, and vibration dampers are deployed between the main carrier frame and the ground base. Reaction force diversion mechanisms are disposed between the wafer stage and the ground base and between the mask stage and the ground base. The reaction force diversion mechanisms can divert reaction forces generated from movement of the two motion stages onto the ground base while blocking vibration propagating from the ground base toward the motion stages.

First claim

Opening claim text (preview).

What is claimed is: 1. A photolithography machine, comprising an illumination unit, a mask stage, a projection objective, a main baseplate, a wafer stage and a main carrier frame, the illumination unit and the mask stage both disposed above the main baseplate, the projection objective disposed between the mask stage and the wafer stage, the main carrier frame disposed above a ground base, the wafer stage and the main baseplate both disposed above the main carrier frame, the main carrier frame and the ground base interposed with vibration dampers, the wafer stage and/or the mask stage and the ground base interposed with reaction force diversion mechanism(s) configured to reduce vibration from the wafer stage and/or the mask stage and isolate vibration from the ground base, wherein the illumination unit is disposed on an illumination-unit support that is provided on the main baseplate, wherein a vibration absorber is provided on a side of the illumination-unit support, wherein the vibration absorber comprises a support plate, a vibration-absorbing block and a damping member, the support plate fixed to the side of the illumination-unit support in a horizontal orientation, the damping member closely abutting the side of the illumination-unit support, the vibration-absorbing block supported at a bottom on the support plate via jackscrews, the vibration-absorbing block laterally brought into close contact with the side of the illumination-unit support by virtue of preload screws, springs and the damping member. 2. The photolithography machine according to claim 1 , wherein the mask stage is disposed on a mask-stage support that is provided on the main baseplate. 3. The photolithography machine according to claim 2 , wherein a mask stage measuring system is further provided on the mask-stage support. 4. The photolithography machine according to claim 1 , wherein one reaction force diversion mechanism is connected to the mask stage and disposed on one side thereof in a first horizontal direction. 5. The photolithography machine according to claim 4 , wherein two reaction force diversion mechanisms are connected to the wafer stage and disposed on one side thereof in a second horizontal direction. 6. The photolithography machine according to claim 1 , wherein a measuring system for the wafer stage is further provided on the main baseplate. 7. The photolithography machine according to claim 1 , wherein each of the reaction force diversion mechanism(s) comprises a support in connection with the ground base. 8. The photolithography machine according to claim 7 , further comprising a wafer-stage motor in connection with the wafer stage and a mask-stage motor in connection with the mask stage, wherein each of the reaction force diversion mechanism(s) has a first end connected to the wafer-stage motor or the mask-stage motor and a second end connected to the ground base. 9. The photolithography machine according to claim 8 , wherein each of the reaction force diversion mechanism(s) further comprises a support connector, a decoupler, a reaction force attenuator and a vibration source connector, the support connector in connection with the support, the vibration source connector in connection with the wafer-stage motor or the mask-stage motor, the decoupler disposed between the support connector and the reaction force attenuator, the decoupler configured to isolate vibration from the ground base. 10. The photolithography machine according to claim 9 wherein the reaction force attenuator comprises a connecting block, reaction force diversion dampers, a reaction force diversion spring and a connecting arm, the connecting block in connection with the support connector, each of the reaction force diversion dampers having a first end connected to the connecting block and a second end connected to the vibration source connector, the reaction force diversion spring having a first end connected to the connecting block and a second end connected to a first end of the connecting arm, a second end of the connecting arm in connection with the vibration source connector. 11. The photolithography machine according to claim 10 , wherein the reaction force diversion spring is connected to the connecting block via a spring guide post. 12. The photolithography machine according to claim 10 , wherein the reaction force diversion spring is connected to the first end of the connecting arm via a preload mount.

Assignees

Inventors

Classifications

  • Assembly, maintenance, transport or storage of apparatus · CPC title

  • Vibration, e.g. vibration detection, compensation, suppression or isolation · CPC title

  • Reaction force control means, e.g. countermass · CPC title

  • Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving · CPC title

  • Stages · CPC title

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What does patent US10691025B2 cover?
A reaction force diversion mechanism, a motor device and a photolithography machine are disclosed. The photolithography machine includes an illumination unit, a mask stage, a projection objective, a main baseplate, a wafer stage and a main carrier frame. The illumination unit and the mask stage are disposed above the main baseplate, and the main carrier frame is arranged above a ground base. Bo…
Who is the assignee on this patent?
Shanghai Micro Electronics Equipment Group Co Ltd
What technology area does this patent fall under?
Primary CPC classification G03F7/70975. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Jun 23 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).