Window deposition apparatus
US-2024307909-A1 · Sep 19, 2024 · US
US10689750B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10689750-B2 |
| Application number | US-201615215170-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 20, 2016 |
| Priority date | Jul 24, 2015 |
| Publication date | Jun 23, 2020 |
| Grant date | Jun 23, 2020 |
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An evaporator body for a PVD coating system comprises a basic body and an evaporator surface, to which a titanium dihydride layer is applied. A titanium hydride layer comprises an organic carrier agent and titanium hydride as the single inorganic solid. The thickness of the layer is less than or equal to 10 μm.
Opening claim text (preview).
The invention claimed is: 1. A method for producing an evaporator body for a PVD coating system with a basic body and an evaporator surface on the basic body, which comprises the following steps: providing a suspension of titanium hydride and an organic carrier agent in an organic solvent; and applying the suspension onto the evaporator surface while forming a titanium hydride layer, in which titanium hydride is present as the only inorganic solid; wherein the titanium hydride layer is formed in a thickness of no more than 10μ; and heating the evaporator body to melt aluminum in contact with the titanium hydride layer to form a Ti—Al wetting layer. 2. The method according to claim 1 , wherein the suspension is applied by means of a print process. 3. The method according to claim 1 , wherein the suspension contains titanium hydride in a portion of about 5 to 15% by weight in relation to the total weight of the suspension. 4. The method according to claim 1 , wherein the suspension is applied with a coating weight of 1 to 5 mg per cm 2 onto the evaporator surface. 5. The method according to claim 1 , in which the evaporator body is heated to a temperature greater than 1000° C. 6. The method according to claim 5 , wherein the basic body is heated to a temperature ranging from a 1400 to 1700° C. 7. The method according to claim 1 , wherein the suspension comprises a varnish. 8. The method according to claim 1 , wherein the Ti—Al wetting layer is bonded to the base body via an intermediate layer comprising titanium diboride and titanium nitride. 9. The method according to claim 1 , wherein the organic carrier agent comprising a synthetic resin. 10. The method of claim 1 , wherein the Ti—Al layer is of formula TiA 3 . 11. The method of claim 10 , wherein the Ti—Al layer further comprises Ti x Al y phases. 12. The method of claim 1 , wherein the thickness of the titanium hydride layer is 2-8 μm. 13. The method of claim 1 , wherein the thickness of the titanium hydride layer is 4-6 μm.
including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates · CPC title
Replenishment of source material · CPC title
Evaporation for physical or chemical purposes; Evaporation apparatus therefor, e.g. evaporation of liquids for gas phase reactions · CPC title
comprising aluminium or copper {(B32B15/016 and B32B15/017 take precedence)} · CPC title
Composite [nonstructural laminate] · CPC title
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