Devices with low melting point alloy for control of device flexibility

Patent metadata

Field	Value
Publication number	US-10688656-B2
Application number	US-201615091822-A
Country	US
Kind code	B2
Filing date	Apr 6, 2016
Priority date	Apr 27, 2015
Publication date	Jun 23, 2020
Grant date	Jun 23, 2020

Abstract

A continuum device/manipulator includes a first flexible tube, a low melting point (LMP) alloy disposed within the first flexible tube, and a temperature adjustment element that applies heat or cooling to change a phase of the LMP alloy. Changing the phase of the LMP alloy controls a flexibility of the first flexible tube.

First claim

What is claimed is:

1. A continuum device/manipulator comprising:
a first flexible tube;
a second flexible tube disposed within an inner opening of the first flexible tube;
a low melting point (LMP) alloy disposed between the first flexible tube and the second flexible tube; and
a temperature adjustment element comprising a helical spring, the temperature adjustment element being configured to apply heating to temperatures above a melting point of the LMP alloy or cooling to temperatures below the melting point of the LMP alloy to change a phase of the LMP alloy, wherein changing the phase of the LMP alloy controls a flexibility of the continuum device/manipulator by changing the LMP alloy between a liquid state and a solid state, the helical spring being coiled around the second flexible tube;
a plurality of wires comprising at least three wires and electrically connected to the helical spring to form electrically controllable segments between electrical connections of the plurality of wires to the helical spring, each wire of the plurality of wires being electrically connected to the helical spring at a different location on the helical spring; and
a controller configured to control a temperature of the temperature adjustment element at each segment by selectively energizing the wires of the plurality of wires;
wherein the helical spring, the plurality of wires, and the electrical connections between the plurality of wires are disposed between the first flexible tube and the second flexible tube and are embedded within and surrounded by the LMP alloy.

2. The continuum device/manipulator of claim 1 , wherein the helical spring is configured to operate as a resistive flexible heater by passing an electric current through the helical spring, and
wherein the LMP alloy is disposed in a space formed by an inner surface of the first flexible tube and an outer surface of the second flexible tube.

3. The continuum device/manipulator of claim 1 , further comprising a power supply electrically connected to the plurality of wires.

4. The continuum device/manipulator of claim 1 , wherein the temperature adjustment element comprises a coolant pump configured to cause coolant to flow through the second flexible tube or through a cooling tube.

5. The continuum device/manipulator of claim 1 , further comprising: one or more non-continuum segments.

6. The continuum device/manipulator of claim 1 , further comprising a motorized joint comprising a motor disposed at a joint of the continuum device/manipulator.

7. The continuum device/manipulator of claim 1 , further comprising: a grasper disposed at a distal end of the first flexible tube.

8. The continuum device/manipulator of claim 1 , wherein the second flexible tube comprises an opening that forms a lumen of the continuum device/manipulator, the lumen being configured to provide passage for items from a proximal end to a distal end of the continuum device/manipulator.

9. The continuum device/manipulator of claim 1 , further comprising a cooling tube disposed within the LMP alloy.

10. The continuum device/manipulator of claim 1 , wherein the LMP alloy has a melting point at sixty-two degrees Celsius.

11. The continuum device/manipulator of claim 1 , wherein the LMP alloy comprises bismuth, indium, and tin.

12. The continuum device/manipulator of claim 1 , further comprising steering wires anchored between a collar and an end of the continuum device/manipulator and configured to actuate to bend the continuum device/manipulator when positioning at least one segment adjacent to the LMP alloy that is not in a solid state, the steering wires being formed of a shape memory alloy.

13. The continuum device/manipulator of claim 12 , wherein the shape memory alloy is Nitinol.

14. The continuum device/manipulator of claim 1 , wherein the first flexible tube is helically disposed around the second flexible tube.

15. The continuum device/manipulator of claim 1 , wherein the first flexible tube comprises a lattice disposed around the second flexible tube.

16. The continuum device/manipulator of claim 1 , further comprising a cutter configured to perform a cutting operation at a distal end of the second flexible tube.

17. The continuum device/manipulator of claim 16 , wherein the cutter is configured to pass through the second flexible tube.

18. An apparatus comprising:
a first flexible tube;
a second flexible tube disposed within an inner opening of the first flexible tube;
a low melting point (LMP) alloy disposed between the first flexible tube and the second flexible tube; and
a temperature adjustment element configured to apply heating to temperatures above a melting point of the LMP alloy or cooling to temperatures below the melting point of the LMP alloy to change a phase of the LMP alloy, wherein changing the phase of the LMP alloy controls a flexibility of the continuum device/manipulator by changing the LMP alloy between a liquid state and a solid state;
wherein the temperature adjustment element comprises a cooling tube coiled around the second flexible tube and configured to pass coolant or hot fluid through the cooling tube;
wherein the temperature adjustment element comprises a helical spring coiled around the second flexible tube;
wherein the apparatus further comprises a plurality of wires comprising at least three wires electrically connected to the helical spring to form electrically controllable segments of the helical spring, each wire of the plurality of wires being electrically connected to the helical spring at a different location on the helical spring; and
a controller configured to control a temperature of the temperature adjustment element at each segment by selectively energizing the wires of the plurality of wires;
wherein the helical spring, the plurality of wires, the electrical connections between the plurality of wires, and the cooling tube are disposed between the first flexible tube and the second flexible tube and are embedded within and surrounded by the LMP alloy.

Assignees

• Univ Johns Hopkins

Inventors

• Alambeigi Farshid
• Seifabadi Reza
• Armand Mehran

Classifications

• B25J15/00

  Gripping heads {and other end effectors (grippers used in machine tools B23Q7/04; gripping members fitted on cranes B66C1/42, B66C1/44; gripping means used for mounting electrical components H05K13/04; gripping means used in the manufacture of semiconductors H10P72/7602)} · CPC title

• B25J18/06

  flexible · CPC title

• B25J9/065

  Snake robots · CPC title

• B25J15/12

  with flexible finger members · CPC title

• B25J9/1095

  chemically actuated · CPC title