Component chuck device and component mounting device

Patent metadata

Field	Value
Publication number	US-10687450-B2
Application number	US-201515761236-A
Country	US
Kind code	B2
Filing date	Sep 29, 2015
Priority date	Sep 29, 2015
Publication date	Jun 16, 2020
Grant date	Jun 16, 2020

Abstract

A component chuck device moves a pusher member downward when negative pressure is supplied, and holds a posture of a component by causing the pusher member to abut with an upper face of the component that is gripped in a gripping mechanism. Then, the component chuck device releases gripping of the component when supply of negative pressure is stopped, and a lead of the component is inserted into a hole of a substrate while holding the posture of the component by moving the pusher member downward while remaining abutted with the upper face of the component.

First claim

The invention claimed is:

1. A component chuck device configured to insert an insertion section of a gripped component into an insertion target section of a substrate, the component chuck device comprising:
a gripping mechanism configured to grip the component in a state in which negative pressure is supplied to the gripping mechanism to close grippers of the gripping mechanism to grip the component; and
a holding mechanism configured to hold a posture of the component gripped by the gripping mechanism using a holding member in a state in which negative pressure is supplied to the holding mechanism,
wherein the holding mechanism is configured to operate to hold the posture of the component using the holding member in both the state in which negative pressure is supplied to the gripping mechanism and the holding mechanism and a state after the supply of negative pressure supplied to the gripping mechanism and the holding mechanism is stopped, wherein the gripping mechanism is configured to operate to open the grippers to release the component when the negative pressure supplied to the gripping mechanism and the holding mechanism is stopped.

2. The component chuck device according to claim 1 ,
wherein the holding mechanism is configured to hold the posture of the component by pressing the component from above using the holding member in both the state in which negative pressure is supplied to the holding mechanism and a state in which positive pressure is supplied to the holding mechanism.

3. The component chuck device according to claim 1 ,
wherein in the holding mechanism, pressing force on the component by the holding member in a state where positive pressure is supplied to the holding mechanism is larger than that in the state where the negative pressure is supplied to the holding mechanism.

4. The component chuck device according to claim 1 ,
wherein the holding mechanism is provided with a cylinder configured to move the holding member vertically and a flow path switching section configured to switch a flow path for air that is supplied to the cylinder,
the cylinder is provided with a hollow first piston configured to slide within the cylinder, a second piston configured to slide within the first piston, a piston rod that penetrates the cylinder and the first piston, and in which the holding member is attached to the lower end and moves integrally with the second piston, a first spring configured to bias the first piston upward with respect to the cylinder, and a second spring configured to bias the second piston
downward with respect to the first piston, the inside of the cylinder being partitioned by the first piston into a lower negative pressure chamber and an upper positive pressure chamber,
the flow path switching section is configured to switch the flow path such that the negative pressure chamber is provided with negative pressure and the positive pressure chamber is open to the air when negative pressure is supplied to the flow path switching section, and switch the flow path such that the positive pressure chamber is provided with positive pressure and the negative pressure chamber is open to the air when positive pressure is supplied to the flow path switching section,
the first piston moves downward to a predetermined position within the cylinder against biasing by the first spring when the negative pressure chamber is provided with negative pressure, and maintains the predetermined position or moves further downward than the predetermined position when the positive pressure chamber is provided with positive pressure, and
the second piston and the piston rod are configured to extrude the holding member by moving downward with biasing force of the second spring accompanying downward movement of the first piston, and extrude the holding member by positive pressure that acts on the second piston in addition to biasing by the second spring when the positive pressure chamber is provided with positive pressure.

5. The component chuck device according to claim 4 ,
wherein the first piston is formed with a cavity section on a sliding surface that slides against the inner wall surface of the cylinder,
the cylinder is provided with a locking member having a size that is able to enter the cavity section, and a movement path is formed such that the locking member moves between a non-protrusion position at which the locking member does not protrude from the inner wall surface and a protrusion position at which the locking member partially protrudes from the inner wall surface,
the flow path switching section is connected to a communication path that communicates with the movement path at the protrusion position, the communication path is provided with negative pressure when negative pressure is supplied to the flow path switching section, and the communication path is provided with positive pressure when positive pressure is supplied to the flow path switching section, and
the locking member locks the first piston such that the first piston does not move above the predetermined position, by moving to the protrusion position when the movement path is provided with negative pressure via the communication path and partially entering the cavity section of the first piston at the predetermined position, and releases locking of the first piston by moving to the non-protrusion position and exiting from the cavity section of the first piston when the movement path is provided with positive pressure via the communication path.

6. The component chuck device according to claim 4 ,
wherein the gripping mechanism is able to grip various components with different heights, and
in the holding mechanism, in a case where the negative pressure chamber is provided with negative pressure and the holding member is extruded, the second piston and the piston rod move downward due to biasing by the second spring until the holding member abuts with the component, and the positions of the second piston and the piston rod are held when abutting with the component due to the second spring contracting when the holding member abuts with the component.

7. The component chuck device according to claim 1 ,
wherein negative pressure is supplied to the gripping mechanism and the holding mechanism from the same negative pressure source.

8. A component mounting device comprising:
a head to which the component chuck device according to claim 1 is attached; and
a moving mechanism, wherein the moving mechanism is configured to move the head,
wherein a component is mounted on a substrate by an insertion section of the component being inserted into an insertion target section of the substrate by the component chuck device.

Assignees

• Fuji Corp

Inventors

• Yamamuro Junichi
• Otsubo Satoru

Classifications

• H05K13/0409

  Sucking devices · CPC title

• Y10T29/49139

  by inserting component lead or terminal into base aperture · CPC title

• B25J15/08

  having finger members (B25J15/02, B25J15/04 take precedence) · CPC title

• H05K13/0413

  with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools · CPC title

• H05K13/0408 Primary

  Incorporating a pick-up tool · CPC title