Laser component and method of producing a laser component

Patent metadata

Field	Value
Publication number	US-10686295-B2
Application number	US-201414912210-A
Country	US
Kind code	B2
Filing date	Aug 14, 2014
Priority date	Aug 21, 2013
Publication date	Jun 16, 2020
Grant date	Jun 16, 2020

Abstract

A laser component includes an edge-emitting first laser chip with an upper side, a lower side, an end side and a side surface, wherein an emission region is arranged on the end side, the side surface is oriented perpendicularly to the upper side and to the end side, a first metallization is arranged on the upper side, a step by which a part adjacent to the upper side of the side surface is set back, is formed on the side surface, a passivation layer is arranged in the set-back part of the side surface, the laser chip is arranged on a carrier, the side surface faces toward a surface of the carrier, and a first solder contact arranged on the surface of the carrier electrically conductively connects to the first metallization.

First claim

The invention claimed is:

1. A method of producing a laser component comprising
providing a wafer having a first laser chip and a second laser chip;
applying a trench extending from an upper side of the first laser chip and the second laser chip into the wafer,
the trench being arranged between the first laser chip and the second laser chip,
the trench being oriented parallel to a resonator of the first laser chip; and
arranging a passivation layer in the trench;
arranging a first metallization on the upper side of the first laser chip;
separating the first laser chip and the second laser chip along a separating plane extending through the trench, side surfaces of the first laser chip and the second laser chip being formed on the separating plane; and
arranging the first laser chip on a surface of a carrier, the side surface of the first laser chip facing toward the surface of the carrier, a first solder contact arranged on the surface of the carrier being electrically conductively connected to the first metallization.

2. The method as claimed in claim 1 , further comprising connecting the upper side of the first laser chip to an upper side of a third laser chip by the first metallization.

3. The method as claimed in claim 1 , wherein the first solder contact connects to the first metallization by reflow soldering.

4. A laser component comprising
an edge-emitting first laser chip with an upper side, a lower side, an end side and a side surface, wherein the side surface is oriented perpendicularly to the upper side and to the end side:
an emission region is arranged on the end side;
a first metallization is arranged on the upper side;
a step by which a part adjacent to the upper side of the side surface is set back, is formed on the side surface;
a passivation layer is arranged in the set-back part of the side surface;
the edge-emitting first laser chip is arranged on a surface of a carrier, wherein the side surface faces toward the surface of the carrier; and
a first solder contact arranged on the surface of the carrier electrically conductively connects to the first metallization.

5. The laser component as claimed in claim 4 , wherein the side surface of the edge-emitting first laser chip connects to the carrier by a second solder contact arranged on the surface of the carrier.

6. The laser component as claimed in claim 5 , wherein the second solder contact electrically conductively connects to the lower side of the edge-emitting first laser chip.

7. The laser component as claimed in claim 4 , wherein a second metallization is arranged on the lower side of the edge-emitting first laser chip.

8. The laser component as claimed in claim 4 , wherein the first metallization connects the upper side of the edge-emitting first laser chip to an upper side of a second laser chip.

9. The laser component as claimed in claim 8 , wherein the second laser chip is configured and arranged mirror-symmetrically with respect to the edge-emitting first laser chip.

10. The laser component as claimed in claim 8 , wherein a side surface of the second laser chip connects to the carrier by a third solder contact arranged on the surface of the carrier.

11. The laser component as claimed in claim 4 , wherein a distance between the upper side and the emission region is less than 10 μm.

12. The laser component as claimed in claim 4 , wherein the set-back part of the side surface is set back by 1 μm to 10 μm.

13. The laser component as claimed in claim 4 , wherein the set-back part of the side surface extends from the upper side of the edge-emitting first laser chip by 10 μm to 50 μm in the direction of the lower side of the edge-emitting first laser chip.

14. The laser component as claimed in claim 4 , wherein a p-doped region of the edge-emitting first laser chip is adjacent to the upper side, and
an n-doped region of the edge-emitting first laser chip is adjacent to the lower side.

15. The laser component as claimed in claim 4 , wherein the first solder contact is arranged on a step formed on the surface of the carrier.

16. A laser component comprising
an edge-emitting first laser chip with an upper side, a lower side, an end side and a side surface, wherein the side surface is oriented perpendicularly to the upper side and to the end side;
an emission region is arranged on the end side;
a first metallization is arranged on the upper side;
a step by which a part adjacent to the upper side of the side surface is set back, is formed on the side surface;
a passivation layer is arranged in the set-back part of the side surface;
the edge-emitting first laser chip is arranged on a surface of a carrier, wherein the side surface faces toward the surface of the carrier;
a first solder contact arranged on the surface of the carrier electrically conductively connects to the first metallization;
the first metallization connects the upper side of the edge-emitting first laser chip to an upper side of a second laser chip; and
a distance between the emission region of the edge-emitting first laser chip and an emission region of the second laser chip is less than 20 μm.

Assignees

• Osram Opto Semiconductors Gmbh

Inventors

• Mueller Jens
• Horn Markus

Classifications

• H01S5/02375

  Positioning of the laser chips · CPC title

• H01S5/0237

  by soldering · CPC title

• H01S5/02355

  Fixing laser chips on mounts · CPC title

• H01S5/02345

  Wire-bonding · CPC title

• H01S5/02469

  Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC · CPC title