Apparatus for molding glass substrate

US10683228B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10683228-B2
Application numberUS-201415034085-A
CountryUS
Kind codeB2
Filing dateNov 4, 2014
Priority dateNov 4, 2013
Publication dateJun 16, 2020
Grant dateJun 16, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present invention relates to an apparatus for molding a glass substrate, and more specifically, to an apparatus for molding a glass substrate capable of forming a glass substrate in a 3D shape and preventing the shape of a vacuum hole from transferring onto the surface of the substrate. To this end, the present invention provides the apparatus for shaping a glass substrate, comprising: a molding frame having a cavity, at least one vacuum hole and at least one decompression hole, wherein the cavity disposed on one surface of the molding frame, the at least one vacuum hole formed in the molding frame below the cavity, the at least one vacuum hole being connected to an external vacuum device, and the at least one decompression hole defined between the cavity and the at least one vacuum hole such that the cavity communicates with the at least one vacuum hole, wherein a width of the at least one decompression hole is greater than a width of the at least one vacuum hole such that the at least one decompression hole lessens vacuum pressure applied to the glass substrate disposed on the cavity through the at least one vacuum hole, wherein all of the at least one vacuum hole are connected to the at least one decompression hole.

First claim

Opening claim text (preview).

What is claimed is: 1. An apparatus for shaping a glass substrate, comprising: a molding frame having a cavity, at least one vacuum hole and at least one decompression hole, wherein the cavity disposed on one surface of the molding frame, the at least one vacuum hole formed in the molding frame below the cavity, the at least one vacuum hole being connected to an external vacuum device, and the at least one decompression hole defined between the cavity and the at least one vacuum hole such that the cavity communicates with the at least one vacuum hole, wherein a width of the at least one decompression hole is greater than a width of the at least one vacuum hole such that the at least one decompression hole lessens vacuum pressure applied to the glass substrate disposed on the cavity through the at least one vacuum hole, wherein all of the at least one vacuum hole are directly connected to the at least one decompression hole. 2. The apparatus according to claim 1 , wherein the apparatus comprises a plurality of the vacuum holes and a plurality of the decompression holes, the plurality of the decompression holes corresponding to the plurality of the vacuum holes respectively. 3. The apparatus according to claim 1 , wherein the apparatus comprises a plurality of the vacuum holes, and at least two vacuum holes of the plurality of the vacuum holes are connected to one decompression hole of the at least one decompression hole. 4. The apparatus according to claim 3 , wherein the at least two vacuum holes are arranged in a row or column, and the apparatus comprises a plurality of the decompression holes, each of which is connected to the at least two vacuum holes in the row or column. 5. The apparatus according to claim 4 , wherein each of the plurality of the decompression holes comprises a trench structure in which the at least two vacuum holes arranged in a row or column is exposed. 6. The apparatus according to claim 1 , wherein at least one wall surface of the cavity comprises a curved surface such that at least one edge portion of four edges of the glass substrate is shaped to have a curved surface. 7. The apparatus according to claim 1 , wherein the vacuum hole comprises: a first path having one end adjoining to the decompression hole; a second path connected to the other end of the first path, wherein an inner diameter of the second path is greater than an inner diameter of the first path.

Assignees

Inventors

Classifications

  • by suction without blowing, e.g. with vacuum or by venturi effect · CPC title

  • Structural details of the press-mould assembly · CPC title

  • C03B23/035Primary

    using a gas cushion or by changing gas pressure, e.g. by applying vacuum {or blowing for supporting the glass while bending} · CPC title

  • by press-bending between shaping moulds · CPC title

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Frequently asked questions

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What does patent US10683228B2 cover?
The present invention relates to an apparatus for molding a glass substrate, and more specifically, to an apparatus for molding a glass substrate capable of forming a glass substrate in a 3D shape and preventing the shape of a vacuum hole from transferring onto the surface of the substrate. To this end, the present invention provides the apparatus for shaping a glass substrate, comprising: a mo…
Who is the assignee on this patent?
Corning Prec Materials Co Ltd
What technology area does this patent fall under?
Primary CPC classification C03B23/0357. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Jun 16 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).