Fold open face seal package

US10683152B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10683152-B2
Application numberUS-201815980878-A
CountryUS
Kind codeB2
Filing dateMay 16, 2018
Priority dateDec 9, 2015
Publication dateJun 16, 2020
Grant dateJun 16, 2020

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A fold open face seal package is provided. The package may comprise a one or two-piece thermoformed blister adhered to a backing card. In the one piece embodiment upper and lower portions of the blister are connected by one or more hinges. In the two-piece embodiment the blister is cut into upper and lower pieces which are adhered to the backing card. The package may be opened by folding the backing card back along a bend line and then reclosed for later use.

First claim

Opening claim text (preview).

The invention claimed is: 1. A package for holding one or more articles, each of the one or more articles having a top, the package comprising: a backing card having a front surface, two side edges and a bend line defining an axis of rotation and a first horizontal plane (P) and separating the backing card into a card upper portion and a card lower portion; and a two piece blister adhered to the backing card and comprising a blister upper piece and a separate blister lower piece, the blister and the backing card configured to hold one or more articles; wherein the blister upper piece comprises an upper body and an upper flange, the upper body having an upper periphery adjacent the backing card, the blister upper piece having a free bottom edge, the upper flange connected to the upper body along the upper periphery and extending laterally away from the upper body; the upper flange is permanently affixed to the card upper portion above the bend line and is releasably adhered to the card lower portion below the bend line; the blister and the backing card defining an interior for holding the articles; and the backing card is bendable along the bend line between a planar position in which the package is closed and a bent position in which the package is open to provide access to the one or more articles. 2. A packaging system comprising: the package of claim 1 ; and one or more articles disposed within the interior, each of the one or more articles having a top; wherein the bend line is located near the tops of each of the one or more articles. 3. The package of claim 1 wherein: the blister lower piece comprises a lower body and a lower flange, the lower body having a lower periphery adjacent the backing card, the lower piece having a free top edge, the lower flange connected to the lower body along the lower periphery and extending laterally away from the lower body. 4. The package of claim 3 wherein: the top edge of the blister lower piece is located below the bend line. 5. The package of claim 1 wherein: the upper body periphery comprises laterally extending upper lobes and the lower body periphery comprises laterally extending lower lobes. 6. The package of claim 3 wherein: the blister upper piece and the blister lower piece are positioned on the backing card in overlapping fashion so that the entire top edge of the blister lower piece located higher up on the backing card than the entire bottom edge of the blister upper piece. 7. The package of claim 3 wherein: the blister upper piece and the blister lower piece are positioned on the backing card in abutting fashion, with the top edge of the blister lower piece abutting the bottom edge of the blister upper piece. 8. The package of claim 3 wherein: the blister upper piece and the blister lower piece are positioned on the backing card in spaced apart fashion, the bottom edge of the upper piece and the top edge of the lower piece defining a gap therebetween. 9. A packaging system comprising: the package of claim 1 ; and one or more articles disposed within the interior, each of the one or more articles having a top; wherein the two-piece blister conforms to the shape of the one or more articles contained within the package. 10. The package of claim 1 wherein: the upper flange is adhered to the backing card along a plurality of first sealed areas and the lower flange is adhered to the backing card along a plurality of second sealed areas. 11. The package of claim 10 wherein: the second sealed areas are spaced apart from the bend line. 12. The package of claim 1 wherein: the bend line is aligned with a grain direction of the backing card. 13. The package of claim 1 wherein: the backing card comprises an unweakened area along the axis of rotation between the bend line and each of the side edges.

Assignees

Inventors

Classifications

  • and forming one compartment · CPC title

  • B65D75/585Primary

    the tear-lines being broken by deformation or bending · CPC title

  • Batteries · CPC title

Patent family

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Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US10683152B2 cover?
A fold open face seal package is provided. The package may comprise a one or two-piece thermoformed blister adhered to a backing card. In the one piece embodiment upper and lower portions of the blister are connected by one or more hinges. In the two-piece embodiment the blister is cut into upper and lower pieces which are adhered to the backing card. The package may be opened by folding the ba…
Who is the assignee on this patent?
Sonoco Dev Inc
What technology area does this patent fall under?
Primary CPC classification B65D75/585. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jun 16 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).