Additive manufacturing system and process with precision substractive technique

US10682807B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10682807-B2
Application numberUS-201815945140-A
CountryUS
Kind codeB2
Filing dateApr 4, 2018
Priority dateSep 13, 2013
Publication dateJun 16, 2020
Grant dateJun 16, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An additive manufacturing system and process for producing three-dimensional parts, which includes forming layers of the three-dimensional part from a part material at a first resolution, and ablating selected voxels of the formed layers with a laser beam at a second resolution that is higher than the first resolution.

First claim

Opening claim text (preview).

The invention claimed is: 1. An additive manufacturing system for producing printed parts, the system comprising: an extrusion head configured to move in three dimensions relative to a print surface and to print portions of a part by depositing molten part material onto the print surface along tool paths defined by a digital model of the part, wherein the part material cools to a solid state at a first resolution onto the print surface; a radiation-emitting device configured to emit radiation sufficient to ablate selected voxels of the printed portions of the part and having a sufficient resolution such that ablated printed portions will have a second resolution that is higher than the first resolution; a scanner configured to scan the printed portions of the part and at least one controller configured to manage operations of the extrusion head and the radiation-emitting device, wherein the controller is configured to generate a scanned map based upon data captured in the scan and to identify at least one region of difference between the scanned map and the digital model, and wherein the selected voxels of the printed portions of the part are located where a region of difference is identified. 2. The system of claim 1 , and further comprising a masking unit configured to spatially modulate the emitted radiation towards the selected voxels. 3. The system of claim 2 , wherein the controller is further configured to adjust the spatial modulation of the masking unit. 4. The system of claim 1 , wherein the radiation-emitting device comprises an excimer laser device. 5. The system of claim 1 , wherein the scanner is incorporated into the radiation-emitting device. 6. The system of claim 1 , wherein the additive manufacturing system further comprises a print environment, and wherein the radiation-emitting device is located outside of the print environment. 7. The system of claim 1 , wherein the radiation-emitting device is configured to emit the laser beam pulses with an average power density ranging from about 0.01 J/cm 2 to about 10 J/cm 2 . 8. The system of claim 1 , wherein the printed portions of the part comprise one or more part layers. 9. The system of claim 1 , wherein the printed portions of the part comprise the entirety of the printed part.

Assignees

Inventors

Classifications

  • involving additional operations performed on the added layers, e.g. smoothing, grinding or thickness control (surface shaping B29C59/00; after-treatment of articles without altering their shape B29C71/00) · CPC title

  • B29C64/112Primary

    using individual droplets, e.g. from jetting heads · CPC title

  • using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material · CPC title

  • Apparatus for additive manufacturing; Details thereof or accessories therefor · CPC title

  • Processes of additive manufacturing · CPC title

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Frequently asked questions

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What does patent US10682807B2 cover?
An additive manufacturing system and process for producing three-dimensional parts, which includes forming layers of the three-dimensional part from a part material at a first resolution, and ablating selected voxels of the formed layers with a laser beam at a second resolution that is higher than the first resolution.
Who is the assignee on this patent?
Stratasys Inc
What technology area does this patent fall under?
Primary CPC classification B29C64/112. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jun 16 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).