Mold device

Patent metadata

Field	Value
Publication number	US-10682792-B2
Application number	US-201515575345-A
Country	US
Kind code	B2
Filing date	Jul 30, 2015
Priority date	Jul 30, 2015
Publication date	Jun 16, 2020
Grant date	Jun 16, 2020

Abstract

The mold device according to the present invention is a mold device to resin-seal the semiconductor device including an insert electrode, and in the semiconductor device, the insert electrode is provided with an insert hole, a nut having a screw hole is disposed in the insert electrode so that the insert hole and the screw hole communicate with each other, the mold device includes a mold body into which resin is injected to resin-seal the semiconductor device, including a side of the insert electrode where the nut is disposed, and a rod-like member that is inserted into the insert hole, and the rod-like member is inserted into the screw hole of the nut through the insert hole of the insert electrode to draw the nut to the side of the insert electrode.

First claim

The invention claimed is:

1. A mold device to resin-seal a semiconductor device including an insert electrode, wherein
in said semiconductor device, said insert electrode is provided with an insert hole, and a nut having a screw hole is disposed in said insert electrode so that said insert hole and said screw hole communicate with each other,
said mold device comprises:
a mold body into which resin is injected to resin-seal said semiconductor device, including a side of said insert electrode where said nut is disposed; and
a rod-like member that is inserted into said insert hole, and
said rod-like member is inserted into said screw hole of said nut through said insert hole of said insert electrode to draw the nut to the side of said insert electrode,
said rod-like member is a plurality of pilot pins,
a claw is provided at a leading end of each of said plurality of pilot pins,
a pilot pin extension rod is further included,
in a state where said plurality of pilot pins are inserted into said screw hole of said nut through said insert hole, said pilot pin extension rod is inserted between said plurality of pilot pins, by which said claws of said plurality of pilot pins are locked in said nut, and
in a state where said claws of said plurality of pilot pins are locked in said nut, said plurality of pilot pins draw said nut to the side of said insert electrode.

2. The mold device according to claim 1 , wherein
said nut is a nut with both ends of said screw hole penetrated, and
said claws of said pilot pins lock a surface of said nut on an opposite side of an entrance side from which said pilot pins are inserted.

3. The mold device according to claim 1 , wherein
said nut is a cap nut, and
said claws of said pilot pins lock an inner wall surface of said screw hole of said nut.

4. A mold device to resin-seal a semiconductor device including an insert electrode, wherein
in said semiconductor device, said insert electrode is provided with an insert hole, and a nut having a screw hole is disposed in said insert electrode so that said insert hole and said screw hole communicate with each other,
said mold device comprises:
a mold body into which resin is injected to resin-seal said semiconductor device, including a side of said insert electrode where said nut is disposed; and
a slide mold disposed on an inner side of said insert electrode,
said mold body includes a protrusion,
said protrusion is inserted into said screw hole of said nut through said insert hole of said insert electrode,
said slide mold includes first and second molds,
in said respective first and second molds, a pair of cutouts is provided, and
said pair of cutouts encloses an outer periphery of a bearing surface of said nut.

5. The mold device according to claim 4 , wherein
said first and second molds have a same rotating shaft, and
said first and second molds rotate with respect to said rotating shaft to switch between a state where said pair of cutouts encloses the outer periphery of the bearing surface of said nut, and a state where said pair of cutouts releases the enclosure of the outer periphery of the bearing surface of said nut.

6. The mold device according to claim 4 , wherein
in the outer periphery of the bearing surface of said nut enclosed by said pair of cutouts, an inclination spread toward the bearing surface is provided, and
in said pair of cutouts, inclinations that fit in the inclination of the outer periphery of the bearing surface of said nut are provided.

7. A mold device to resin-seal a semiconductor device including an insert electrode, wherein
in said semiconductor device, said insert electrode is provided with an insert hole, and a nut having a screw hole is disposed in said insert electrode so that said insert hole and said screw hole communicate with each other,
said mold device comprises:
a mold body into which resin is injected to resin-seal said semiconductor device, including a side of said insert electrode where said nut is disposed; and
a protrusion provided in said mold body,
said protrusion is inserted into said screw hole of said nut through said insert hole of said insert electrode, and
said protrusion is provided with an adsorption passage that adsorbs said nut due to a negative pressure to draw said nut to the side of said insert electrode, and the adsorption passage bisects the protrusion in an axial direction of the protrusion.

8. The mold device according to claim 7 , further comprising an O-ring that surrounds said protrusion.

9. A mold device to resin-seal a semiconductor device including an insert electrode, wherein
in said semiconductor device, said insert electrode is provided with an insert hole, and a nut having a screw hole is disposed in said insert electrode so that said insert hole and said screw hole communicate with each other,
said mold device comprises a mold body into which resin is injected to resin-seal said semiconductor device, including a side of said insert electrode where said nut is disposed, and
said mold body is provided with a recession to receive a head portion of a bolt that is screwed into said screw hole of said nut through said insert hole,
wherein the mold body includes a through hole on a side of the insert electrode opposite the nut for inserting the rod-like member into the mold body.

Assignees

• Mitsubishi Electric Corp

Inventors

• Yasui Takatoshi
• Hata Yuki
• Saito Shoji
• Ando Katsuji
• Okamoto Korehide
• MURAI Ryoji

Classifications

• H10P72/0441

  Apparatus for sealing, encapsulating, glassing, decapsulating or the like · CPC title

• H10W74/016

  using moulds · CPC title

• H10W74/01

  Manufacture or treatment · CPC title

• H10W72/00

  Interconnections or connectors in packages · CPC title

• B29C45/14418

  Sealing means between mould and article · CPC title