Composite printed circuit board and laundry treatment apparatus having the same

US10681809B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10681809-B2
Application numberUS-201816103054-A
CountryUS
Kind codeB2
Filing dateAug 14, 2018
Priority dateAug 29, 2017
Publication dateJun 9, 2020
Grant dateJun 9, 2020

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

Disclosed is a composite printed circuit board including a first printed circuit board (PCB) having a first circuit pattern mounted thereon, and a second PCB having a second circuit pattern mounted thereon, and the first PCB penetrates and is coupled to the second PCB so that the first circuit pattern is electrically connected to the second circuit pattern.

First claim

Opening claim text (preview).

What is claimed is: 1. A composite printed circuit board comprising: a first printed circuit board (PCB) that includes a first body provided with a first circuit pattern, and a mounting portion provided on one side of the first body; and a second PCB that includes a second body provided with a second circuit pattern, and a mounting hole provided on the second body, wherein the mounting portion is configured to be inserted into the mounting hole to physically couple the first PCB to the second PCB and to electrically connect the first circuit pattern to the second circuit pattern, wherein the first PCB further includes: a protruding fixing portion that protrudes from a surface of the first body, wherein the protruding fixing portion is configured to prevent the first body from tilting in a thickness direction of the first body, and an inline fixing portion provided on one of both ends of the first body to guide insertion of the mounting portion to the mounting hole at a prescribed position, wherein the inline fixing portion is configured to guide insertion of the plurality of mounting portions to a same depth, wherein the second PCB further includes a fixing hole configured to receive the inline fixing portion, wherein the mounting portion includes a first mounting portion provided on the one side of the first body and a second mounting portion provided on the one side of the first body, and the second mounting portion being spaced apart from the first mounting portion, and wherein the mounting hole includes a first mounting hole corresponding to the first mounting portion and a second mounting hole corresponding to the second mounting portion, wherein a width of the first mounting portion is greater than a width of the second mounting portion. 2. The composite printed circuit board according to claim 1 , wherein the first PCB includes: an exposed lead connected to the first circuit pattern and provided to be exposed on one surface or both opposing surfaces of the mounting portion. 3. The composite printed circuit board according to claim 2 , wherein the second PCB includes: a connection lead provided adjacent to the mounting hole and configured to connect to the exposed lead. 4. The composite printed circuit board according to claim 3 , wherein the mounting portion is provided to extend from the first body such that a length of the mounting portion is longer than a thickness of the second body. 5. The composite printed circuit board according to claim 3 , wherein the mounting portion includes a plurality of mounting portions, and the mounting hole includes a plurality of mounting holes. 6. The composite printed circuit board according to claim 5 , wherein the inline fixing portion is provided on one or both lateral ends of the first body and spaced apart from the mounting portions, wherein the inline fixing portion is inserted into and coupled to the second body. 7. The composite printed circuit board according to claim 5 , wherein the inline fixing portion is co-planar to the mounting portions. 8. The composite printed circuit board according to claim 3 , wherein the connection lead has a prescribed width that corresponds to a width of the exposed lead and is provided adjacent to the exposed lead to accommodate solder between the connection lead and the exposed lead. 9. The composite printed circuit board according to claim 8 , wherein the connection lead includes a plurality of leads positioned adjacent to corresponding ones of a plurality of exposed leads. 10. The composite printed circuit board according to claim 8 , wherein the connection lead is provided on a bottom side of the second body corresponding to the exposed leads that protrude through the second body. 11. The composite printed circuit board according to claim 1 , wherein the protruding fixing portion protrudes from the first body perpendicular to the mounting portions. 12. The composite printed circuit board according to claim 11 , wherein the protruding fixing portion has a prescribed shape such that the protruding fixing portion extends to contact the second body. 13. The composite printed circuit board according to claim 12 , wherein the protruding fixing portion is configured to penetrate the second body. 14. The composite printed circuit board according to claim 1 , wherein the first circuit pattern of the first PCB is provided to be mounted on both surfaces of the first body, and wherein the second circuit pattern of the second PCB is provided to be mounted only on one surface of the second body.

Assignees

Inventors

Classifications

  • associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] · CPC title

  • H05K3/366Primary

    substantially perpendicularly to each other (H05K3/361 takes precedence) · CPC title

  • H05K1/115Primary

    Via connections; Lands around holes or via connections (H05K1/112 takes precedence) · CPC title

  • Holes or slots in insulating substrate not used for electrical connections · CPC title

  • Structural association of two or more printed circuits (providing electric connection to or between printed circuits H05K1/11, H01R12/00) · CPC title

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Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US10681809B2 cover?
Disclosed is a composite printed circuit board including a first printed circuit board (PCB) having a first circuit pattern mounted thereon, and a second PCB having a second circuit pattern mounted thereon, and the first PCB penetrates and is coupled to the second PCB so that the first circuit pattern is electrically connected to the second circuit pattern.
Who is the assignee on this patent?
Lg Electronics Inc
What technology area does this patent fall under?
Primary CPC classification H05K3/366. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jun 09 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).