Flexible circuit board, optical transceiver assembly, and optical module

Patent metadata

Field	Value
Publication number	US-10681804-B2
Application number	US-201816190400-A
Country	US
Kind code	B2
Filing date	Nov 14, 2018
Priority date	Nov 16, 2017
Publication date	Jun 9, 2020
Grant date	Jun 9, 2020

Abstract

A flexible circuit board, and an optical transceiver assembly and an optical module that have such flexible circuit board. The flexible circuit board includes a substrate body, a transmission metal layer formed on at least one surface of the substrate body, a strengthening layer formed on the transmission metal layer, and a surface metal layer formed on a portion of an outer surface of the strengthening layer. The surface metal layer constitutes a securing portion for securing and connecting to an external element. A portion of the flexible circuit board that is not covered by the surface metal layer constitutes a connecting portion that connects to the securing portion. The surface metal layer is electrically connected to the transmission metal layer.

First claim

What is claimed is:

1. A flexible circuit board, comprising:
a substrate body;
a transmission metal layer formed on at least one surface of the substrate body, wherein the transmission metal layer includes a first surface facing the substrate body and a second surface opposite to the first surface;
a strengthening layer formed on the second surface of the transmission metal layer, wherein the strengthening layer includes an inner surface facing the transmission layer and an outer surface opposite to the inner surface; and
a surface metal layer formed on a portion of the outer surface of the strengthening layer,
wherein the surface metal layer of the flexible circuit board constitutes a securing portion for securing and connecting to an external element,
a portion of the flexible circuit board that is not covered by the surface metal layer constitutes a connecting portion that connects to the securing portion; and
the surface metal layer is electrically connected to the transmission metal layer.

2. The flexible circuit board of claim 1 , wherein a solder pad is formed at the securing portion for securing and connecting the flexible circuit board to the external element.

3. The flexible circuit board of claim 1 , wherein the flexible circuit board further comprises a pore structure and the surface metal layer is electrically connected to the transmission metal layer through the pore structure.

4. The flexible circuit board of claim 3 , wherein the pore structure is formed in a middle portion of the securing portion.

5. The flexible circuit board of claim 1 , wherein the material of the strengthening layer is a liquid crystal polymer, a polyimide, or Teflon®.

6. The flexible circuit board of claim 1 , wherein the flexible circuit board further comprises one or a plurality of the securing portions.

7. The flexible circuit board of claim 1 , wherein a pattern of the surface metal layer is formed by etching.

8. The flexible circuit board of claim 1 , wherein the substrate body is a multilayer board structure.

9. An optical transceiver assembly, comprising:
at least one of an optical transmitting element or an optical receiving element; and
the flexible circuit board of claim 1 ,
wherein the flexible circuit board is secured and connected to the at least one of the optical transmitting element or the optical receiving element through the securing portion.

10. An optical module, comprising:
at least one of an optical transmitting element or an optical receiving element;
a rigid circuit board; and
the flexible circuit board of claim 1 ,
wherein the flexible circuit board is connected to the at least one of the optical transmitting element or the optical receiving element and the rigid circuit board through the securing portion.

Assignees

• Innolight Tech Suzhou Ltd

Inventors

• Fang Xigui
• Chen Qin
• Hou Yunfei
• Zhou Jie

Classifications

• G02B6/42

  Coupling light guides with opto-electronic elements · CPC title

• H05K1/111

  Pads for surface mounting, e.g. lay-out · CPC title

• H05K1/028 Primary

  Bending or folding regions of flexible printed circuits (H05K1/0283 takes precedence) · CPC title

• H05K1/189

  characterised by the use of flexible or folded printed circuits · CPC title

• H05K2201/0141

  Liquid crystal polymer [LCP] · CPC title