Adhesive for semiconductor mounting, and semiconductor sensor

Patent metadata

Field	Value
Publication number	US-10679925-B2
Application number	US-201716082430-A
Country	US
Kind code	B2
Filing date	Mar 10, 2017
Priority date	Mar 10, 2016
Publication date	Jun 9, 2020
Grant date	Jun 9, 2020

Abstract

Provided is an adhesive for semiconductor mounting that can achieve high-precision gap control and can increase heat resistance when a semiconductor is mounted. An adhesive for semiconductor mounting according to the present invention is an adhesive that is used for mounting a semiconductor, and contains a silicone resin and a spacer, the content of the spacer being 0.1% by weight or more and 5% by weight or less in 100% by weight of the adhesive, the 10% compressive elasticity modulus of the spacer being 5000 N/mm2 or more and 15000 N/mm2 or less, and the average particle diameter of the spacer being 10 μm or more and 200 μm or less.

First claim

The invention claimed is:

1. An adhesive for semiconductor mounting that is an adhesive used for mounting a semiconductor and comprises a silicone resin and a spacer,
a content of the spacer being 0.1% by weight or more and 5% by weight or less in 100% by weight of the adhesive,
a 10% compressive elasticity modulus of the spacer being 5000 N/mm 2 or more and 15000 N/mm 2 or less, and
an average particle diameter of the spacer being 10 μm or more and 200 μm or less.

2. The adhesive for semiconductor mounting according to claim 1 , wherein when the spacer is subjected to heating at 150° C. for 1000 hours, a ratio of the 10% compressive elasticity modulus of the spacer after the heating to the 10% compressive elasticity modulus of the spacer before the heating is 0.95 or more and 1.05 or less.

3. The adhesive for semiconductor mounting according to claim 1 , wherein the spacer contained in the adhesive includes no spacer particles having an average particle diameter of 1.5 times or more the average particle diameter of the spacer, or includes, in all 100% spacer particles, 0.1% or less of spacer particles having an average particle diameter of 1.5 times or more the average particle diameter of the spacer.

4. The adhesive for semiconductor mounting according to claim 1 , wherein a specific gravity of the spacer is 1.05 or more and less than 1.30.

5. The adhesive for semiconductor mounting according to claim 1 , wherein a compression recovery rate of the spacer is 50% or more.

6. The adhesive for semiconductor mounting according to claim 1 , wherein the spacer is a copolymer of a polymerization component including divinylbenzene.

7. The adhesive for semiconductor mounting according to claim 1 ,
wherein the spacer is a copolymer of a polymerization component including a (meth)acrylic compound, and
the (meth)acrylic compound includes a (meth)acrylic compound having four or more (meth)acryloyl groups.

8. The adhesive for semiconductor mounting according to claim 6 ,
wherein the spacer is a polymer of a polymerization component, and
a polymerizable group residual rate of the spacer is less than 1%.

9. The adhesive for semiconductor mounting, according to claim 1 , being an adhesive for mounting of a semiconductor sensor chip that is used to mount a semiconductor sensor chip.

10. A semiconductor sensor comprising:
a first member;
a second member, the second member being a semiconductor; and
an adhesive layer that bonds the first member to the second member,
the adhesive layer being a cured product of the adhesive for semiconductor mounting according to claim 1 .

Assignees

• Sekisui Chemical Co Ltd

Inventors

• Ueda Saori
• Yamada Yasuyuki

Classifications

• C08G65/336

  containing silicon · CPC title

• C09J11/08

  Macromolecular additives · CPC title

• C09J2203/326

  for bonding electronic components such as wafers, chips or semiconductors · CPC title

• H01L24/32

  Electricity · mapped topic

• H01L2224/05644

  Electricity · mapped topic