Display panel with flexible circuit board regions and display module

Patent metadata

Field	Value
Publication number	US-10678104-B2
Application number	US-201816309456-A
Country	US
Kind code	B2
Filing date	Nov 22, 2018
Priority date	Sep 27, 2018
Publication date	Jun 9, 2020
Grant date	Jun 9, 2020

Abstract

A display panel and a display module are provided. The display panel includes a bonding region. The bonding region includes a drive integrated circuit (IC) chip region, a first flexible circuit board region and a second flexible circuit board region. A first soldering pad is disposed in the first flexible circuit board region. A second soldering pad is disposed in the second flexible circuit board region. The first soldering pad and the second soldering pad are configured to output driving signals.

First claim

What is claimed is:

1. A display panel, wherein the display panel comprises a bonding region, the bonding region comprises:
a drive integrated circuit (IC) chip region, wherein a drive IC chip is disposed in the drive IC chip region of the display panel, and the drive IC chip region is configured to output driving signals;
a first flexible circuit board region, wherein a first soldering pad is disposed in the first flexible circuit board region of the display panel, and the first soldering pad is electrically connected to an input terminal port of the drive IC chip region, and is electrically connected to a output terminal port of the drive IC chip region through internal wires of the drive IC chip to output first driving signals; and
at least one second flexible circuit board region, wherein a second soldering pad is disposed in the second flexible circuit board region of the display panel, and the second soldering pad is configured to output second driving signals;
wherein the at least one second flexible circuit board region are two second flexible circuit board regions; and
wherein the drive IC chip region is parallel to the first flexible circuit board region, and the second flexible circuit board regions are located at two outer sides of the drive IC chip region and the first flexible circuit board region.

2. The display panel as claimed in claim 1 , wherein the second soldering pad is further configured to transmit testing signals.

3. The display panel as claimed in claim 1 , wherein the display panel further comprises an array wiring area, and the second soldering pad is electrically connected to signal wires in the array wiring area to output the second driving signals.

4. The display panel as claimed in claim 3 , wherein
the drive IC chip region comprises at least one input terminal port, and the first soldering pad comprises at least one first sub-soldering pad; and
a number of the at least one input terminal port is equal to or greater than a number of the at least one first sub-soldering pad.

5. The display panel as claimed in claim 1 , wherein the second soldering pad is electrically connected to the corresponding input terminal port of the drive IC chip region, and is electrically connected to the output terminal port of the drive IC chip region through the internal wires of the drive IC chip to output the second driving signals.

6. The display panel as claimed in claim 5 , wherein
the drive IC chip region comprises at least one first input terminal port and at least one second input terminal port, the first soldering pad comprises at least one first sub-soldering pad, and the second soldering pad comprise at least one second sub-soldering pad;
the at least one first sub-soldering pad is electrically connected to the at least one first input terminal port of the drive IC chip region, and is electrically connected to a first output terminal port corresponding to the at least one first input terminal port in the drive IC chip region through the internal wires of the drive IC chip to output the first driving signals; and
the at least one second sub-soldering pad is electrically connected to the at least one second input terminal port of the drive IC chip region, and is electrically connected to a second output terminal port corresponding to the at least one second input terminal port in the drive IC chip region through the internal wires of the drive IC chip to output the second driving signals.

7. The display panel as claimed in claim 6 , wherein a sum of a number of the at least one first input terminal port and a number of the at least one second input terminal port, is equal to or greater than a sum of a number of the at least one first sub-soldering pad and a number of the at least one second sub-soldering pad.

8. The display panel as claimed in claim 1 , wherein the display panel further comprises a liquid crystal cell test region, the liquid crystal cell test region comprises at least one test soldering pad, and the at least one test soldering pad is configured to transmit testing signals.

9. A display module, the display module comprising a display panel, and further comprising a touch layer, a polarizer and a cover plate layer located on the display panel, wherein the display panel comprises a bonding region, the bonding region comprises:
a drive integrated circuit (IC) chip region, wherein a drive IC chip is disposed in the drive IC chip region of the display panel, and the drive IC chip region is configured to output driving signals;
a first flexible circuit board region, wherein a first soldering pad is disposed in the first flexible circuit board region of the display panel, and the first soldering pad is electrically connected to an input terminal port of the drive IC chip region, and is electrically connected to a corresponding output terminal port of the drive IC chip region through internal wires of the drive IC chip to output first driving signals; and
at least one second flexible circuit board region, wherein a second soldering pad is disposed in the second flexible circuit board region of the display panel, and the second soldering pad is configured to output second driving signals;
wherein the at least one second flexible circuit board region are two second flexible circuit board regions; and
wherein the drive IC chip region is parallel to the first flexible circuit board region, the second flexible circuit board regions are located at two outer sides of the drive IC chip region and the first flexible circuit board region.

10. The display module as claimed in claim 9 , wherein the second soldering pad is further configured to transmit testing signals.

11. The display module as claimed in claim 9 , wherein the display panel further comprises an array wiring area, and the second soldering pad is electrically connected to corresponding signal wires in the array wiring area to output the second driving signals.

12. The display module as claimed in claim 11 , wherein
the drive IC chip region comprises at least one input terminal port, and the first soldering pad comprises at least one first sub-soldering pad; and
a number of the at least one input terminal port is equal to or greater than a number of the at least one first sub-soldering pad.

13. The display module as claimed in claim 9 , wherein the second soldering pad is electrically connected to the corresponding input terminal port of the drive IC chip region, and is electrically connected to the corresponding output terminal port of the drive IC chip region through the internal wires of the drive IC chip to output the second driving signals.

14. The display module as claimed in claim 13 , wherein
the drive IC chip region comprises at least one first input terminal port and at least one second input terminal port, the first soldering pad comprises at least one first sub-soldering pad, and the second soldering pad comprise at least one second sub-soldering pad;
the at least one first sub-soldering pad is electrically connected to the at least one first input terminal port of the drive IC chip region, and is electrically connected to a first output terminal port corresponding to the at least one first input terminal port in the drive IC chip region through the internal wires of the drive IC chip to output the first driving signals; and
the at least one second sub-soldering pad is electrically connected to the at least one second input terminal port of the drive IC chip region, and is electrically connected to a second output terminal port corresponding to the at least one second input terminal port in the drive IC chip region through the interna

Assignees

• Wuhan China Star Optoelectronics Technology Co Ltd

Inventors

• Chen Bocai
• Wang Jinglong

Classifications

• G02F1/1309

  Repairing; Testing · CPC title

• G02F1/13458 Primary

  Terminal pads · CPC title

• G02F1/13452

  Conductors connecting driver circuitry and terminals of panels · CPC title

• G02F1/1345 Primary

  Conductors connecting electrodes to cell terminals · CPC title