Pressure sensor module having a sensor chip and passive devices within a housing

Patent metadata

Field	Value
Publication number	US-10677675-B2
Application number	US-201816114543-A
Country	US
Kind code	B2
Filing date	Aug 28, 2018
Priority date	Dec 16, 2014
Publication date	Jun 9, 2020
Grant date	Jun 9, 2020

Abstract

A pressure sensor module including a housing, a pressure sensor chip, and one or more of an integrated passive device (IDP) chip and discrete passive devices are disclosed. The pressure sensor chip and one or more of the IPD chip and the discrete passive devices are arranged within the housing.

First claim

What is claimed is:

1. A method of providing a pressure sensor module comprising:
providing a housing defining an interior cavity open to an exterior environment via a passage through the housing;
arranging a pressure sensor chip within the interior cavity; and
arranging an integrated passive device chip within the interior cavity.

2. The method of claim 1 , comprising: electrically connecting the pressure sensor chip and the integrated passive device chip.

3. The method of claim 2 , comprising electrically connecting the pressure sensor chip and integrated passive device chip using bond wires.

4. The method of claim 1 , the integrated passive device chip comprising exclusively passive electronic devices.

5. The method of claim 1 , comprising:
providing a leadframe extending through the housing from the interior cavity to beyond the housing; and
electrically connecting the pressure sensor chip and integrated passive device chip to different portions of the leadframe.

6. The method of claim 1 , comprising:
encapsulating the pressure sensor chip and the integrated passive device chip at least partially in an encapsulation material.

7. The method of claim 1 , comprising:
providing the housing with external electrical contacts for electrically connected the pressure sensor to a printed circuit board.

8. The method of claim 1 , comprising:
providing a leadframe comprising a portion within the interior cavity; and
arranging the pressure sensor chip and integrated passive device chip on the leadframe via a mold compound.

9. The method of claim 1 , comprising:
arranging the pressure sensor chip and integrated passive device chip laterally to one another.

10. The method of claim 1 , comprising:
arranging the pressure sensor chip and integrated passive device chip vertically to one another.

11. A method of providing a pressure sensor module comprising:
providing a housing defining an interior cavity open to an exterior environment via a passage through the housing;
arranging within the interior cavity:
a pressure sensor chip;
at least one integrated passive device chip; and
one or more discrete passive devices.

12. The method of claim 11 , comprising:
encapsulating at least partially within an encapsulation material the pressure sensor chip, at least one integrated passive device chip, and one or more discrete passive devices.

13. The method of claim 11 , comprising:
electrically connecting the pressure sensor switches, the at least one integrated passive device chip, and the one or more discrete passive devices with one another.

14. The method of claim 11 , comprising electrically connecting the pressure sensor chip and integrated passive device chip using bond wires.

15. The method of claim 13 , comprising:
providing a leadframe comprising a portion arranged within the interior cavity and portions extending through the housing to an exterior of the housing, and
arranging the pressure sensor chip, at least one integrated passive device chip, and one or more discrete passive devices on different portions of the leadframe within the interior cavity.

16. The method of claim 15 , comprising:
providing portions of the leadframe extending to the exterior of the housing with contacts for electrical connection to a printed circuit board.

17. The method of claim 13 , comprising:
providing the leadframe with a die pad arranged within the interior cavity;
arranging the pressure sensor chip, at least one integrated passive device chip, and one or more discrete passive devices on the die pad; and
encapsulating within an encapsulation material the pressure sensor chip, at least one integrated passive device chip, the one or more discrete passive devices, and the die pad.

18. The method of claim 1 , comprising:
arranging the pressure sensor chip, the at least one integrated passive device chip, and the one or more discrete passive devices laterally to one another.

19. The method of claim 1 , comprising:
arranging the pressure sensor chip, the at least one integrated passive device chip, and the one or more discrete passive devices vertically to one another.

Assignees

• Infineon Technologies Ag

Inventors

• Vaupel Mathias
• Boehm Matthias
• Gross Steven
• Loehndorf Markus
• Schmitt Stephan
• Theuss Horst
• Wietschorke Helmut

Classifications

• G01L19/148

  Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation · CPC title

• G01L19/14

  Housings {(G01L19/0007, G01L19/0084, G01L19/0092, G01L19/04, G01L19/06 take precedence)} · CPC title

• G01L19/0084 Primary

  to the outside of the housing (other details about the housing see G01L19/14) · CPC title

• G01L19/147

  Details about the mounting of the sensor to support or covering means · CPC title

• H10W90/753

  between laterally-adjacent chips · CPC title