Temperature calibration system comprising a valve in a closed fluidic system

US10677369B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10677369-B2
Application numberUS-201715668417-A
CountryUS
Kind codeB2
Filing dateAug 3, 2017
Priority dateAug 3, 2017
Publication dateJun 9, 2020
Grant dateJun 9, 2020

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Embodiments are directed to a temperature calibration system that includes a closed fluidic system, such as a thermosiphon or a heat pipe. The closed fluidic system includes a valve for fluidly separating components therein from each other. In one embodiment, the closed fluidic system is a thermosiphon (or a heat pipe) and the valve is configured, in a closed state, to cover a port of the condenser to fluidly separate the condenser from other components of the thermosiphon. The valve may be a passively activated valve or an electrically actuated valve. In some embodiments, the valve is thermally actuated such that the valve changes state in response to changes in temperature.

First claim

Opening claim text (preview).

The invention claimed is: 1. A temperature calibration system comprising: a temperature calibration unit configured to receive one or more device elements to be calibrated; and a closed fluidic system configured to remove heat from the temperature calibration unit, the closed fluidic system including a condenser and an evaporator, the closed fluidic system including a valve configured to fluidly decouple the condenser from the evaporator in a closed state and to fluidly couple the condenser to the evaporator in an open state. 2. The temperature calibration system of claim 1 , wherein the valve is located inside of the condenser and configured to cover a port of the condenser in the closed state. 3. The temperature calibration system of claim 1 , wherein the valve is a passive valve that expands and contracts to move between the closed state and the open state in response to changes in temperature. 4. The temperature calibration system of claim 3 , wherein the valve is a bi-material strip that includes a first material coupled to a second material, the first material having a different coefficient of thermal expansion than the second material. 5. The temperature calibration system of claim 4 , wherein the bi-material strip has a movable end that moves radially between the open state and the closed state. 6. The temperature calibration system of claim 3 , wherein the valve has a first end that is fixed to an inner surface of the condenser and a second end that is configured to expand and contract to place the valve in the closed state and the open state, respectively. 7. The temperature calibration system of claim 1 , wherein the valve is configured to be actuated in response to receiving an electrical signal. 8. The temperature calibration system of claim 1 , further comprising a stirling cooler coupled to the condenser of the closed fluidic system, the stirling cooler being configured to cool the condenser, wherein the valve is configured to fluidly decouple the condenser from the evaporator in the closed state to limit a temperature of the condenser and thereby protect the stirling cooler. 9. A temperature calibration system comprising: a temperature calibration unit; an evaporator on the temperature calibration unit, the evaporator having a port; a condenser having a port; a connecting tube having a first end coupled to the port of the evaporator and a second end coupled to the port of the condenser; a valve located in the condenser, the valve being configured to move between an open state that fluidly couples the condenser with the connecting tube, and a closed state that fluidly decouples the condenser from the connecting tube; and a cooling assembly coupled to the condenser, wherein the valve is configured to fluidly decouple the condenser from the evaporator in the closed state to limit a temperature of the condenser and thereby protect the cooling assembly. 10. The temperature calibration system of claim 9 , wherein the valve moves between the open state and the closed state in response to changes in temperature that cause a portion of the valve to move between the open state and closed state. 11. The temperature calibration system of claim 9 , wherein the valve is a strip located around an inner surface of the condenser, the strip including a movable end that when in the closed state covers the port of the condenser. 12. The temperature calibration system of claim 11 , wherein the movable end of the strip is curled inward and spaced from the inner surface of the condenser in the open state. 13. The temperature calibration system of claim 11 , wherein the movable end of the strip abuts the inner surface of the condenser in the open state. 14. The temperature calibration system of claim 9 , wherein the valve includes at least one thermally conductive material that includes a first end fixed to the condenser and a movable end that is movable and is configured to move the valve between the open state and the closed state in response to temperature changes inside of the condenser. 15. A method comprising: heating a temperature calibration unit; using a thermosiphon or heat pipe to remove heat from the temperature calibration unit, the thermosiphon or heat pipe including a condenser and an evaporator; using a stirling cooler to remove heat from the condenser; and in response to the condenser increasing in temperature above a threshold, fluidly decoupling the condenser from the evaporator in order to prevent damage to the stirling cooler. 16. The method of claim 15 , wherein fluidly decoupling the condenser from the evaporator comprises closing a valve at a port of the condenser to fluidly decouple the condenser from the evaporator. 17. The method of claim 16 , wherein fluidly decoupling the condenser from the evaporator comprises thermally expanding a material to cause a port of the condenser to be fluidly decoupled from the evaporator. 18. The method of claim 15 , wherein fluidly decoupling the condenser from the evaporator comprises providing an electrical signal to a valve to cause the valve to fluidly decouple the condenser from the evaporator. 19. The method of claim 16 , wherein the valve moves radially, circumferentially, or linearly in response to receiving the electrical signal. 20. The method of claim 16 , further comprising in response to a decrease in temperature below the threshold, fluidly coupling the condenser to the evaporator. 21. The method of claim 16 , wherein fluidly decoupling the condenser from the evaporator includes maintaining pressure relief between the condenser and the evaporator. 22. The temperature calibration system of claim 9 , comprising a pressure equalization port that is open when the valve is in the closed state. 23. The temperature calibration system of claim 22 , wherein the pressure equalization port is configured to relieve pressure in the evaporator. 24. The temperature calibration system of claim 1 , wherein the closed fluidic system includes a pressure equalization port that provides pressure relief for the evaporator.

Assignees

Inventors

Classifications

  • Control arrangements therefor · CPC title

  • Means for filling or sealing heat pipes · CPC title

  • with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers (F28D15/043 takes precedence) · CPC title

  • for preventing overheating, e.g. heat shields · CPC title

  • F16K31/002Primary

    actuated by temperature variation (thermo-electric F16K31/025) · CPC title

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What does patent US10677369B2 cover?
Embodiments are directed to a temperature calibration system that includes a closed fluidic system, such as a thermosiphon or a heat pipe. The closed fluidic system includes a valve for fluidly separating components therein from each other. In one embodiment, the closed fluidic system is a thermosiphon (or a heat pipe) and the valve is configured, in a closed state, to cover a port of the conde…
Who is the assignee on this patent?
Fluke Corp
What technology area does this patent fall under?
Primary CPC classification F28D15/0266. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue Jun 09 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 5 related publications on this page (citations in our corpus or others sharing the same primary CPC).