Heat conductive sheet

Patent metadata

Field	Value
Publication number	US-10676587-B2
Application number	US-201716316901-A
Country	US
Kind code	B2
Filing date	Jun 9, 2017
Priority date	Jul 26, 2016
Publication date	Jun 9, 2020
Grant date	Jun 9, 2020

Abstract

A heat conductive sheet comprising a cured product layer of a heat conductive silicone composition on one or both surfaces of a glass cloth sealed using a cured product of a heat conductive resin composition. The heat conductive silicone composition includes an organic silicon compound component and an aspherical heat conductive filler. The amount of the heat conductive filler is 250 to 600 parts by mass with respect to 100 parts by mass of the organic silicon compound component, and the heat conductive filler has a DOP oil absorption of not more than 80 ml/100 g. The heat conductive sheet can be continuously manufactured by coating molding and wound into a roll even with the use of an inexpensive aspherical heat conductive filler, and has high heat conductivity, low thermal contact resistance, and high insulating properties.

First claim

The invention claimed is:

1. A heat-conductive sheet comprising a glass cloth sealed with a cured heat-conductive resin composition and, on one or both sides of the sealed glass cloth, a cured layer of a heat-conductive silicone composition, wherein
the heat-conductive silicone composition comprises an organosilicon compound component and a non-spherical heat-conductive filler, the amount of the non-spherical heat-conductive filler being from 250 to 600 parts by weight per 100 parts by weight of the organosilicon compound component and the non-spherical heat-conductive filler having a DOP oil absorption of 80 mL/100 g or less, and
the non-spherical heat-conductive filler comprises:
(1) from 100 to 500 parts by weight per 100 parts by weight of the organosilicon compound component of an aluminum hydroxide powder having an average particle size of from 5 to 14 μm and a DOP oil absorption of 50 mL/100 g or less, and
(2) from 50 to 400 parts by weight per 100 parts by weight of the organosilicon compound component of an aluminum hydroxide powder having an average particle size of from 0.5 to 3 μm and a DOP oil absorption of 80 mL/100 g or less, wherein
an amount of the aluminum hydroxide powder having the average particle size of from 5 to 14 μm and the DOP oil absorption of 50 mL/100 g or less is at least 40 wt % based on the total amount of the non-spherical heat-conductive filler.

2. The heat-conductive sheet of claim 1 , wherein the non-spherical heat-conductive filler in the heat-conductive silicone composition has an amount of particles at least 45 μm in size of from 0 to 0.5 wt % and an amount of particles at least 75 μm in size of from 0 to 0.01 wt %.

3. The heat-conductive sheet of claim 1 , wherein the organosilicon compound component in the heat-conductive silicone composition comprises:
(A) an organopolysiloxane, which has at least two silicon-bonded alkenyl groups per molecule, represented by the following average compositional formula (1):
R 1 a SiO (4-a)/2   (1)

wherein each R 1 is independently a substituted or unsubstituted monovalent hydrocarbon group of 1 to 10 carbon atoms, and the subscript a is from 1.90 to 2.05.

4. The heat-conductive sheet of claim 3 , wherein the organosilicon compound component in the heat-conductive silicone composition further comprises (D) one or more selected from the group consisting of:
(D1) alkoxysilanes represented by the following formula (2):
R 2 b R 3 c Si(OR 4 ) 4-b-c   (2)

wherein each R 2 is independently an alkyl group of 6 to 15 carbon atoms, each R 3 is independently a substituted or unsubstituted monovalent hydrocarbon group of 1 to 12 carbon atoms, each R 4 is independently an alkyl group of 1 to 6 carbon atoms, b is an integer from 1 to 3, c is 0, 1 or 2, and the sum b+c is from 1 to 3; and
(D2) dimethylpolysiloxanes, which are capped at one end with a trialkoxysilyl group, represented by the following formula (3):

wherein each R 5 is independently an alkyl group of 1 to 6 carbon atoms, and d is an integer from 5 to 100.

5. The heat-conductive sheet of claim 4 , wherein the amount of component (D) is from 0.01 to 30 wt % of the total amount of the organosilicon compound component in the heat-conductive silicone composition.

6. The heat-conductive sheet of claim 1 , wherein the glass cloth layer has a thickness of 60 μm or less and the heat-conductive sheet has an overall thickness which is from 130 to 900 μm when the sheet has the cured layer of heat-conductive silicone composition on both sides of the sealed glass cloth, and from 80 to 500 μm when the sheet has the cured layer of heat-conductive silicone composition on one side of the sealed glass cloth.

7. The heat-conductive sheet of claim 1 , wherein the cured heat-conductive silicone composition has a thermal conductivity of at least 1.2 W/m·K.

8. The heat-conductive sheet of claim 1 , wherein the cured heat-conductive silicone composition has a Durometer A hardness of from 60 to 96.

9. The heat-conductive sheet of claim 1 , wherein a thermal resistance at a total heat-conductive sheet thickness of 0.2 mm, as measured in accordance with ASTM D5470 at 50° C. and 100 psi, is 2.5 cm 2 ·K/W or less.

10. The heat-conductive sheet of claim 1 , wherein a dielectric breakdown voltage in air at a total heat-conductive sheet thickness of 0.2 mm, as measured in accordance with JIS K6249, is at least 4 kV.

Assignees

• Shinetsu Chemical Co

Inventors

• Endo Akihiro
• Ishihara Yasuhisa
• Tsuchiya Toru
• Yamaguchi Hisaharu
• Moteki Masahiro
• Maruyama Takahiro

Classifications

• C08L2203/20

  use in electrical or conductive gadgets · CPC title

• C08K7/00

  Use of ingredients characterised by shape · CPC title

• H05K7/20

  Modifications to facilitate cooling, ventilating, or heating · CPC title

• C08L2205/035

  containing four or more polymers in a blend · CPC title

• B32B27/283

  comprising polysiloxanes · CPC title