Laser process monitoring

Patent metadata

Field	Value
Publication number	US-10675709-B2
Application number	US-201615331226-A
Country	US
Kind code	B2
Filing date	Oct 21, 2016
Priority date	Oct 23, 2015
Publication date	Jun 9, 2020
Grant date	Jun 9, 2020

Abstract

A method and a device for monitoring laser cutting processes in the high-power range above 1 kW mean output envisage automatic quality control after interruption and/or completion of a cutting process carried out with predetermined cutting parameters. The cutting process is interrupted after a first partial processing step, whereupon a partial section (K1 . . . KX) of the processing path is scanned. This preferably takes place at a higher speed than that for the first partial processing procedure and preferably close to or on the same processing path. On the basis of the scan result at least one quality feature of the processing result is automatically determined and compared with predefined quality specifications. Depending on the result of the comparison a fault message can then be issued, the processing interrupted, reworking of a defect point carried out, at least one cutting parameter adjusted and the cutting process continued with the changed set of cutting parameters.

First claim

The invention claimed is:

1. A method of monitoring laser cutting processes in the high-power range above 1 kW mean output, wherein after interruption and/or completion of a cutting process carried out with predetermined cutting parameters quality control is automatically carried out, wherein the cutting process is interrupted after a first partial processing step, wherein at least a partial section (K 1 , . . . KX) of the processing section cut during the first partial processing step is scanned at a higher speed than that of the laser cutting of the first partial processing step and f>H′>h′>frJ3+y close to or on the same processing path, wherein on the basis of the scan result at least one quality feature of the processing result is determined and compared with predefined quality specifications, wherein quality characteristic comprises a slag residue (S) in a cutting gap on the machining path, a cutting gap width and a cutting gap roughness, and compared with predefined quality standards, wherein depending on the result of the comparison one of the following measures is carried out: issuing of a fault message, discontinuation of the cutting process, adaptation of at least one of the cutting parameters, reworking of one or more defect points, continuation of the cutting process, with the changed set of cutting parameters.

2. The method according to claim 1 , wherein for the cutting process at least at times an online process monitoring procedure is additionally carried out, wherein depending on the result of the comparison, if need be an adjustment of at least one monitoring parameter of the on-line process monitoring procedure and/or continuation of the cutting process with the adjusted set of on-line monitoring parameters takes place.

3. The method according to claim 1 , wherein after continuation of the cutting process this is again interrupted after a further partial processing step (K 2 . . . KX), at least a partial section of the further processing section is scanned at a higher speed than that of the laser cutting of the further partial processing step and close to or on the same processing path,
wherein during this at least one quality feature of the processing result is automatically determined and compared with predefined quality specifications, and
wherein depending on the result of the comparison at least one of the following measures is carried out: issuing of a fault message, discontinuation of the cutting process, adaptation of at least one of the cutting parameters, adjustment of at least one monitoring parameter of an online process monitoring system, reworking of one or more defect points, continuation of the cutting process, with the changed set of cutting parameters or with the adjusted set of online monitoring parameters.

4. The method according to claim 1 , wherein the processing steps are carried out several times during the course of the cutting process, wherein the entire cutting process, wherein the entire cutting process comprises a complete cutting plan for a plurality of workpieces (W) and each partial processing step maximally the cutting plan for one of the workpieces (W), or at least a part of the cutting plan for one workpiece.

5. The method according to claim 1 , wherein the interruption of the cutting process takes place after a partial processing section (K 1 . . . KX) with a predetermined cutting length.

6. The method according to claim 5 , wherein depending on the comparison of the at least one quality feature or quality defect, in particular kerf width (d), cutting surface roughness (R) and not completely cut through contour areas, as well as slag residue (S) with the quality specifications at least one of the cutting parameters selected from forward movement, laser power, focus position and cutting gas pressures is automatically adjusted.

7. The method according to claim 5 , wherein the length of the partial processing section (K 1 . . . KX) and/or of the scanned partial section thereof is selected as a function of changing properties of the laser cutting device or the geometry of the cutting path.

8. The method according to claim 1 , wherein the number and/or the selection of the partial processing sections (K 1 . . . KX) can be preselected, wherein the processing section (K) is processed without the partial processing section or wherein cutting process (K) only has one partial processing section and/or wherein partial processing procedures are only carried out on a partial quantity of the processing sections (K) or workpieces (W).

9. The method according to claim 1 , wherein the first partial processing step and scanning procedure or the first group of partial processing procedures and scanning procedures take(s) place upstream of the actual processing procedure as a calibration and reference step and depending on the results of the comparison of the measured quality features with the quality specifications for at least one cutting parameter its value is adjusted for the subsequent actual processing procedure, wherein partial calibration procedures with different cutting parameter settings are carried out one after the other and/or within a partial processing procedure one or more cutting parameters are adjusted, wherein after the partial processing procedures the quality features are automatically determined and after the completion of the calibration procedure subsequent actual process is carried out either with adjusted cutting parameters and/or adjusted monitoring parameters.

10. The method according to claim 1 , wherein at least one partial procedure of the cutting process is monitored by an online processing monitoring method and wherein the method of monitoring laser cutting processes is triggered and carried out as a function of the result of the online process monitoring method.

11. The method according to claim 9 , wherein at least one calibration procedure with changing cutting parameter settings is carried out and monitored by means of an online process monitoring method, wherein a concordance of the determined quality features of the processing result with the used cutting parameter settings and with characteristics of the signals of the online processing monitoring system is drawn up and stored for use in the latter.

12. The method according to claim 1 , wherein a processing procedure is carried out with time-consecutive variations of several processing parameters and the processing procedure is regulated by way of a controllable process parameter as a function of at least one quality feature of the processing results assessed by means of an online process-monitoring method and feedback from the measurements relating to the same quality feature(s), wherein the method is used on all the partial processing areas or only on partial sections of the partial processing areas.

13. The method according to claim 12 , wherein algorithms of the online process monitoring method and their parameterization are continually adapted by occasional feedback.

Assignees

• Bystronic Laser Ag

Inventors

• Lüdi Andreas
• Bader Roland

Classifications

• B23K31/125

  Weld quality monitoring · CPC title

• B23K26/0626

  Energy control of the laser beam (B23K26/0622 takes precedence) · CPC title

• B23K26/38

  by boring or cutting · CPC title

• B23K31/00

  Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups B23K1/00 - B23K28/00 · CPC title

• B23K26/032 Primary

  using optical means · CPC title