Compound for metal powder injection molding, metal powder molded body, method for producing sintered body, and sintered body

Patent metadata

Field	Value
Publication number	US-10675682-B2
Application number	US-201815902338-A
Country	US
Kind code	B2
Filing date	Feb 22, 2018
Priority date	Feb 24, 2017
Publication date	Jun 9, 2020
Grant date	Jun 9, 2020

Abstract

A compound for metal powder injection molding includes secondary particles in which first metal particles are bound to one another, and a matrix region including a binder and second metal particles composed of the same constituent material as the first metal particles and having a smaller average particle diameter than the first metal particles. The constituent material of the first metal particles is any of an Fe-based alloy, an Ni-based alloy, and a Co-based alloy.

First claim

What is claimed is:

1. A compound for metal powder injection molding, comprising:
first metal particles bound to one another to form secondary particles, the first metal particles being bound to one another and collectively encapsulated by a first binder; and
second metal particles dispersed within a second binder to form a mixture;
the secondary particles being mixed into the mixture such that the secondary particles are bound together and collectively encapsulated by the second binder;
the second binder being different from the first binder;
the second metal particles being composed of a same constituent material as the first metal particles; and
the second metal particles having a smaller average particle diameter than the first metal particles.

2. The compound for metal powder injection molding according to claim 1 , wherein the constituent material of the first metal particles is any of an Fe-based alloy, an Ni-based alloy, and a Co-based alloy.

3. The compound for metal powder injection molding according to claim 1 , wherein the first metal particles are bound to one another in the secondary particles via a second binder.

4. The compound for metal powder injection molding according to claim 1 , wherein the first metal particles in the secondary particles are adhered to one another.

5. The compound for metal powder injection molding according to claim 1 , wherein the secondary particles are dispersed in the mixture of the second metal particles and the binder.

6. A metal powder molded body, comprising:
granulated particles; and
secondary particles molded with the granulated particles,
the secondary particles being composed of first metal particles that are bound to one another and collectively encapsulated by a first binder; and
the granulated particles being composed of second metal particles and a second binder, the secondary particles being dispersed throughout and entirely encapsulated by the second binder, the second metal particles being composed of a same constituent material as the first metal particles, the second metal particles having a smaller average particle diameter than the first metal particles.

7. A sintered body, comprising:
a plurality of first portions that each include a sintered material of first metal particles; and
a second portion that entirely encapsulates each of the plurality of first portions, the second portion including a sintered material of second metal particles composed of a same constituent material as the first portion, the second metal particles having a smaller average crystal grain diameter than the first portion.

Assignees

• Seiko Epson Corp

Inventors

• Nakamura Hidefumi
• Hideshima Yasutoshi

Classifications

• B22F9/026

  Spray drying of solutions or suspensions · CPC title

• B22F2301/35

  Iron · CPC title

• B22F7/06

  of composite workpieces or articles from parts, e.g. to form tipped tools {(B22F7/002 takes precedence)} · CPC title

• B22F3/24

  After-treatment of workpieces or articles {(B22F3/1146 takes precedence)} · CPC title

• B22F2001/0066

  Operations & Transport · mapped topic