Cooling module, cooling module mounting board and electronic device
US-2016073548-A1 · Mar 10, 2016 · US
Immersion cooling systems and methods
US10674641B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10674641-B2 |
| Application number | US-201615090049-A |
| Country | US |
| Kind code | B2 |
| Filing date | Apr 4, 2016 |
| Priority date | Apr 4, 2016 |
| Publication date | Jun 2, 2020 |
| Grant date | Jun 2, 2020 |
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- Title
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- Abstract
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Abstract
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An electronics cooling arrangement includes a housing, an electronic device disposed within the housing, and a solid-liquid phase change material disposed within the housing and is in thermal communication with the electronic device to absorb heat generated by the electronic device. A method of cooling an electronic device and a vehicular electronics cooling system are also described.
First claim
Opening claim text (preview).
What is claimed is: 1. An electronics cooling arrangement, comprising: a sealed housing; a liquid-vapor phase dielectric coolant contained within the sealed housing; an electronic device including a printed circuit board (PCB) disposed within the sealed housing and submerged with the liquid-vapor phase coolant, wherein the PCB has an exposed conductor submerged within the liquid vapor-phase dielectric coolant and in direct mechanical contact with the liquid-vapor phase dielectric coolant; and a solid-liquid phase change material (PCM) disposed within the sealed housing at least partially submerged within the liquid-vapor phase dielectric coolant and in thermal communication with the electronic device, wherein the solid-liquid PCM is configured to absorb heat generated by the electronic device, wherein solid-liquid PCM is in direct contact with the liquid-vapor phase dielectric coolant disposed within the housing. 2. The electronics cooling arrangement as recited in claim 1 , wherein the solid-liquid PCM is fully submerged within the liquid-vapor phase coolant disposed within the housing. 3. The electronics cooling arrangement as recited in claim 1 , wherein the solid-liquid PCM is partially submerged within the liquid-vapor phase coolant disposed within the housing. 4. The electronics cooling arrangement as recited in claim 1 , wherein the solid-liquid PCM includes wax body. 5. The electronics cooling arrangement as recited in claim 1 , wherein the housing and a liquid-vapor phase coolant disposed within the housing define therebetween an ullage space, a condenser being disposed within the ullage space, and a portion of the solid-liquid PCM being disposed within the ullage space. 6. The electronics cooling arrangement as recited in claim 5 , further including a heat exchanger disposed on a side of the ullage space opposite the condenser. 7. The electronics cooling arrangement as recited in claim 1 , wherein the electronic device comprises at least one of a capacitor, a heat sink, and a solid-state power converter. 8. The electronics cooling arrangement as recited in claim 1 , wherein the housing has a fixed volume. 9. The electronics cooling arrangement as recited in claim 1 , wherein the PCM is free-floating within the liquid-vapor phase coolant disposed within the housing. 10. The electronics cooling arrangement as recited in claim 1 , wherein the housing and a liquid-vapor phase coolant disposed within the housing define therebetween an ullage space, a condenser being disposed within the ullage space, and a portion of the solid-liquid PCM being disposed within the ullage space.
Assignees
Inventors
Classifications
- H05K7/20936Primary
Liquid coolant with phase change · CPC title
by immersion · CPC title
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Frequently asked questions
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- What does patent US10674641B2 cover?
- An electronics cooling arrangement includes a housing, an electronic device disposed within the housing, and a solid-liquid phase change material disposed within the housing and is in thermal communication with the electronic device to absorb heat generated by the electronic device. A method of cooling an electronic device and a vehicular electronics cooling system are also described.
- Who is the assignee on this patent?
- Hamilton Sundstrand Corp
- What technology area does this patent fall under?
- Primary CPC classification H05K7/20936. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jun 02 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).