Fan-less chiller-less liquid-air cooling for electronic racks of it components in data centers

Patent metadata

Field	Value
Publication number	US-10674635-B2
Application number	US-201715526313-A
Country	US
Kind code	B2
Filing date	May 5, 2017
Priority date	May 5, 2017
Publication date	Jun 2, 2020
Grant date	Jun 2, 2020

Abstract

A data center cooling system includes a housing to contain electronic racks of IT components operating therein, a coolant distribution unit (CDU) situated within the housing to control a liquid flow of a cooling liquid. One or more liquid cooling devices are disposed on the IT components to receive a first liquid from the CDU, to exchange or extract heat generated from the IT components, to transform the first liquid to a second liquid with a higher temperature, and to transmit the second liquid back to the CDU. The CDU is coupled to a heat transfer system to dissipate the exchanged heat to an external environment. The data center cooling system includes an airflow delivery system to generate a direct or indirect airflow to travel through the servers of the electronic racks to remove heat generated by the servers to the external environment eliminating chiller and IT fans.

First claim

What is claimed is:

1. A data center system, comprising:
a housing to house a plurality of electronic racks of information technology (IT) components operating therein, each of the electronic racks including:
a heat removal liquid manifold assembly to provide heat removal liquid, the heat removal liquid manifold coupled to a coolant distribution unit (CDU) situated within the housing to control a liquid flow of a cooling liquid, wherein the heat removal liquid manifold is mounted on a backend of the respective electronic rack and the CDU is shared between the plurality of electronics racks;
a plurality of server blades contained in a plurality of server slots respectively, each server blade including one of the IT components representing a server therein, wherein each server blade is coupled to the heat removal liquid manifold modularly, such that a server blade can be removed from the electronic rack without affecting the operations of remaining server blades, to receive cooler liquid from the heat removal liquid manifold to remove heat generated by the IT component and to transmit warmer liquid carrying the heat exchanged from the IT component back to the heat removal liquid manifold;

one or more cooling devices disposed on the IT components to receive a first liquid from the CDU, to exchange heat generated from the IT components using the first liquid, to transform the first liquid into a second liquid with a higher temperature, and to transmit the second liquid carrying the exchanged heat back to the CDU to form a first liquid loop, wherein the one or more CDUs couples the first liquid loop to a heat dissipating system to carry the exchanged heat to the external environment outside of the housing without a chiller unit; and
an airflow delivery system to generate an airflow from a cooler/colder external environment, to cause the airflow to travel through the servers of the electronic racks to exchange heat generated by the servers due to operations of the servers, and to exhaust the airflow carrying the exchanged heat back to the external environment outside of the housing.

2. The data center system of claim 1 , wherein the airflow delivery system comprises an air filtration system to receive cool air from an external environment of the housing and to deliver the cool air to flow within an airspace between the IT components, generating warm air.

3. The data center system of claim 2 , wherein the airflow delivery system comprises an air exhaust fan to remove the warm air within the housing to an external environment of the housing, such that server fans and rack fans are eliminated, wherein the exhaust air has a higher temperature than the external environment.

4. The data center system of claim 3 , wherein the air filtration system is situated on a first side of the housing to receive cool air from the first side of the housing, wherein the air exhaust fan is situated on a second side of the housing to cause the airflow to travel from the first side through the IT components of the electronic racks to the second side of the housing.

5. The data center system of claim 1 , wherein the CDU comprises:
a heat exchanger to exchange heat carried by the warmer liquid with an external cooler liquid supplied by an external heat removal system;
a liquid pump to pump the cooler liquid into the heat removal liquid manifold;
a pump controller coupled to the liquid pump; and
a liquid reservoir coupled to the liquid pump.

6. The data center system of claim 5 , wherein the pump controller controls liquid flow rate based on a temperature of the IT components.

7. The data center system of claim 5 , wherein the pump controller controls liquid flow rate based on a workload of the IT components.

8. The data center system of claim 1 , wherein the one or more cooling devices are one or more liquid cold plates mounted on the IT components.

Assignees

• Baidu Usa Llc
• Baidu Com Times Tech Beijing Co Ltd

Inventors

• Gao Tianyi
• Cui Yan
• Sun Xiaogang
• Heydari Ali

Classifications

• H05K7/20836

  Thermal management, e.g. server temperature control · CPC title

• H05K7/20772 Primary

  within server blades for removing heat from heat source · CPC title

• H05K7/20745 Primary

  within rooms for removing heat from cabinets, e.g. by air conditioning device · CPC title

• H05K7/2079 Primary

  within rooms for removing heat from cabinets · CPC title

• H05K7/20736 Primary

  within cabinets for removing heat from server blades · CPC title