Optical sensor module and sensor chip thereof

Patent metadata

Field	Value
Publication number	US-10672937-B2
Application number	US-201715646533-A
Country	US
Kind code	B2
Filing date	Jul 11, 2017
Priority date	Sep 2, 2015
Publication date	Jun 2, 2020
Grant date	Jun 2, 2020

Abstract

An optical sensor module and a sensor chip thereof are provided. The optical sensor module includes a substrate, a sensor chip and a passive chip. The sensor chip is disposed on the substrate, and the sensor chip includes a chip body having an active region located at a top side thereof and a recess portion depressed from a top surface of the chip body. The passive chip is accommodated in the recess portion, and a depth of the recess portion is greater than a thickness of the passive chip.

First claim

What is claimed is:

1. An optical sensor module comprising:
a substrate; and
a sensor chip disposed on the substrate, wherein the sensor chip includes a chip body having an active region located at a top side thereof and a recess portion depressed from a top surface of the chip body; and
a light-emitting component accommodated in the recess portion, wherein a depth of the recess portion is greater than a thickness of the light-emitting component;
wherein the sensor chip further includes a multi-functional structure disposed on an inner surface of the recess portion, and the light-emitting component is electrically connected to the substrate by the multi-functional structure.

2. The optical sensor module according to claim 1 , wherein the multi-functional structure includes at least one metal layer disposed on a sidewall surface of the recess portion and surrounding the light-emitting component for preventing the active region from receiving the light emitted by the light-emitting component, for electrically connecting the light-emitting component to the substrate, and for reflecting the light emitted by the light-emitting component.

3. The optical sensor module according to claim 1 , wherein the multi-functional structure includes a shielding layer disposed on a sidewall surface of the recess portion and located between the light-emitting component and the active region for preventing the active region from receiving the light emitted by the light-emitting component.

4. The optical sensor module according to claim 1 , wherein the multi-functional structure includes a redistribution layer for electrically connecting the light-emitting component to the substrate.

5. The optical sensor module according to claim 4 , wherein the redistribution layer includes a first conductive portion and a second conductive portion insulated from each other.

6. The optical sensor module according to claim 5 , wherein the light-emitting component has a first terminal and a second terminal, and the first terminal and the second terminal are respectively electrically connected to the first conductive portion and the second conductive portion by wire bonding or flip-chip bonding.

7. The optical sensor module according to claim 1 , wherein the multi-functional structure includes a reflective layer disposed on a sidewall surface of the recess portion for reflecting light emitted by the light-emitting component.

8. The optical sensor module according to claim 1 , wherein the sensor chip further comprises a protective material disposed in the recess portion for encapsulating the light-emitting component.

9. The optical sensor module according to claim 8 , wherein the protective material is transparent to the light emitted by the light-emitting component.

10. The optical sensor module according to claim 1 , wherein the recess portion is spaced from all of side surfaces of the chip body.

11. The optical sensor module according to claim 1 , wherein the depth of the recess portion is less than a thickness of the chip body.

12. The optical sensor module according to claim 1 , wherein the recess portion is spaced from the active region by a distance ranging from 0.5 cm to 1 cm.

13. The optical sensor module according to claim 1 , wherein the sensor chip includes a plurality of internal conductive plugs penetrating through the chip body so as to electrically connect the active region to the substrate.

14. A sensor chip comprising a chip body having an active region located at a top side thereof and a recess portion depressed from a top surface thereof for accommodating a light-emitting component, wherein the recess portion has a depth greater than a thickness of the light-emitting component, the sensor chip further comprises a multi-functional structure disposed on an inner surface of the recess portion for connecting the light-emitting component to a substrate, the recess portion is spaced from all of side surfaces of the chip body, the multi-functional structure includes a redistribution layer, the redistribution layer includes a first conductive portion and a second conductive portion that are insulated from each other.

15. The sensor chip according to claim 14 , wherein the multi-functional structure includes a shielding layer disposed on a sidewall surface of the recess portion and located between the light-emitting component and the active region for preventing the active region from receiving light emitted by the light-emitting component.

16. The sensor chip according to claim 14 , wherein the multi-functional structure includes a conductive layer for electrically connecting the light-emitting component to the substrate.

17. The sensor chip according to claim 14 , wherein the multi-functional structure includes a reflective layer disposed on a sidewall surface of the recess portion for reflecting light emitted by the light-emitting component.

18. The sensor chip according to claim 14 , further comprising a protective material disposed in the recess portion for encapsulating the light-emitting component.

19. The sensor chip according to claim 14 , further a plurality of internal conductive plugs penetrating through the chip body, one of the internal conductive plugs being electrically connected to the active region.

Assignees

• Pixart Imaging Inc

Inventors

• Shen Chi-Chih

Classifications

• A61B5/14551

  for measuring blood gases · CPC title

• H01L31/02164

  Electricity · mapped topic

• H01L24/13

  Electricity · mapped topic

• H01L31/02005

  Electricity · mapped topic

• H01L2224/16225

  Electricity · mapped topic