Method of performing analysis of pattern defect, imprint apparatus, and article manufacturing method

Patent metadata

Field	Value
Publication number	US-10672673-B2
Application number	US-201715451759-A
Country	US
Kind code	B2
Filing date	Mar 7, 2017
Priority date	Mar 10, 2016
Publication date	Jun 2, 2020
Grant date	Jun 2, 2020

Abstract

There is provided a method of performing an analysis of a defect in a pattern of an imprint material on a substrate that has undergone an imprint process of transferring a pattern of a mold onto the substrate. The method includes obtaining a defect distribution of the pattern on the substrate, obtaining map information indicating an arrangement of the imprint material on the substrate, and determining a type of a defect based on a relationship between a position of the defect in the defect distribution and a position of a gap in the imprint material generated in a process of spreading the imprint material by the imprint process, wherein the position of the gap is predicted based on the map information.

First claim

What is claimed is:

1. A method of performing an analysis of a defect in a pattern of an imprint material on a substrate during an imprint process, the method comprising:
contacting a pattern of a mold and the imprint material on the substrate to form the pattern of the imprint material on the substrate;
obtaining a defect distribution of the pattern of the imprint material on the substrate;
obtaining map information indicating an arrangement of the imprint material on the substrate; and
determining a type of a defect based on a relationship between a position of the defect in the defect distribution and a position of a gap in the imprint material generated in spreading the imprint material by the imprint process on the substrate, wherein the position of the gap is predicted based on the map information.

2. The method according to claim 1 , wherein the determining the type of the defect includes determining that the defect is caused by insufficient filling of the imprint material when a distance between the position of the defect and the position of the gap is within a threshold.

3. The method according to claim 2 , wherein the determining the type of the defect further includes determining that the defect is caused by adhesion of foreign particles when the distance is not within the threshold.

4. A method of performing an analysis of a defect in a pattern of an imprint material on a substrate, the method comprising:
contacting a pattern of a mold and the imprint material on the substrate to form the pattern of the imprint material on the substrate;
obtaining a defect distribution of the pattern of the imprint material on the substrate;
calculating a defect repetition cycle in the defect distribution;
dividing the defect distribution into regions by a unit cell having a size of the calculated repetition cycle;
calculating a defect density distribution in the unit cell by superimposing the defect distribution divided into the regions; and
determining a defect type in the defect distribution based on the calculated defect density distribution.

5. The method according to claim 4 , wherein the determining the type of the defect includes determining that the defect is caused by insufficient filling of the imprint material if the defect belongs to a high density region in the defect density distribution.

6. The method according to claim 5 , wherein the determining the type of the defect further includes determining that the defect is caused by adhesion of foreign particles if the defect does not belong to the high density region.

7. An article manufacturing method comprising:
performing, using an imprint apparatus, an imprint process of transferring a pattern of a mold onto a substrate by bringing the pattern of the mold into contact with an imprint material on the substrate and curing the imprint material;
processing the substrate on which the imprint process has been performed, and
manufacturing the article from the processed substrate,
wherein the imprint apparatus includes
an arrangement unit configured to arrange the imprint material in a shot region on the substrate, and
a controller,
the controller is configured to:
obtain a defect distribution of the pattern on the substrate,
obtain map information indicating an arrangement of the imprint material on the substrate, and
determine a type of a defect based on a relationship between a position of the defect in the defect distribution and a position of a gap in the imprint material generated in a process of spreading the imprint material by the imprint process, wherein the position of the gap is predicted based on the map information.

Assignees

• Canon Kk

Inventors

• Baba Norikazu
• Yamamoto Kiyohito

Classifications

• G05B19/41875

  characterised by quality surveillance of production · CPC title

• G05B2219/32194

  Quality prediction · CPC title

• Y02P90/22

  Cross-Sectional Technologies · mapped topic

• H01L21/0271

  Electricity · mapped topic

• G03F7/0002 Primary

  Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping · CPC title