Illuminated multilayer structure with embedded light sources

Patent metadata

Field	Value
Publication number	US-10670800-B2
Application number	US-201816155956-A
Country	US
Kind code	B2
Filing date	Oct 10, 2018
Priority date	Apr 13, 2016
Publication date	Jun 2, 2020
Grant date	Jun 2, 2020

Abstract

An electronic device includes a substrate film having a first side and a second side, and a number of light sources configured to emit light. A plastic lightguide layer is molded onto the first side of the substrate film. The plastic lightguide layer being of optically at least translucent material to transmit light. The device also includes a masking layer provided on the outer surface of the plastic lightguide layer. The masking layer defines a window for letting the light emitted by the embedded light sources to pass through the masking layer towards the environment.

First claim

The invention claimed is:

1. A multilayer assembly for an electronic device comprises:
a flexible substrate film configured to accommodate electronics on at least a first side thereof, the substrate film having the first side and a second side, the substrate film including at least one material selected from the group consisting of: thermoplastic material, PMMA (Polymethyl methacrylate), Poly Carbonate (PC), polyimide, a copolymer of Methyl Methacrylate and Styrene (MS resin), glass, organic material, fibrous material, Polyethylene Terephthalate (PET), and metal, the substrate film including a three-dimensional, non-planar shape such that the substrate film has different thicknesses along a length thereof;
conductive traces printed by means of printed electronics technology on the first side of the substrate film,
light sources provided on the first side of the substrate film and configured to emit light of predetermined frequency or frequency band, including or substantially limiting to visible light,
a molded plastic lightguide layer provided onto the first side of the substrate film and at least partially embedding the light sources, the plastic lightguide layer being of optically at least one of translucent, at least one substantially transparent, material having regard to the predetermined frequency or band, wherein the plastic lightguide layer is configured to transmit light emitted by the embedded light sources so that the transmitted light propagates within the lightguide layer and is outcoupled from the plastic lightguide layer via an outer surface thereof substantially opposite to the embedded light sources, and
a masking layer provided on the outer surface of the plastic lightguide layer, containing substantially opaque material to block external view of at least some internals of the multilayer assembly including the light sources, wherein the masking layer defines a window for letting the light emitted by the embedded light sources and propagated within the plastic lightguide layer to pass through the masking layer towards the environment,
the light sources, masking layer and related window being mutually configured such that there is substantially no direct line-of-sight (LOS) path at least within a selected viewing angle from outside the assembly, including zero angle from the surface normal of the masking layer, to the light sources and optionally further electronics through the window.

2. The assembly of claim 1 , further comprising a protective cover layer on the masking layer.

3. The assembly of claim 2 , wherein the cover layer is of substantially optically transparent material having regard to the frequency or frequency band of the light sources, or defines a window of no material, such as a through-hole, or of substantially optically translucent or transparent material having regard to the frequency or band of the light sources.

4. The assembly of claim 1 , further comprising a bottom layer on the second side of the substrate film.

5. The assembly of claim 4 , wherein the bottom layer comprises or is established by an attaching feature, including adhesive or a mechanical fixing structure, for securing the assembly to a host device or host element.

6. The assembly of claim 1 , wherein the window is a through-hole.

7. The assembly of claim 1 , wherein the window comprises substantially translucent or transparent material having regard to said frequency or band.

8. The assembly of claim 1 , wherein the window defines an optical diffuser.

9. The assembly of claim 1 , wherein the window defines at least one illuminated element selected from the group consisting of: graphical pattern, text, symbol, number, and figure.

10. The assembly of claim 1 , wherein the illuminance, luminance or luminous intensity associated with the window is substantially constant to provide uniform illumination to the environment.

11. The assembly of claim 1 , wherein the substrate film contains optically substantially translucent or transparent material having regard to said frequency or band.

12. The assembly of claim 1 , configured for at least one of substantially internal reflection—or at least one of substantially total internal reflection, based propagation of light therewithin between the light sources and the window.

13. The assembly of claim 1 , wherein the plastic lightguide layer includes at least one material selected from the group consisting of: PC, PMMA, ABS, PET, nylon (PA, polyamide), polypropylene (PP), polystyrene (GPPS), and MS resin.

14. The assembly of claim 1 , wherein the electronics located on the substrate comprise at least one element selected from the group consisting of: conductive trace, printed conductive trace, contact pad, component, integrated circuit (chip), processing unit, memory, communication unit, transceiver, transmitter, receiver, signal processor, microcontroller, battery, light emitting device, light sensing device, photodiode, connector, electrical connector, optical connector, diode, OLED (Organic LED), printed electronic component, sensor, force sensor, antenna, accelerometer, gyroscope, capacitive switch or sensor, electrode, sensor electrode, printed sensor electrode, and photovoltaic cell.

15. A method of establishing a multilayer assembly for an electronic device comprising:
obtaining a preferably flexible substrate film configured to accommodate electronics on at least a first side thereof, said film having the first side and a second side;
printing by means of printed electronics technology, a number of conductive traces on the first side of the substrate film;
providing a number of light sources on the first side of the substrate film, said light sources being configured to emit light of predetermined frequency or frequency band;
molding a plastic lightguide layer onto the first side of the substrate and thereby at least partially embedding the light sources, the plastic lightguide layer being of optically at least translucent material having regard to the predetermined frequency or band of light, whereupon the plastic lightguide layer is configured to transmit light emitted by the embedded light sources so that the transmitted light propagates within the lightguide layer and is outcoupled from the lightguide layer via an outer surface thereof substantially opposite to the embedded light sources;
providing a masking layer on the outer surface of the lightguide layer containing substantially opaque material to block external view of at least some internals of the multilayer structure including the light sources, wherein the masking layer defines a window for letting the light emitted by the embedded light sources and propagated within the lightguide layer to pass through the masking layer towards the environment, the light sources, masking layer and related window being mutually configured such that there is substantially no direct line-of-sight path at least within a selected viewing angle from outside the assembly to the light sources and optionally further electronics through the window; and
providing a further film for establishing either the masking layer or a layer between the masking layer and lightguide layer, and the substrate film within a mold, each against opposing mold halves, and molding thermoplastic material for forming the plastic lightguide layer between the two films.

16. The method of claim 15 , wherein the further film contains or is processed to contain a through-hole for the window.

17. The method of claim 15 , wherein the further film contains or is processed to contain a surface feature, at least one selected fr

Assignees

• Tactotek Oy

Inventors

• Keränen Antti
• Heikkinen Mikko

Classifications

• G02B6/0055

  Reflecting element, sheet or layer · CPC title

• G02B6/0065

  Manufacturing aspects; Material aspects · CPC title

• H05K3/284

  for encapsulating mounted components (H05K1/185 takes precedence) · CPC title

• H05K2201/10106

  Light emitting diode [LED] · CPC title

• H05K1/0274 Primary

  Optical details, e.g. printed circuits comprising integral optical means (H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42) · CPC title