Semiconductor-component device assembled on a heat sink, assembly method, and lighting device for a motor vehicle including such a device

Patent metadata

Field	Value
Publication number	US-10670221-B2
Application number	US-201514868922-A
Country	US
Kind code	B2
Filing date	Sep 29, 2015
Priority date	Sep 30, 2014
Publication date	Jun 2, 2020
Grant date	Jun 2, 2020

Abstract

A device including at least one semiconductor component connected to an electrical connection element, the electrical connection element is attached to a heat sink and connected to a group of electrical wires, the group being linked mechanically and electrically to the electrical connection element by a single connector, the group being linked to the heat sink by holding means.

First claim

What is claimed is:

1. A device including at least one semiconductor component connected to an electrical connection element, so that the at least one semiconductor component is in contact with a first surface of the electrical connection element, the first surface of the electrical connection element is in contact with a heat sink and connected to a group of electrical wires, the first surface of the electrical connection element radiating heat to the heat sink, the group being linked mechanically and electrically to the electrical connection element by a single connector in contact with a second surface of the electrical connection element opposite to the first surface,
wherein the group is linked to the heat sink by a holder, and
wherein the holder comprises at least a first lug projecting from a side surface of an orifice of the heat sink, the group of electrical wires being held between the first lug and an edge of the orifice.

2. The device according to claim 1 , wherein the at least one semiconductor component comprises at least one semi-conductive emitter chip.

3. The device according to claim 2 , wherein the electrical connection element is a printed circuit board.

4. The device according to claim 2 , wherein the heat sink is substantially L-shaped.

5. The device according to claim 2 , wherein the heat sink has openings.

6. The device according to claim 1 , wherein the heat sink is linked to a supporting element in a motor vehicle lamp or inside a vehicle rear-light supporting element.

7. The device according to claim 6 , wherein the electrical connection element is a printed circuit board.

8. The device according to claim 6 , wherein the heat sink has openings.

9. The device according to claim 1 , wherein the electrical connection element is a printed circuit board.

10. The device according to claim 1 , wherein the heat sink is substantially L-shaped.

11. The device according to claim 10 , wherein the holder is on one of the branches of the L-shape of the heat sink.

12. The device according to claim 1 , wherein the heat sink has openings.

13. A lighting device for a motor vehicle, wherein the lighting device for a motor vehicle includes the device according to claim 1 .

14. A device including at least one semiconductor component connected to an electrical connection element so that the at least one semiconductor component is in contact with a first surface of the electrical connection element, the first surface of electrical connection element is attached to a heat sink and connected to a group of electrical wires, said group being linked mechanically and electrically to said electrical connection element by a single connector in contact with a second surface of the electrical connection element opposite to the first surface, wherein said group is linked to said heat sink by a holder,
wherein said group is linked mechanically to said heat sink by said a holder comprising a first portion formed by a clamping ring through which said group passes and a second portion formed by a click-fit foot made of a thermally insulating material attaching said clamping ring to said heat sink,
wherein the click-fit foot is inserted in an orifice of the heat sink, and
wherein the click-fit foot is thermally decoupled from the heat sink.

15. The device according to claim 14 , wherein the click-fit foot includes a click-fit branch comprising two fins that bear against a front side of the heat sink.

16. The device according to claim 14 , wherein the click-fit foot includes a click-fit branch comprising two elbows protruding from the click-fit branch in mutually opposing directions forming a click-fit arrow, wherein the click-fit arrow is inserted in the orifice of the heat sink.

17. The device according to claim 14 , wherein
the click fit foot includes a click-fit branch comprising
two fins that bear against a front side of the heat sink around the orifice, and
two elbows protruding from the click-fit branch in mutually opposing directions forming a click-fit arrow,

wherein the click-fit arrow is inserted in the orifice of the heat sink, and
wherein the two elbows bear against a back side of the heat sink around the orifice.

18. A method for assembling a semiconductor component on a heat sink, the semiconductor component being connected to an electrical connection element, so that the semiconductor component is in contact with a first surface of the electrical connection element, wherein the method comprises:
a first step in which a group of electrical wires is attached and connected to the electrical connection element using a single connector in contact with a second surface of the electrical connection element opposite to the first surface, a second step in which the group is attached to the heat sink using a holder, and a third step in which the electrical connection element is attached to the heat sink;
wherein the holder comprises at least a first lug projecting from a side surface of an orifice of the heat sink, the group of electrical wires being held between the first lug and an edge of the orifice, and
the first surface of the electrical connection element is in contact with the heat sink and connected to the group of electrical wires, the first surface of the electrical connection element radiating heat to the heat sink.

Assignees

• Valeo Vision

Inventors

• Mornet Eric
• Ducloux Bruno
• Yacoubi Nadia
• Letoumelin Remi
• Puente Jean-Claude
• Matte Franck
• Jacquemin Didier

Classifications

• F21S45/00

  Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light · CPC title

• F21S45/47 Primary

  Passive cooling, e.g. using fins, thermal conductive elements or openings · CPC title

• H05K7/20409

  Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing · CPC title

• H05K1/181

  associated with surface mounted components · CPC title

• B60Q1/0088

  Details of electrical connections (B60Q1/305 takes precedence; electrical connection of the light source itself F21S41/192, F21S43/195) · CPC title