Polyamide compositions with high melt flow and good mechanical properties

US10669394B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10669394-B2
Application numberUS-201615736803-A
CountryUS
Kind codeB2
Filing dateMay 31, 2016
Priority dateJun 19, 2015
Publication dateJun 2, 2020
Grant dateJun 2, 2020

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  1. Title

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  2. Abstract

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A polyamide composition with improved melt flow containing (A) 20 to 99.9 wt % of one or more polyamides independently selected from the group consisting of aliphatic polyamide, semi-aromatic polyamide, aromatic polyamide and their blends, (B) 0.1 to 10 wt % of one or more polyether polyols having a melting temperature below room temperature, (C) 0 to 70 wt % of one or more reinforcing agents, and (D) 0 to 50 wt % of one or more other additives, each based on the whole composition. A molding article produced from the polyamide composition also is disclosed.

First claim

Opening claim text (preview).

The invention claimed is: 1. Polyamide composition comprising the following components, (A) 40 to 65 wt % of one or more polyamides independently selected from the group consisting of aliphatic polyamide, semi-aromatic polyamide, aromatic polyamide and their blends, based on the whole composition; (B) 1 to 7 wt % of one or more polyether polyols having a melting temperature below room temperature, based on the whole composition; (C) 30 to 55 wt % of one or more reinforcing agents, based on the whole composition; and (D) 0.5 to 30 wt % of one or more other additives, based on the whole composition, wherein the one or more polyether polyols are (poly)ethylene oxide and/or (poly)propylene oxide reacted with one or more of glycerol, diglycerol, triglycerol, pentaerythritol, dipentaerythritol, tripentaerythritol, ethane diamine, diethane diamine, toluene diamine, sorbitol, triaminopropane and triaminobenzene, and wherein the polyether polyols have a weight average molecular weight of 200 to 3000 g/mol. 2. The polyamide composition according to claim 1 , wherein the polyamides are selected from the group consisting of PA6, PA66, PA6/66, PA46, PA6T/6, PAMXD6, PA9T, PA10T, PA6I/6T, and their blends. 3. The polyamide composition according to claim 1 , wherein the reinforcing agents are selected from the group consisting of carbon fibers, glass fibers, glass beads, amorphous silica, calcium silicate, calcium metasilicate, magnesium carbonate, kaolin, chalk, powdered quartz, mica, barium sulfate, feldspar, and mixtures thereof. 4. The polyamide composition according to claim 1 , wherein the other additives D) are independently selected from the group consisting of stabilizers, anti-oxidants, lubricant, flame retardants, chain-extenders, colorants, necleating agents, plasticizers, impact modifiers, polymer blend components, and mixtures thereof. 5. A molding article produced from the polyamide composition according to claim 1 . 6. A method of increasing a melt flow rate (ISO 1133) of a polyamide composition comprising including a polyether polyol which is (poly)ethylene oxide and/or (poly)propylene oxide reacted with one or more of glycerol, diglycerol, triglycerol, pentaerythritol, dipentaerythritol, tripentaerythritol, ethane diamine, diethane diamine, toluene diamine, sorbitol, triaminopropane, and triaminobenzene in the polyamide composition, wherein the polyether polyol has a weight average molecular weight of 200 to 3,000 g/mol. 7. A method of increasing the surface gloss 60° (ISO 2813)of a molding article produced from a polyamide composition comprising including a polyether polyol in the polyamide composition, wherein the polyether polyol is (poly)ethylene oxide and/or (poly)propylene oxide reacted with one or more of glycerol, diglycerol, triglycerol, pentaerythritol, dipentaerythritol, tripentaerythritol, ethane diamine, diethane diamine, toluene diamine, sorbitol, triaminopropane, and triaminobenzene, and the polyether polyol has a weight average molecular weight to 200 to 3,000 g/mol.

Assignees

Inventors

Classifications

  • Carboxylic acid amides · CPC title

  • C08L77/06Primary

    Polyamides derived from polyamines and polycarboxylic acids (C08L77/10 takes precedence) · CPC title

  • C08L77/02Primary

    Polyamides derived from omega-amino carboxylic acids or from lactams thereof (C08L77/10 takes precedence) · CPC title

  • Polyalkylene oxides · CPC title

  • containing two or more polymers of the same C08L -group · CPC title

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What does patent US10669394B2 cover?
A polyamide composition with improved melt flow containing (A) 20 to 99.9 wt % of one or more polyamides independently selected from the group consisting of aliphatic polyamide, semi-aromatic polyamide, aromatic polyamide and their blends, (B) 0.1 to 10 wt % of one or more polyether polyols having a melting temperature below room temperature, (C) 0 to 70 wt % of one or more reinforcing agents, …
Who is the assignee on this patent?
Basf Se
What technology area does this patent fall under?
Primary CPC classification C08L77/06. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Jun 02 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).