Cured film-forming composition

Patent metadata

Field	Value
Publication number	US-10669376-B2
Application number	US-201716088442-A
Country	US
Kind code	B2
Filing date	Mar 30, 2017
Priority date	Mar 31, 2016
Publication date	Jun 2, 2020
Grant date	Jun 2, 2020

Abstract

Provided are: a cured film-forming composition whereby a underlayer film for image formation formed from the composition exhibits high liquid repellency (lyophobicity) and lyophilic/liquid-repellent properties of the underlayer film can be easily changed even when exposed to a low amount of ultraviolet radiation; and a cured film obtained using the composition. The cured film-forming resin composition is characterized by containing: a polymer comprising a structural unit derived from a first monomer having the structure of formula (1) as component (A); a polymer other than component (A), which is a polymer in which the content of fluorine relative to the overall weight of the polymer is lower than in component (A), as component (B); a photoacid generator as component (C); and a solvent. (In the formula, R 1 denotes hydrogen or a methyl group, and R 2 denotes a fluorine-containing group able to be detached together with the oxygen atom bonded to R 2 .)

First claim

The invention claimed is:

1. A resin composition for forming a cured film, comprising:
as component (A), a polymer comprising a structural unit derived from a first monomer having a structure of formula (1)

wherein R 1 represents hydrogen or a methyl group, and R 2 represents a fluorine-containing group capable of being eliminated together with an oxygen atom to which the fluorine-containing group is bonded;
as component (B), a polymer other than component (A), which has a smaller fluorine content based on the weight of the polymer than that of component (A);
a photo-acid generator as component (C); and
a solvent.

2. The resin composition for forming a cured film according to claim 1 , wherein R 2 represents a fluorine-substituted hydrocarbon group, which is optionally branched and/or cyclized, and which is optionally interrupted by an aromatic ring, —O—, —S—, —CO—, —CS—, —NH—, or a combination thereof.

3. The resin composition for forming a cured film according to claim 1 , wherein R 2 has two or more carbon atoms.

4. The resin composition for forming a cured film according to claim 1 , wherein the polymer component (A) further comprises a structural unit derived from a second monomer having a group (group (x)) capable of forming due to heat a covalent bond between the polymers as component (A) or between the polymer component (A) and the polymer component (B).

5. The resin composition for forming a cured film according to claim 1 , wherein the polymer component (B) comprises a structural unit derived from a monomer having a group (group (x)) capable of forming due to heat a covalent bond between the polymers as component (B) or between the polymer component (A) and the polymer component (B).

6. The resin composition for forming a cured film according to claim 4 , wherein group (x) is at least one group selected from the group consisting of a hydroxyl group, a carboxyl group, an amide group, an alkoxysilyl group, an isocyanate group, a blocked isocyanate group, and a group represented by formula (2):

wherein R 3 represents an alkyl group, an alkoxy group, or a phenyl group.

7. The resin composition for forming a cured film according to claim 4 , which further comprises, as a component (D), a compound having two or more groups capable of undergoing a thermal reaction with group (x) per molecule.

8. The resin composition for forming a cured film according to claim 1 , wherein the polymer component (A) has a fluorine content of 5% by weight or more based on the weight of the polymer.

9. The resin composition for forming a cured film according to claim 1 , wherein the polymer component (B) has a fluorine content of less than 5% by weight based on the weight of the polymer.

10. A cured film, which is obtained using the resin composition for forming a cured film according to claim 1 , and wherein the cured film has an ultraviolet light exposed portion more lyophilic than an unexposed portion.

11. The cured film according to claim 10 , wherein the ultraviolet light exposed portion has a contact angle to propylene glycol monomethyl ether acetate at least 5° greater than that of the unexposed portion.

12. A wiring forming auxiliary layer comprising the cured film of claim 10 .

13. A method for the manufacture of a resin composition for forming a cured film comprising use of a copolymer comprising a structural unit derived from a first monomer and a structural unit derived from a second monomer having a group (group (x)) capable of forming due to heat a covalent bond between the polymers as component (A) or between the polymer component (A) and the polymer component (B), wherein the first monomer has a structure of formula (1)

wherein R 1 represents hydrogen or a methyl group, and R 2 represents a fluorine-containing group capable of being eliminated together with an oxygen atom to which the fluorine-containing group is bonded.

14. A method for the manufacture of a cured film having an ultraviolet light exposed portion more lyophilic than an unexposed portion comprising use of the resin composition for forming a cured film according to claim 1 .

15. The method according to claim 14 , wherein the ultraviolet light exposed portion has a contact angle to propylene glycol monomethyl ether acetate at least 5° greater than that of the unexposed portion.

16. The resin composition for forming a cured film according to claim 5 , wherein group (x) is at least one group selected from the group consisting of a hydroxyl group, a carboxyl group, an amide group, an alkoxysilyl group, an isocyanate group, a blocked isocyanate group, and a group represented by formula (2):

wherein R 3 represents an alkyl group, an alkoxy group, or a phenyl group.

17. The resin composition for forming a cured film according to claim 5 , which further comprises, as a component (D), a compound having two or more groups capable of undergoing a thermal reaction with group (x) per molecule.

18. A wiring forming auxiliary layer comprising the cured film of claim 11 .

Assignees

• Nissan Chemical Corp

Inventors

• Yukawa Shojiro
• Hoshino Yuki
• Takeda Kayo

Classifications

• C08F220/282

  and containing two or more oxygen atoms · CPC title

• C08L2203/202

  use in electrical wires or wirecoating · CPC title

• C08L101/00

  Compositions of unspecified macromolecular compounds · CPC title

• C08F220/20

  of polyhydric alcohols or phenols {, e.g. 2-hydroxyethyl (meth)acrylate or glycerol mono-(meth)acrylate} · CPC title

• C08L33/26

  Homopolymers or copolymers of acrylamide or methacrylamide · CPC title