Ceramic device and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-10669209-B2
Application number	US-201715842902-A
Country	US
Kind code	B2
Filing date	Dec 15, 2017
Priority date	Dec 7, 2017
Publication date	Jun 2, 2020
Grant date	Jun 2, 2020

Abstract

A ceramic device including a ceramic material, a patterned metal structure, and a surface activation material is provided. A surface of the ceramic material at least includes a first surface and a second surface that are not coplanar. The ceramic material has recesses on the surface thereof. The patterned metal structure is disposed on the first surface and the second surface. The surface activation material is disposed on a surface of the recesses and located at an interface between the ceramic material and the patterned metal structure.

First claim

What is claimed is:

1. A ceramic device, comprising:
a ceramic material, wherein a surface of the ceramic material at least comprises a first surface and a second surface that are not coplanar, and the ceramic material has recesses on the surface thereof;
a patterned metal structure disposed on the first surface and the second surface; and
a surface activation material disposed on a surface of the recesses and located at an interface between the ceramic material and the patterned metal structure, wherein
based on a total of the ceramic material and the surface activation material, a content of the surface activation material is 5 wt % or less at an interface between the ceramic material and the patterned metal structure.

2. The ceramic device of claim 1 , wherein the ceramic material comprises calcium titanate (CaTiO 3 ), magnesium titanate (MgTiO 3 ), zinc titanate (ZnTiO 3 ), or a combination thereof.

3. The ceramic device of claim 1 , wherein the first surface and the second surface are adjacent to each other.

4. The ceramic device of claim 1 , wherein a surface roughness resulting from the recesses on the ceramic material is less than 5 microns.

5. The ceramic device of claim 1 , wherein the ceramic material has at least one through-hole, and a portion of the patterned metal structure is disposed on a surface of the at least one through-hole.

6. The ceramic device of claim 5 , wherein an aspect ratio of the at least one through-hole is 12 or less.

7. The ceramic device of claim 1 , wherein the patterned metal structure comprises a first patterned metal layer.

8. The ceramic device of claim 7 , wherein a material of the first patterned metal layer comprises copper, nickel, silver, or gold.

9. The ceramic device of claim 7 , wherein the patterned metal structure further comprises a second patterned metal layer, and the second patterned metal layer is disposed on the first patterned metal layer.

10. The ceramic device of claim 9 , wherein a thickness of the first patterned metal layer is greater than a thickness of the second patterned metal layer.

11. The ceramic device of claim 9 , wherein a material of the second patterned metal layer comprises an electroplated metal or an electroless plated metal.

12. The ceramic device of claim 11 , wherein the electroplated metal comprises copper, nickel, silver, gold, platinum, tin, or alloy thereof, or the electroless plated metal comprises copper, nickel, silver, gold, platinum, or palladium.

13. The ceramic device of claim 9 , wherein the patterned metal structure further comprises a third patterned metal layer, and the third patterned metal layer is disposed on the second patterned metal layer.

14. The ceramic device of claim 13 , wherein a material of the third patterned metal layer comprises an electroplated metal or an electroless plated metal.

15. The ceramic device of claim 14 , wherein the electroplated metal or the electroless plated metal comprises gold, nickel, silver, tin, platinum, or alloy thereof.

16. The ceramic device of claim 1 , wherein the surface activation material comprises palladium, gold, platinum, silver, or a compound thereof.

17. The ceramic device of claim 1 , wherein the ceramic device comprises a filter or an antenna for a Global Positioning System.

18. The ceramic device of claim 1 , wherein the first surface and the second surface are not adjacent to each other.

Assignees

• Ind Tech Res Inst

Inventors

• Huang Meng-Chi
• Kao Tune-Hune
• Lin Guan-Ting

Classifications

• C04B41/4541

  Electroless plating · CPC title

• C04B35/04

  based on magnesium oxide · CPC title

• C04B35/00

  Shaped ceramic products characterised by their composition {(porous ceramic products C04B38/00; ceramic articles characterised by particular shape, see the relevant classes, e.g. linings for casting ladles, tundishes, cups or the like B22D41/02; ceramic substrates for microelectronic semi-conductors H10W70/692)}; Ceramics compositions ({shaping of ceramics B28B;} containing free metal bonded to carbides, diamond, oxides, borides, nitrides, silicides, e.g. cermets, or other metal compounds, e.g. oxynitrides or sulfides other than as macroscopic reinforcing agents C22C); Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products {(infiltration of sintered ceramic preforms with molten metal C04B41/51; chemical preparation of powders of inorganic compounds C01)} · CPC title

• C04B41/4564

  Electrolytic or electrophoretic processes, e.g. electrochemical re-alkalisation of reinforced concrete (desalination C04B41/53) · CPC title

• C04B41/53

  involving the removal of at least part of the materials of the treated article, {e.g. etching, drying of hardened concrete (C04B41/0036 - C04B41/0054 take precedence)} · CPC title